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    Method of manufacturing circuit module
    104.
    发明授权
    Method of manufacturing circuit module 失效
    制造电路模块的方法

    公开(公告)号：US5581875A

    公开(公告)日：1996-12-10

    申请号：US389485

    申请日：1995-02-16

    Applicant: Eiichi Hibino ,  Yoji Maeda ,  Sadao Kotera ,  Kazunori Kinoshita

    Inventor： Eiichi Hibino ,  Yoji Maeda ,  Sadao Kotera ,  Kazunori Kinoshita

    IPC: B23P21/00 ,  H05K3/34 ,  H05K9/00 ,  H05K13/04 ,  H05K7/14

    CPC classification number: H05K3/3415 ,  H05K3/3405 ,  H05K9/0039 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/1572 ,  H05K3/3447 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49153

    Abstract: An electronic component is mounted on one major surface of a dual side wiring substrate. A terminal is press-fitted into a mounting hole in the dual side wiring substrate from the one major surface side to be temporarily fixed in the substrate, and an electronic component is mounted on the other major surface of the dual side wiring substrate after soldering paste is applied. A frame having a plurality of bent pieces extending inwardly is mounted onto the dual face wiring substrate from a position above the substrate so that the bent pieces abut against the pattern of the dual side wiring substrate. The terminal press-fitted from the one major surface side, the electronic component mounted on the other major surface, and the frame are soldered simultaneously by a reflow method.

    Abstract translation: 电子部件安装在双面布线基板的一个主表面上。 将端子从一个主表面侧压配合到双面布线基板的安装孔中，以临时固定在基板中，并且在焊膏之后将电子部件安装在双面布线基板的另一个主表面上 被申请;被应用。 具有向内延伸的多个弯曲片的框架从基板上方的位置安装到双面布线基板上，使得弯曲的片抵靠双面布线基板的图案。 从一个主表面压入的端子，安装在另一个主表面上的电子部件和框架通过回流方式同时焊接。

    Electrical componet mounting system
    105.
    发明授权
    Electrical componet mounting system 失效
    电子元件安装系统

    公开(公告)号：US5548488A

    公开(公告)日：1996-08-20

    申请号：US415699

    申请日：1995-04-03

    Applicant: Scott A. Hansen

    Inventor： Scott A. Hansen

    IPC: H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K7/12 ,  H05K5/02

    CPC classification number: H05K3/326 ,  H05K7/12 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10878 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/308

    Abstract: An electrical component mounting system includes a substantially rigid substrate supporting a flexible circuit having a contact terminal with at least one aperture to receive a connecting pin from an electrical component. The aperture has a diameter slightly smaller than the diameter of the component conductor pin, such that extending the pin through the aperture in the flexible circuit deforms the contact terminal into an aligned larger diameter aperture in the substrate to provide a secure electrical connection between the pin and the terminal of the flexible circuit. In one embodiment of the invention, the conductive pin includes a locking groove for lockably engaging the rigid substrate.

    Abstract translation: 电气部件安装系统包括支撑柔性电路的基本上刚性的基板，所述柔性电路具有至少一个孔的接触端子，以从电气部件接收连接销。 该孔具有稍小于部件导体销的直径的直径，使得通过柔性电路中的孔延伸销将接触端子变形成衬底中对齐的较大直径的孔，以在引脚之间提供牢固的电连接 和柔性电路的端子。 在本发明的一个实施例中，导电销包括用于可锁定地接合刚性基板的锁定槽。

    Packages for stacked integrated circuit chip cubes
    106.
    发明授权
    Packages for stacked integrated circuit chip cubes 失效
    堆叠集成电路芯片立方体的封装

    公开(公告)号：US5343366A

    公开(公告)日：1994-08-30

    申请号：US903838

    申请日：1992-06-24

    Applicant: Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

    Inventor： Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

    IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R23/68

    CPC classification number: H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092

    Abstract: This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate surface or the pin-like structures can be adapted for insertion into apertures in a second substrate. The second substrate provides a means for electrically inter-connecting a plurality of these cuboids. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cuboid structures.

    Abstract translation: 本发明涉及将集成电路芯片三维封装成堆栈以形成立方体结构。 在堆叠中的相邻芯片之间，设置有电互连装置，其是具有多个导体的第一基板，其多个导体电连接到芯片接触位置，并且其另一端延伸到芯片堆叠的一侧， 形成多个针状电互连组件。 销状结构可以由在其至少一侧上具有电导体的第一基板的凸起从该侧延伸形成。 或者，销状结构可以由从第一基板的边缘的两侧悬臂的导体形成，并且其中来自两侧的相应导体对准并且间隔开第一基板厚度。 这些空间包含焊料并形成焊料加载的针状结构。 销状结构可以直接焊接到第二衬底表面上的导体上，或者针状结构可以适于插入到第二衬底中的孔中。 第二基板提供用于电连接多个这些长方体的装置。 优选地，第一和第二基底是电路化柔性聚合物膜。 第二基板设置在诸如PC板的第三基板上，其间具有弹性材料，其允许将散热器压紧成与长方体结构的相对侧紧密接触。

