公开(公告)号：US20170188454A1

公开(公告)日：2017-06-29

申请号：US15459740

申请日：2017-03-15

Applicant: Sridharan Venk ,  Earl Alfred Picard ,  Qi Dai ,  Richard Garner

Inventor： Sridharan Venk ,  Earl Alfred Picard ,  Qi Dai ,  Richard Garner

IPC: H05K1/02

CPC classification number: H05K1/111 ,  F21S4/22 ,  F21V21/005 ,  G06K19/07749 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1421 ,  H05K1/0209 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/051 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09872 ,  H05K2201/099 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1545 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.

公开(公告)号：US20160066410A1

公开(公告)日：2016-03-03

申请号：US14559837

申请日：2014-12-03

Applicant: Samsung Display Co. Ltd.

Inventor： Dong Beom CHO

IPC: H05K1/02 ,  H05K1/14 ,  H05K5/00

CPC classification number: H05K1/028 ,  H05K1/111 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/10136 ,  Y02P70/611

Abstract: A curved display device is provided. The curved display device includes: a curved display panel configured to have short sides and long sides; a printed circuit board (PCB) configured to provide signals for driving the curved display panel; and a flexible wiring board including a first portion, which is connected to a first area, a second portion, which is connected to the PCB, and a third portion, which is disposed between the first portion and the second portion and has curved sides, wherein a curvature radius of a first side of the curved sides differs from a curvature radius of a second side of the curved sides.

Abstract translation: 提供了一种弯曲的显示装置。 弯曲显示装置包括：弯曲显示面板，其配置为具有短边和长边; 配置为提供用于驱动所述弯曲显示面板的信号的印刷电路板（PCB）; 以及柔性布线板，包括连接到第一区域的第一部分，连接到PCB的第二部分和设置在第一部分和第二部分之间并具有弯曲侧面的第三部分， 其中所述弯曲侧的第一侧的曲率半径与所述弯曲侧的第二侧的曲率半径不同。

公开(公告)号：US09119314B2

公开(公告)日：2015-08-25

申请号：US13483522

申请日：2012-05-30

Applicant: Rohit Krishna Koppal ,  Martin Earl Holman, IV ,  Patrick Yves Mas ,  Douglas Wayne Moskowitz

Inventor： Rohit Krishna Koppal ,  Martin Earl Holman, IV ,  Patrick Yves Mas ,  Douglas Wayne Moskowitz

IPC: H05K1/00 ,  G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/36 ,  H05K7/14 ,  H01R12/79 ,  H04M1/02

CPC classification number: H05K1/147 ,  H01R12/79 ,  H04M1/0252 ,  H04M1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/148 ,  H05K1/189 ,  H05K3/36 ,  H05K3/365 ,  H05K7/1402 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1031 ,  H05K2201/2009 ,  Y02P70/611 ,  Y10T29/49124

Abstract: A flexible printed circuit connector structure and assembly method. A panel with a back side that is parallel to a first plane and a flexible printed circuit backer that has a base and a backing structure. The base is attached to the back side of the panel. The backing structure depends from the base and extends along a second plane that forms an angle with the first plane. A first flexible circuit side of the flexible printed circuit is attached to a first side and an opposite second side of the backing structure. The flexible printed circuit has exposed conductors on a second flexible circuit side that is opposite the first flexible circuit side.

Abstract translation: 柔性印刷电路连接器结构及组装方法。 具有平行于第一平面的背面的面板和具有底座和背衬结构的柔性印刷电路支架。 基座连接到面板的背面。 背衬结构从底部延伸并且沿着与第一平面成角度的第二平面延伸。 柔性印刷电路的第一柔性电路侧连接到背衬结构的第一侧和相对的第二侧。 柔性印刷电路在第二柔性电路侧具有与第一柔性电路侧相对的露出导体。

公开(公告)号：US09042108B2

公开(公告)日：2015-05-26

申请号：US13702216

申请日：2011-04-11

Applicant: Kazuhiro Nobori

Inventor： Kazuhiro Nobori

IPC: H05K1/00 ,  H05K7/00 ,  G02F1/1345 ,  H05K1/14 ,  H05K3/36 ,  H05K13/00 ,  H05K3/32

CPC classification number: H05K7/00 ,  G02F1/13452 ,  H01L2924/0002 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/045 ,  H05K2201/055 ,  H05K2201/09445 ,  Y10T29/49124 ,  H01L2924/00

Abstract: In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.

Abstract translation: 在显示装置（100）中，在端子部（112）的连接面上形成有一排突出电极（115）和一排突出电极（116），一排突出电极（116） 在一排突出电极（115）和显示部分（111）之间，柔性印刷电路板（150）的一端连接到一排突出电极（115），柔性印刷电路板（160）的一端 ）连接到所述突出电极（116）的行，所述突出电极（115）的行与所述突出电极（116）的行相邻，并且所述柔性印刷电路板（150）的一端和 柔性印刷电路板（160）的一端彼此相对。

公开(公告)号：US08801457B2

公开(公告)日：2014-08-12

申请号：US13381113

申请日：2010-06-18

Applicant: Shoichi Nomura ,  Goro Nakamura

Inventor： Shoichi Nomura ,  Goro Nakamura

IPC: H01R12/00

CPC classification number: H01R12/613 ,  H01R13/5208 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2203/0264 ,  Y10T29/49194

Abstract: A flexible flat cable connecting structure for connecting a flexible flat cable in which a plurality of rectangular conductors are provided in parallel and a plurality of connector terminals arranged at an array pitch different from that of the rectangular conductors comprises an intermediate cable arranging member one end of which is coupled to the connector terminals and in which a plurality of branch conductors are provided in parallel which are set to have mutually different longitudinal dimensions according to the array pitch. The intermediate cable arranging member is laid on the flexible flat cable so that the intermediate cable arranging member and the flexible flat cable are in the same plane and form an angle. The other ends of the branch conductors of the intermediate cable arranging member are connected to the respective rectangular conductors.

