公开(公告)号：US06319012B1

公开(公告)日：2001-11-20

申请号：US09230019

申请日：1999-01-18

Applicant: Juergen Moessinger ,  Walter Grote

Inventor： Juergen Moessinger ,  Walter Grote

IPC: H01R4100

CPC classification number: H05K1/028 ,  H05K1/0271 ,  H05K1/0281 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/09109 ,  H05K2201/09281 ,  H05K2201/2009

Abstract: The invention relates to a flexible strip conductor connection, by means of which electrical connections between an electrical device (2) and an external component (1) can be made, wherein the strip conductors (8) are located in or on a flexible foil (3), which is clamped on the electrical device (2) as well as the external component (1). In a predetermined area in the course of the strip conductors (8), the flexible foil (3) has a loop (6), which can be filled with an elastic material perpendicularly in relation to the foil plane, or the strip conductors (8) in the plane of the foil respectively have a loop-shaped deviation (9) perpendicularly to the course of strip conductor.

Abstract translation: 本发明涉及一种柔性带状导体连接件，通过该柔性带状导体连接可以制造电气装置（2）和外部部件（1）之间的电连接，其中带状导体（8）位于柔性箔片 3），其被夹紧在电气设备（2）以及外部部件（1）上。 在带状导体（8）的过程中的预定区域中，柔性箔（3）具有环（6），其可以相对于箔平面垂直地填充有弹性材料或带状导体（8） ）分别具有垂直于带状导体的过程的环形偏差（9）。

公开(公告)号：US06188579B1

公开(公告)日：2001-02-13

申请号：US09351551

申请日：1999-07-12

Applicant: Charles Joseph Buondelmonte ,  Walter J. Picot

Inventor： Charles Joseph Buondelmonte ,  Walter J. Picot

IPC: H05K720

CPC classification number: H05K1/0271 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10969 ,  H05K2203/0415 ,  Y10T29/49128 ,  Y10T29/49169 ,  H01L2924/00

Abstract: A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the pallet and a second portion that is bonded to the bottom surface of the printed wiring board so that the insert is movable, relative to the pallet, in a plane parallel to the PWB. In one embodiment, the pallet includes an opening having a first portion and a second portion that is larger than the first portion, and the first and second portions of the insert fit at least partially in the respective first and second portions of the pallet opening. In another embodiment, the insert has a thickness that is equal to or greater than the thickness of the pallet.

Abstract translation: 印刷线路板组件包括联接到印刷线路板的底表面的托盘。 提供了具有可滑动地安装到托盘的第一部分和与印刷线路板的底表面接合的第二部分的插入件，使得插件相对于托盘在与PWB平行的平面中可移动 。 在一个实施例中，托盘包括具有第一部分和大于第一部分的第二部分的开口，并且插入件的第一和第二部分至少部分地配合在托盘开口的相应的第一和第二部分中。 在另一个实施例中，插入件的厚度等于或大于托盘的厚度。

公开(公告)号：US5984691A

公开(公告)日：1999-11-16

申请号：US39082

申请日：1998-03-10

Applicant: William Louis Brodsky ,  Glenn Lee Kehley ,  Glenn Edward Myrto ,  John Henry Sherman

Inventor： William Louis Brodsky ,  Glenn Lee Kehley ,  Glenn Edward Myrto ,  John Henry Sherman

IPC: H01R12/62 ,  H01R12/71 ,  H01R13/24 ,  H01R13/648 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H01L23/49811 ,  H01R12/62 ,  H01R12/714 ,  H01R13/648 ,  H05K1/118 ,  H05K3/326 ,  H01L2224/16225 ,  H05K1/036 ,  H05K2201/0133 ,  H05K2201/0373 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compression portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. Flexure is also enhanced by utilization of patterns of one or more apertures (64) in the flexible substrate relative to and substantially surrounding the positioned conductors (56). Electrical assemblies including a pair of circuitized substrates electrically interconnected by the defined interposers are also described.