    Auto electrical connecting circuit board assembly
    108.
    发明授权
    Auto electrical connecting circuit board assembly 失效
    汽车电气连接电路板总成

    公开(公告)号：US5169471A

    公开(公告)日：1992-12-08

    申请号：US737224

    申请日：1991-07-29

    Applicant: Gene W. Strasser

    Inventor： Gene W. Strasser

    IPC: B29C35/08 ,  B29C70/62 ,  B29C70/88 ,  H05K1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/32

    CPC classification number: H05K3/32 ,  B29C35/08 ,  B29C70/62 ,  B29C70/882 ,  H05K1/0293 ,  H05K1/0373 ,  B29C2035/0822 ,  B29K2995/0005 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1105 ,  H05K2203/173 ,  H05K3/281 ,  Y10S428/90 ,  Y10S428/901 ,  Y10T156/1057 ,  Y10T428/24331 ,  Y10T428/24909

    Abstract: A circuit board for automatically interconnecting electrical components mounted on the circuit board, comprising of a nonconducting emulsion layer sandwiched between two nonconducting outer layers. Electrical leads from electronic components are inserted through holes in one outer layer. Dispersed within the emulsion layer are conducting particles with an elongated length. The emulsion layer's melting temperature is lower than the outer layers allowing movement of the conducting particles when the temperature of the emulsion layer is above the melting temperature, and prevents movement when the temperature is below. Included with the circuit board is an electromagnetic and infrared (EIR) assembly positioned near the outer layer opposite the layer with the electronic components. The EIR assembly has an infrared source and two magnetic field generating devices. One produces a magnetic field parallel to the emulsion layer forcing the conducting particles to line up parallel to the emulsion layer. The elongated length is sufficient so each parallel positioned conducting particle comes into contact with any neighboring parallel positioned particle, thus forming a conducting path. The other produces a magnetic field perpendicular to the emulsion layer forcing the conducting particles to line up perpendicular, electrically isolating the conducting particles from any neighboring particles. Moving the EIR assembly across the circuit board generating the parallel magnetic field forms a conducting path, or generating the perpendicular magnetic field erases any conducting paths. The infrared source is used to raise the temperature of the emulsion layer.

    Abstract translation: 一种用于自动地连接安装在电路板上的电气部件的电路板，包括夹在两个不导电外层之间的不导电乳剂层。 电子元件的电线穿过一个外层的孔。 分散在乳剂层内的是具有细长长度的导电颗粒。 当乳剂层的温度高于熔融温度时，乳剂层的熔融温度低于允许导电颗粒移动的外层，并且当温度低于时防止移动。 包括在电路板中的电磁和红外（EIR）组件位于与电子部件相对的外层附近。 EIR组件具有红外源和两个磁场产生装置。 产生平行于乳剂层的磁场，迫使导电颗粒平行于乳剂层排列。 细长的长度是足够的，因此每个平行定位的导电粒子与任何相邻的平行定位的粒子接触，从而形成导电路径。 另一个产生垂直于乳剂层的磁场，迫使导电颗粒垂直排列，将导电颗粒与任何相邻颗粒电隔离。 将EIR组件移动穿过生成并联磁场的电路板形成导电路径，或者产生垂直磁场，擦除任何导电路径。 红外源用于提高乳剂层的温度。

    Mounting of electronic components on substrates
    110.
    发明授权
    Mounting of electronic components on substrates 失效
    电子元器件在基片上的安装

    公开(公告)号：US5141455A

    公开(公告)日：1992-08-25

    申请号：US681826

    申请日：1991-04-08

    Applicant: Timothy R. Ponn

    Inventor： Timothy R. Ponn

    IPC: H01R13/719 ,  H05K1/18 ,  H05K3/32 ,  H05K9/00

    CPC classification number: H05K1/189 ,  H01R13/719 ,  H05K3/326 ,  H05K1/182 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49153

    Abstract: A method for mounting electronic components, such as capacitors and the like, to a flat flexible insulating substrate having conductive material thereon. In one form of the invention, an electronic component is attached to a given area of the substrate with one conductive side of the electronic component in electrical connection with the conductive material on the substrate. A slot is formed in the substrate substantially about the electronic component but less than 360.degree. thereabout to define a tongue, including the electronic component, and an integral hinge portion of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360.degree. slot is formed in the substrate. One conductive side of the electronic component is in electrical connection with the conductive material on the substrate within the closed slot, and the other conductive side of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal is electrically connected to the conductive material on the substrate inside the closed slot.

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