公开(公告)号：US5093761A

公开(公告)日：1992-03-03

申请号：US495158

申请日：1990-03-19

Applicant: Risuke Ozaki

Inventor： Risuke Ozaki

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/09109 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2201/2009 ,  H05K2203/1438 ,  H05K3/0061 ,  H05K3/429 ,  Y10S428/901

Abstract: A circuit board device includes a flexible circuit board, a rigid circuit board bonded to at least a part of the flexible circuit board, and a metal plate bonded to at least one of the rigid circuit board and a portion of the flexible circuit board which is itself bonded to the rigid circuit board. Heat generated from components mounted on the rigid circuit board is dissipated through the metal plate to a frame, for example.

Abstract translation: 电路板装置包括柔性电路板，与柔性电路板的至少一部分结合的刚性电路板，以及与刚性电路板和挠性电路板的至少一个接合的金属板， 本身粘接到刚性电路板上。 例如，通过金属板将安装在刚性电路板上的部件产生的热量散发到框架。

公开(公告)号：US4413308A

公开(公告)日：1983-11-01

申请号：US297862

申请日：1981-08-31

Applicant: Vernon L. Brown

Inventor： Vernon L. Brown

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/189 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/118 ,  H05K1/182 ,  H05K2201/09109 ,  H05K2201/10727 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/3442

Abstract: A mounting arrangement for an integrated circuit leadless chip carrier (13) for providing compliance to prevent solder joint failures due to stress and differential thermal expansion. A supporting substrate board (10, 20, 30) has bonded to one surface a flexible sheet (11) carrying printed wiring (12) to which the carrier (13) is electrically connected by means of solder pedestals (19). At each of the latter connections the board (10, 20, 30) presents recesses (15, 22, 31a, 33a) over which the sheet (11) is freely suspended to provide free sheet portions (18) which absorb the stress and differential expansion to protect the solder connections.

Abstract translation: 用于集成电路无引线芯片载体（13）的安装装置，用于提供顺应性以防止由于应力和差分热膨胀引起的焊点故障。 支撑基板（10,20,30）在一个表面上粘合承载印刷布线（12）的柔性片（11），载体（13）借助于焊盘（19）电连接到该柔性片。 在每个后续连接处，板（10,20,30）呈现凹部（15,22,3a，33a），片材（11）可以自由地悬挂在该凹槽上，以提供吸收应力和差动的自由片材部分（18） 扩展以保护焊接连接。

公开(公告)号：US3004229A

公开(公告)日：1961-10-10

申请号：US79514659

申请日：1959-02-24

Applicant: SANDERS ASSOCIATES INC

Inventor： STEARNS THOMAS H

IPC: H01B7/08 ,  H01P3/08 ,  H05K1/00 ,  H05K1/02

CPC classification number: H01P3/085 ,  H01B7/08 ,  H05K1/024 ,  H05K1/0283 ,  H05K1/0393 ,  H05K2201/0116 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09236

公开(公告)号：US11800654B2

公开(公告)日：2023-10-24

申请号：US17700748

申请日：2022-03-22

Applicant: Japan Aviation Electronics Industry, Limited

Inventor： Shinji Ueda ,  Seiya Takahashi ,  Hiroshi Akimoto

IPC: H05K5/00 ,  H05K1/02

CPC classification number: H05K5/0069 ,  H05K1/0298 ,  H05K2201/09109

Abstract: A device includes a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member basically includes a first film formed with an opening and includes a frame film. At least one of the first circuit member and the second circuit member includes an exposed portion and a seal portion which surrounds the exposed portion. The frame film has a film-seal portion and a circuit-seal portion. The film-seal portion is bonded to the first film to surround the opening. The circuit-seal portion is bonded to the seal portion to surround the exposes portion. The device is formed with a closed space which is enclosed by the first sealing member and the second sealing member. The exposed portion is exposed to the outer space located outside the device.

公开(公告)号：US09769920B2

公开(公告)日：2017-09-19

申请号：US14226593

申请日：2014-03-26

Applicant: Apple Inc.

Inventor： Colin M. Ely ,  Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf ,  Stephen Brian Lynch

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/28 ,  H05K3/00

CPC classification number: H05K1/0281 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0305 ,  H05K2201/055 ,  H05K2201/057 ,  H05K2201/09109 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10128 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1194 ,  H05K2203/1327 ,  H05K2203/1366

Abstract: An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

公开(公告)号：US09131633B2

公开(公告)日：2015-09-08

申请号：US12511426

申请日：2009-07-29

Applicant: Kentaro Miura ,  Hajime Yamaguchi ,  Masao Tanaka ,  Takashi Miyazaki

Inventor： Kentaro Miura ,  Hajime Yamaguchi ,  Masao Tanaka ,  Takashi Miyazaki

IPC: G02F1/1345 ,  H05K3/36 ,  G02F1/1333

CPC classification number: H05K3/361 ,  G02F1/133305 ,  G02F1/1345 ,  G02F1/13452 ,  G02F1/13454 ,  H05K2201/09109 ,  H05K2203/1572

Abstract: A display device includes: a flexible first substrate; a flexible second substrate provided facing the first substrate; a display part; and a wiring substrate. The display part has a display component which is disposed between the first substrate and the second substrate. The display component produces at least one of an optical characteristic change and a light emission. The wiring substrate is connected to a connection pad provided on at least one of the first substrate and the second substrate. At least a portion of the wiring substrate is interposed between the first substrate and the second substrate outside the display part.