Abstract translation: 一种柔性电路插入器（50）及其制造方法，其中插入器包括至少一个柔性电路化衬底（53），其具有导体（55）和电镀元件（56）的电介质（例如，聚酰亚胺）层（54） 例如铜垫，其中可能具有用于增强连接的枝晶（57），与导体对准的有孔支撑构件（58）和在其上具有有孔构件的支撑构件（60）。 当插入件接合时，柔性电路化基板（53）在孔（59）内被压下。 公开了各种替代方案，包括形成有延伸到支撑构件（58）中的相应孔（59）中的压缩部分（69）的支撑件（60“）和临时可压缩支撑件（60”） 。 通过利用柔性基板中的一个或多个孔（64）的图案相对于并且基本上围绕定位的导体（56）也增强了弯曲。 还描述了包括通过限定的插入体电互连的一对电路化基板的电气组件。

公开(公告)号：US5594214A

公开(公告)日：1997-01-14

申请号：US383415

申请日：1995-02-03

Applicant: Pin-Chien Liao

Inventor： Pin-Chien Liao

IPC: H01B7/08 ,  H01B11/00 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/281 ,  H05K1/0293 ,  H05K1/118 ,  H05K1/0295 ,  H05K2201/053 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09409 ,  H05K2201/0979 ,  H05K2201/09954 ,  H05K2201/09972 ,  H05K2201/10053 ,  H05K2201/2009 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/175 ,  H05K3/0058 ,  H05K3/386

Abstract: The signal transmission flat cable provided includes a first layer of substrate membrane, a second layer of a plurality of parallel traces for transmitting the signal, a third layer of finger array and a fourth layer of thin polyester membrane. The third layer of finger array covers the second layer. The fourth layer of thin polyester membrane is used to protect the second layer and third layer. The signal transmission flat cable is characterized in that the plurality of finger arrays are provided in the third layer at a plurality of predetermined locations along the flat cable and each of the plurality of finger arrays is spaced from each other by a given distance. A glue material is provided to bond the fourth layer and the second layer along the given distance. As a result, the flat cable has the module capability by which an user may cut away the excess portion of the flat cable depending on different requirement, such that the remaining portion of the flat cable may be inserted into the keyboard socket on the motherboard of a computer.

Abstract translation: 提供的信号传输扁平电缆包括第一层衬底膜，用于传输信号的多个平行迹线的第二层，第三层手指阵列和第四层薄聚酯膜。 手指阵列的第三层覆盖第二层。 第四层薄聚酯膜用于保护第二层和第三层。 信号传输扁平电缆的特征在于，多根指状阵列沿着扁平电缆在多个预定位置处设置在第三层中，并且多个指形阵列中的每一个彼此间隔开给定的距离。 提供粘合材料以沿着给定距离结合第四层和第二层。 结果，扁平电缆具有模块能力，用户可以根据不同的要求切割扁平电缆的多余部分，使得扁平电缆的剩余部分可以插入到主板上的键盘插槽中 一台电脑。

公开(公告)号：US5516989A

公开(公告)日：1996-05-14

申请号：US387283

申请日：1995-02-10

Applicant: Shigeo Uedo ,  Hitoshi Itou

Inventor： Shigeo Uedo ,  Hitoshi Itou

IPC: H05K1/02 ,  H05K1/00 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K2201/09109 ,  H05K3/4611 ,  H05K3/4635

Abstract: A structure of the flexing section of a multilayer flexible circuit board wherein at least one layer of a flexible insulation base material is bonded, via an adhesive agent layer, between a plurality of wiring conductors on which required wiring patterns are formed with conductive foil, the flexible insulation base material of the flexing section of the multilayer flexible circuit board being provided with a non-bonded portion so that it is not bonded with the wiring conductors or another flexible insulation base material at least on one surface.

