公开(公告)号：US09408327B2

公开(公告)日：2016-08-02

申请号：US14800374

申请日：2015-07-15

Applicant: TDK-LAMBDA CORPORATION

Inventor： L. Ray Albrecht, III ,  Gordon K. Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H01L23/473

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 提供了两个PCB之间的受控电隔离，以使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US20160141776A1

公开(公告)日：2016-05-19

申请号：US14540480

申请日：2014-11-13

Applicant: LEAR CORPORATION

Inventor： Bert William Eakins ,  George E. Fox

IPC: H01R12/58 ,  H01R43/20

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board. One or more electrical terminals with short and/or long solder tabs may be inserted into the second side of the circuit board and/or one or more electrical components may be attached to second side of circuit board.

Abstract translation: 组装电路板的方法可以包括将第一电端子插入电路板的第一侧，并且将第二层焊膏施加到电路板的第二侧，第二侧与第一侧相对设置。 第一电端子可以包括焊接片，焊接片的最大长度可以短于电路板的最小厚度，并且如果第一电端子插入到电路板中，则焊料片可以至少部分延伸 进入电路板，而不会完全延伸穿过电路板。 具有短和/或长焊料突片的一个或多个电端子可以插入电路板的第二侧和/或一个或多个电气部件可以附接到电路板的第二侧。

公开(公告)号：US08614689B2

公开(公告)日：2013-12-24

申请号：US11791721

申请日：2006-01-16

Applicant: Kazuhiro Nishikawa ,  Yoshihiro Kai ,  Kazuto Nakamura

Inventor： Kazuhiro Nishikawa ,  Yoshihiro Kai ,  Kazuto Nakamura

IPC: G06F3/045

CPC classification number: G06F3/045 ,  G06F2203/04103 ,  H01H2207/01 ,  H01H2207/014 ,  H01R4/04 ,  H01R12/62 ,  H05K3/321 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10871

Abstract: In a method for connecting lead wires to a touch panel, the method includes the steps of: providing through holes 9a to 9d the number of which corresponds to the number of electrode ends by perforation in a lower electrode plate 3; using a metal-pin 11 having a pin-shaft 11b and a disk shaped pin-head 11a with a diameter larger than an outer diameter of the pin-shaft; inserting the pin-shaft 11b into a metal-pin fixing hole formed corresponding to the through hole 9a at a circuit 10c in a connector tail of a lead wire 10, whereby the pin-shaft 11b is erectly provided on the connector tail of the lead wire 10; and inserting the pin-shafts 11b to 14b into the through holes 9a to 9d, and in addition, electrically connecting the pin-shaft inserted into a lower electrode plate 3 through a conductive adhesive 15 to electrode ends 6c, 7c, 6d, 7d.

Abstract translation: 在将引线连接到触摸面板的方法中，该方法包括以下步骤：在下电极板3中通过穿孔提供数量对应于电极端数的通孔9a至9d; 使用具有销轴11b的金属销11和直径大于销轴的外径的盘形销头11a; 在引线10的连接器尾部的电路10c处将针轴11b插入与通孔9a形成的金属针固定孔中，由此将引脚轴11b竖立地设置在引线的连接器尾部 电线10; 并将销轴11b至14b插入到通孔9a至9d中，此外，通过导电粘合剂15将插入下电极板3的销轴电连接到电极端6c，7c，6d，7d。

公开(公告)号：US20130330966A1

公开(公告)日：2013-12-12

申请号：US14000851

申请日：2011-02-25

Applicant: Igor Perez-Uria ,  Ola Arvidsson

Inventor： Igor Perez-Uria ,  Ola Arvidsson

IPC: H01R13/516

CPC classification number: H01R13/516 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10871

Abstract: A connection pin for mounting in a through-hole provided in a component carrier of an electronic assembly, the connection pin comprising an anchoring part adapted for insertion into said through-hole, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin is provided with an internal cavity, which is provided with an outer opening at a free end of the anchoring part. The contact part is provided with a protruding elongated interconnection member at a free end thereof, and the respective shapes of the interconnection member and the internal cavity are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. A method for producing an electronic assembly with stackable modules is also disclosed.

Abstract translation: 一种用于安装在设置在电子组件的部件托架中的通孔中的连接销，所述连接销包括适于插入所述通孔的锚固部分，适于延伸到所述通孔外部的接触部分，以及 凸缘部分适于抵靠所述部件载体并且位于所述锚定部分和所述接触部分之间。 连接销设置有内部空腔，其在锚定部分的自由端处设置有外部开口。 接触部分在其自由端处设置有突出的细长互连构件，并且互连构件和内部空腔的相应形状使得互连构件适于插入到另一相似连接销的相应内部空腔中。 还公开了一种用于制造具有可堆叠模块的电子组件的方法。

公开(公告)号：US08378231B2

公开(公告)日：2013-02-19

申请号：US12510028

申请日：2009-07-27

Applicant: Kiyotaka Tsukada ,  Toshihiro Nomura ,  Daisuke Minoura

Inventor： Kiyotaka Tsukada ,  Toshihiro Nomura ,  Daisuke Minoura

IPC: H05K1/11

CPC classification number: H05K1/145 ,  H01L24/01 ,  H01L24/25 ,  H01L2224/2518 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0204 ,  H05K3/284 ,  H05K3/306 ,  H05K2201/096 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10643 ,  H05K2201/10871 ,  H05K2201/10946 ,  Y10T29/4913 ,  Y10T29/49153 ,  H01L2924/00

Abstract: A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.