Abstract translation: 显示装置包括：柔性第一基板; 设置为面向所述第一基板的柔性第二基板; 显示部分; 和布线基板。 显示部具有设置在第一基板和第二基板之间的显示部件。 显示部件产生光学特性变化和光发射中的至少一个。 布线基板连接到设置在第一基板和第二基板中的至少一个上的连接焊盘。 布线基板的至少一部分介于显示部分外的第一基板和第二基板之间。

公开(公告)号：US08895864B2

公开(公告)日：2014-11-25

申请号：US13435372

申请日：2012-03-30

Applicant: Darryl Cotton ,  Samiul Md Haque ,  Piers Andrew

Inventor： Darryl Cotton ,  Samiul Md Haque ,  Piers Andrew

IPC: H05K3/20 ,  H05K1/00

CPC classification number: H05K3/0064 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09045 ,  H05K2201/09109 ,  H05K2201/09263 ,  H05K2201/2036

Abstract: An apparatus and method wherein the apparatus includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.

Abstract translation: 一种装置和方法，其中所述装置包括可变形基板; 导电部分; 以及至少一个支撑件，其构造成将所述导电部分耦合到所述可变形基板，使得所述导电部分与所述可变形基板间隔开。

公开(公告)号：US08839513B2

公开(公告)日：2014-09-23

申请号：US13963463

申请日：2013-08-09

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hidehiro Nakamura

IPC: H05K13/00

CPC classification number: H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

Abstract: A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Abstract translation: 一种制造凹形连接器基板的方法包括：准备具有将板状连接器引导到连接位置和切割部分的引导/保持区域的引导基板的步骤; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。

公开(公告)号：US08491739B2

公开(公告)日：2013-07-23

申请号：US12878297

申请日：2010-09-09

Applicant: Philip R. Germann ,  Mark J. Jeanson

Inventor： Philip R. Germann ,  Mark J. Jeanson

IPC: B32B37/00

CPC classification number: B23K31/00 ,  B23K20/04 ,  B23K2103/16 ,  B32B37/0076 ,  B32B43/00 ,  B32B2457/08 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4691 ,  H05K2201/058 ,  H05K2201/09109

Abstract: A method and apparatus are provided for implementing interleaved-dielectric joining of multi-layer laminates. First and second multi-layer laminates are provided, each having with a laminated portion and an unlaminated portion. The first and second multi-layer laminates are joined together at the unlaminated portions by interleaving a plurality of dielectric layers of the first and second multi-layer laminates. Respective conductors carried by adjacent dielectric layers are connected. The interleaved unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates.

Abstract translation: 提供了一种用于实现多层层压体的交错电介质接合的方法和装置。 提供第一和第二多层层叠体，每层具有层压部分和未层压部分。 第一和第二多层层叠体通过交织第一和第二多层层压体的多个介电层而在未层压部分连接在一起。 连接由相邻电介质层承载的各导线。 交织的未层压部分通过热和压力层压在一起，以形成接合的第一和第二多层层压体的较大层压体。

公开(公告)号：US08279612B2

公开(公告)日：2012-10-02

申请号：US12719331

申请日：2010-03-08

Applicant: Naotaka Murakami ,  Keiichi Tominaga ,  Masato Matsubara

Inventor： Naotaka Murakami ,  Keiichi Tominaga ,  Masato Matsubara

IPC: H05K1/00

CPC classification number: H05K1/147 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09109 ,  H05K2201/09172 ,  H05K2203/0195

Abstract: An electronic circuit device including a circuit board having electronic parts, and a flexible wiring board for connection between the circuit board and external equipment. The circuit board has circuit-side connection terminals juxtaposed on a mount surface having the electrical parts mounted thereon or a non-mount surface. The wiring board has terminals juxtaposed on one of the surfaces thereof so that the wiring-board-side connection terminals confront the circuit-side circuit board connection terminals, and free-end portions each formed so as to include at least one of the wiring-board-side connection terminals, and the wiring board free-end portions are not adhesively attached to the circuit board, and the circuit-side connection terminals are electrically connected to the corresponding wiring-board-side connection terminals while the circuit-side connection terminals confront the wiring-board-side connection terminals.

Abstract translation: 一种电子电路装置，包括具有电子部件的电路板和用于在电路板和外部设备之间连接的柔性布线板。 电路板具有并置在其上安装有电气部件的安装表面上的电路侧连接端子或非安装表面。 布线板的一个表面上并列设有端子，使得布线板侧连接端子与电路侧电路板连接端子相对，并且各自形成为包括布线板侧连接端子中的至少一个的自由端部， 板侧连接端子和布线板自由端部不粘合到电路板上，并且电路侧连接端子电连接到相应的布线板侧连接端子，而电路侧连接端子 面对接线板侧的连接端子。