Abstract translation: 一种多层柔性电路板的弯曲部分的结构，其中柔性绝缘基材的至少一层经由粘合剂层在形成有导电箔的所述布线图案的多个布线导体之间接合， 多层柔性电路板的挠曲部分的柔性绝缘基材具有非接合部分，使得其至少在一个表面上不与布线导体或另一柔性绝缘基材结合。

公开(公告)号：US5445869A

公开(公告)日：1995-08-29

申请号：US184106

申请日：1994-01-21

Applicant: Takayuki Ishikawa ,  Kouichi Santo

Inventor： Takayuki Ishikawa ,  Kouichi Santo

IPC: H05K1/02 ,  H05K1/00 ,  H05K7/14 ,  B32B9/00

CPC classification number: H05K1/028 ,  H05K2201/09109 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31786

Abstract: A composite flexible substrate (100) is constituted with an inside flexible substrate (1) and an outside flexible substrate (2) having a zigzag-shaped part (Z.sub.1), and the outside flexible substrate (2) is superposed on the inside flexible substrate (1) and is fixed at both end parts of the inside flexible substrate (1) and the outside flexible substrate (2). When the inside flexible substrate (1) is longitudinally bent, the outside flexible substrate (2) is deformed due to stretching of the zigzag-shaped part (Z.sub.1) without irregularly deforming the inside flexible substrate.

Abstract translation: 复合柔性基板（100）由内部柔性基板（1）和具有锯齿形部分（Z1）的外部柔性基板（2）构成，外部柔性基板（2）重叠在内部柔性基板 （1）并固定在内部柔性基板（1）和外部柔性基板（2）的两端部。 当内部柔性基板（1）纵向弯曲时，外部柔性基板（2）由于锯齿形部分（Z1）的拉伸而变形，而柔性基板的内部不会变形。

公开(公告)号：US5170326A

公开(公告)日：1992-12-08

申请号：US801139

申请日：1991-12-02

Applicant: Keith A. Meny ,  Patrick A. McGovern ,  David Cottingham ,  Frank E. Kazak

Inventor： Keith A. Meny ,  Patrick A. McGovern ,  David Cottingham ,  Frank E. Kazak

IPC: H05K1/00 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K5/0043 ,  H05K1/05 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K3/0061

Abstract: An electronic module assembly (50) has a bendable base plate (52) upon which circuit components (76) are mounted. A module enclosure device (56) mates with the base plate and has an integrally formed, non-removable support arm (96). During assembly, the base plate (52) is bent around the support arm (96) in a "C" shape. Thus formed, the base plate (52) and the module enclosure device (56) form an internal cavity that holds the circuit components (76).

Abstract translation: 电子模块组件（50）具有可弯曲的基板（52），电路部件（76）安装在该基板上。 模块外壳装置（56）与基板配合并且具有一体形成的不可拆卸的支撑臂（96）。 在组装期间，基板（52）以“C”形围绕支撑臂（96）弯曲。 如此形成，基板（52）和模块封闭装置（56）形成保持电路部件（76）的内部空腔。

公开(公告)号：US5159751A

公开(公告)日：1992-11-03

申请号：US835817

申请日：1992-02-18

Applicant: David J. Cottingham ,  Michael J. Petrites ,  Thomas J. Tischhauser

Inventor： David J. Cottingham ,  Michael J. Petrites ,  Thomas J. Tischhauser

IPC: H05K1/00 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K5/0043 ,  H05K1/05 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K3/0061 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: An electronic module assembly (31) is provided by assembling components (17) to a planar polyimide flex circuit film (14) laminated to an aluminum rigidizer plate (11). The flex circuit film and rigidizer are then bent by a sheet metal bending process such that the rigidizer plate forms an exterior protective housing and the components are provided in an interior space (30). Connector pins (23) provide external electrical access to the components and circuit patterns (15, 16, 19) on the film (14). Structures (24, 25, 29) mate with the bent plate and substantially enclose the interior space. Module cost is reduced since the existing flex circuit rigidizer plate is used to form part of the module housing, and economical planar component assembly techniques are utilized while eliminating the step of mounting the flex circuit rigidizer plate to an external module housing. Two techniques for using a mandrel shaft (26, 35) to bend the plate (11) without stressing the film (14) are disclosed.