Abstract translation: 半导体器件包括各自具有绝缘板，导体电路和通孔的布线板，所述绝缘板具有顶表面和底表面，所述导体电路形成在顶表面和底表面上，所述通孔穿过绝缘板并电连接 顶表面和底表面的导体电路; 导体柱各自具有凸缘，头部和腿部，凸缘部分具有第一和第二表面，并且具有比通孔大的外径，头部从第一表面突出，腿部从第二表面突出 ; 以及各自具有形成在一个或多个表面上并连接到所述腿部的电极的电子部件。 插入头部直到凸缘部分的第一表面与布线板的底表面接触并且在通孔的内壁处电连接。

公开(公告)号：US08139361B2

公开(公告)日：2012-03-20

申请号：US12639092

申请日：2009-12-16

Applicant: David L. Hager ,  Paul A. Wormsbecher

Inventor： David L. Hager ,  Paul A. Wormsbecher

IPC: H05K7/20 ,  H05K1/16

CPC classification number: H05K7/12 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/10871 ,  H05K2203/1446 ,  Y10T29/4913

Abstract: Various embodiments of the present invention provide an anchor, circuit board assembly, and method for operably engaging an electronic component with a circuit board having a first side and a second side. Anchor embodiments include an anchor portion configured for receiving at least a portion of the electronic component and a pair of anchor legs flexibly extending from the ends of the anchor portion and configured for insertion into apertures defined in the circuit board. The anchor further includes a compression element slidably disposed about the anchor legs and movable between an unlocked position and a locked position. The compression element is configured for urging the anchor legs towards one another when moved from the unlocked position to the locked position such that the anchor is secured in the apertures when the compression element is in the locked position.

Abstract translation: 本发明的各种实施例提供了一种锚固器，电路板组件和用于将电子部件与具有第一侧和第二侧的电路板可操作地接合的方法。 锚固实施例包括构造成用于接收电子部件的至少一部分的锚定部分和从锚定部分的端部柔性地延伸并且被配置为插入到限定在电路板中的孔中的一对锚腿。 锚固件还包括可滑动地设置在锚腿周围并且可在解锁位置和锁定位置之间移动的压缩元件。 压缩元件构造成当从解锁位置移动到锁定位置时将锚腿朝向彼此推动，使得当压缩元件处于锁定位置时，锚固件固定在孔中。

公开(公告)号：US07901995B2

公开(公告)日：2011-03-08

申请号：US11689558

申请日：2007-03-22

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L21/60

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。 对于有铅器件，引线面向设备的热中心及其与之相互作用的系统。 对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。

公开(公告)号：US07847470B2

公开(公告)日：2010-12-07

申请号：US11904526

申请日：2007-09-26

Applicant: Tomotaka Kuroda

Inventor： Tomotaka Kuroda

IPC: H01L41/047 ,  H01L41/053

CPC classification number: H05K1/144 ,  H05K3/301 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10083 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10871

Abstract: To provide high reliable surface mounting oscillator that solder does not leak out by heat from the oscillator. The base print board with a terminal on the first surface and a concave on the second surface which is the opposite side of the first surface, the metal strut fixed to the concave, the sub print board has piezoelectric vibrator supported by the metal strut, the base print board, the cover which covers the metal strut and the sub print board.

Abstract translation: 提供高可靠的表面安装振荡器，焊料不会从振荡器的热量泄漏出来。 基板印刷电路板具有位于第一表面上的端子，第二表面上是与第一表面相对的凹面，金属支柱固定在凹面上，副印刷电路板具有由金属支柱支撑的压电振动器， 基板印刷板，覆盖金属支柱和副印刷板的盖板。

公开(公告)号：US07791425B2

公开(公告)日：2010-09-07

申请号：US11975753

申请日：2007-10-22

Applicant: Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

Inventor： Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

IPC: H03B1/00 ,  H03B5/32

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/09463 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178 ,  Y10T428/24612

Abstract: The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

Abstract translation: 本发明涉及一种二级安装板，其中第二基板由位于外基座表面上的具有安装电极的第一基板上的金属销水平支撑，金属销的自由下端插入 并且所述金属销通过焊料固定到设置在所述第一基板的表面上的环形电极焊盘，以形成所述孔的外周，其中所述环形电极的环的一部分 被切开打开一样。 这提供了两级安装板，其中金属引脚可以可靠地连接到第一基板以水平地支撑第二基板，以及使用其的晶体振荡器。

公开(公告)号：US20100099274A1

公开(公告)日：2010-04-22

申请号：US12495265

申请日：2009-06-30

Applicant: Sung-Yu Hsieh ,  Wen-Chin Wu

Inventor： Sung-Yu Hsieh ,  Wen-Chin Wu

IPC: H01R12/00 ,  H05K3/30

CPC classification number: H01R12/7005 ,  H01R12/7052 ,  H01R12/716 ,  H05K1/182 ,  H05K3/306 ,  H05K2201/09063 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2203/167 ,  Y10T29/49139

Abstract: A sinking type electrical connector is adapted for coupling to a circuit board. The sinking type electrical connector includes a body and at least one limiting unit. The body has a front end portion, a connecting portion provided in the front end portion, and a top surface. The limiting unit is provided at one side of the body and includes a plurality of limiting portions respectively located at different levels. A selected one of the limiting portions of the limiting unit which are at different levels is brought to engage the circuit board so that a distance from the top surface of the body to the circuit board is changeable.

Abstract translation: 沉没式电连接器适于耦合到电路板。 沉没式电连接器包括主体和至少一个限制单元。 主体具有前端部，设置在前端部的连接部和顶面。 限制单元设置在主体的一侧，并且包括分别位于不同级别的多个限制部分。 限制单元的不同级别的限定部分中的选定的一个使得电路板接合，使得从主体的顶表面到电路板的距离是可变的。