Abstract translation: 通过将部件（17）组装到层压到铝刚性板（11）上的平面聚酰亚胺柔性电路膜（14）上来提供电子模块组件（31）。 柔性电路膜和刚性化器然后通过金属板弯曲工艺弯曲，使得刚性板形成外部保护壳体，并且部件设置在内部空间（30）中。 连接器引脚（23）提供对薄膜（14）上的组件和电路图案（15,16,19）的外部电接入。 结构（24,25,29）与弯曲板匹配并且基本上包围内部空间。 模块成本降低，因为现有的柔性电路刚性板用于形成模块壳体的一部分，并且利用经济的平面部件组装技术，同时消除将柔性电路刚性化板安装到外部模块壳体的步骤。 公开了使用心轴（26,35）在不压制薄膜（14）的情况下使板（11）弯曲的两种技术。

公开(公告)号：US4900878A

公开(公告)日：1990-02-13

申请号：US252826

申请日：1988-10-03

Applicant: Elie J. Ichkhan

Inventor： Elie J. Ichkhan

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09109 ,  H05K3/429

Abstract: Terminations (10, 40, 70, 90) for flexible printed circuitry comprises thermosetting epoxy or polyimide prepreg sheets (36, 56, 64, 88, 102) in the rigid portion, instead of thermoplastic acrylic adhesive, partial coverlays (20, 50, 84, 94) instead of full coverlays and, as desired, rigidized members of epoxy or polyimide glass (16, 52, 54, 86) or prepreg internally as well as externally of the terminations. Anchor pads 34 secured to plated-through holes (38) minimize z-axis expansion of the terminations.

Abstract translation: 用于柔性印刷电路的端接件（10,40,70,90）包括刚性部分中的热固性环氧树脂或聚酰亚胺预浸片（36,56,64,88,102），而不是热塑性丙烯酸类粘合剂，部分覆盖层（20,50， 84,94）代替全覆盖层，并且根据需要，环氧树脂或聚酰亚胺玻璃（16,52,54,86）的刚性化构件或内部以及端子外部的预浸料。 固定到电镀通孔（38）上的锚固垫34最大限度地使终端的z轴膨胀最小化。

公开(公告)号：US4815990A

公开(公告)日：1989-03-28

申请号：US37238

申请日：1987-04-10

Applicant: Raymond D. Ristedt ,  Michael C. Zinck

Inventor： Raymond D. Ristedt ,  Michael C. Zinck

IPC: H05K3/46 ,  H01R12/62 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R9/07

CPC classification number: H01R12/61 ,  H05K1/118 ,  H05K1/0393 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/09172 ,  H05K2201/0919 ,  H05K2201/09409 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/281 ,  H05K3/3447 ,  H05K3/363 ,  H05K3/4092 ,  H05K3/4611 ,  H05K3/4635 ,  Y10S439/93 ,  Y10T29/49155

Abstract: A flexible circuit having termination features incorporated as an integral part thereof and a method of making the same is presented. In accordance with the manufacturing process of the present invention, the end portion of a flexible circuit of standard construction (i.e., conductive traces sandwiched between a flexible base substrate and a flexible cover film) is folded back on itself, frequently with a spacer captured in the fold, and adhesively laminated together. This laminated assembly has a thickness equal to that required for formation of reliable connector pins. Next, a small section of this folded end portion has at least the outer non-conductive cover film removed, preferably by laser techniques, to expose a plurality of connector pins or fingers. The connector fingers will have the desired thickness, width and shape to allow for direct insertion into a mating component (i.e., through-holes on a rigid or flexible circuit board; or into a receptacle such as a female connector). The fingers are preferably solder coated to allow the flexible circuit of the present invention to be attached using common solder reflow techniques.

Abstract translation: 具有作为其组成部分并入的终端特征的柔性电路及其制造方法。 根据本发明的制造方法，标准结构的柔性电路的端部（即，夹在柔性基底基板和柔性覆盖膜之间的导电迹线）的端部自身折回，频繁地将间隔物捕获在 折叠，并粘合地层压在一起。 该层压组件的厚度等于形成可靠的连接器销所需的厚度。 接下来，该折叠端部的一小部分至少具有外绝缘覆盖膜，优选地通过激光技术去除以暴露多个连接器针或手指。 连接器指状物将具有所需的厚度，宽度和形状，以允许直接插入配合部件（即，刚性或柔性电路板上的通孔;或插入诸如母连接器的插座中）。 手指优选地被焊接涂覆以允许本发明的柔性电路使用普通的回流焊技术来附接。