Abstract translation: 一种柔性扁平电缆连接结构，用于连接其中平行设置多个矩形导体的柔性扁平电缆和以矩形导线不同的阵列间距排列的多个连接器端子，包括中间电缆排列构件 其连接到连接器端子，并且其中多个分支导体平行设置，根据阵列间距设置成具有相互不同的纵向尺寸。 中间电缆排列构件放置在柔性扁平电缆上，使得中间电缆排列构件和柔性扁平电缆处于同一平面并形成一个角度。 中间电缆排列构件的分支导体的另一端连接到相应的矩形导体。

公开(公告)号：US20140144675A1

公开(公告)日：2014-05-29

申请号：US14084502

申请日：2013-11-19

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SHIH-PING HSU

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4694 ,  H05K1/111 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09445 ,  H05K2201/09472 ,  Y10T156/1064

Abstract: An exemplary multi-layer printed circuit board includes a multi-layer substrate with a recess, and a first high density wiring substrate received in the recess. The multi-layer substrate includes a base layer, a first wiring layer arranged on the base layer, first insulating layers, and third wiring layers. The first insulating layers and the third wiring layers are alternately arranged on the first wiring layer, such that there is one first insulating layer sandwiched between each two adjacent wiring layers of the first wiring layer and the third wiring layers. The first high density wiring substrate includes first high density wiring layers and third insulating layers, which are alternately arranged on each other. An outmost first high density wiring layer is exposed outside to define third electrical contact pads corresponding to the first electrical contact pads.

Abstract translation: 示例性的多层印刷电路板包括具有凹部的多层基板和容纳在凹部中的第一高密度布线基板。 多层基板包括基底层，布置在基底层上的第一布线层，第一绝缘层和第三布线层。 第一绝缘层和第三布线层交替布置在第一布线层上，使得夹在第一布线层和第三布线层的每两相邻布线层之间的一个第一绝缘层。 第一高密度布线基板包括彼此交替布置的第一高密度布线层和第三绝缘层。 最外面的第一高密度布线层暴露在外面以限定对应于第一电接触焊盘的第三电接触焊盘。

公开(公告)号：US20130072049A1

公开(公告)日：2013-03-21

申请号：US13624526

申请日：2012-09-21

Applicant: Panasonic Corporation

Inventor： Daisuke SATO ,  Mitsuru IIDA ,  Hiroshi IWANO ,  Tadahiro YAMAJI

IPC: H01R13/64 ,  H01R43/20

CPC classification number: H01R4/58 ,  H01R12/7052 ,  H01R12/771 ,  H01R12/79 ,  H05K1/117 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167 ,  Y10T29/49208

Abstract: In a connector assembly 1, male and female terminals 13 and 23 are positioned by inserting guide protrusions 15 into hole portions 25. Each of the guide protrusions 15 includes: a positioning portion 15a positioning male terminals 13 and female terminals 23; and a temporary positioning portion 15b which is smaller in diameter than the positioning portion 15a and is provided on the positioning portion 15a. The temporary positioning portion 15b is inserted through the hole portions 25 for temporary positioning of the male and female connectors 10 and 20 before the positioning portion 15a is inserted through the hole portions 25.

Abstract translation: 在连接器组件1中，通过将引导突起15插入到孔部25中来定位阳，阴端子13和23。每个引导突起15包括：定位部分15a，定位阳端子13和阴端子23; 以及直径比定位部15a小的临时定位部15b，并且设置在定位部15a上。 临时定位部分15b插入穿过孔部分25，用于在定位部分15a插入孔部分25之前临时定位阴连接器10和20。

公开(公告)号：US08376787B2

公开(公告)日：2013-02-19

申请号：US13123029

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

IPC: H01R24/00

CPC classification number: H04Q1/136 ,  H01R4/2433 ,  H01R13/2421 ,  H01R13/4538 ,  H01R13/465 ,  H01R13/6473 ,  H01R13/6616 ,  H01R13/6625 ,  H01R24/64 ,  H01R2201/04 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A termination unit (144) for use with a system that permits the monitoring of a computer network to perform network inventories. The termination unit takes the form of a cap that engages the termination face of a network jack and has a sensing circuit (246) integrated therewith so that, once engaged with the jack, the sensing circuit is connected to two terminals of the jack. The sensing circuit may include a resistor, capacitor or inductor, any of which provide a known sensing value that is different than a sensed value of an end-user device used on the network, but less than infinity so that the system senses when an end-user device is connected to or disconnected from the network.

Abstract translation: 一种与允许监视计算机网络执行网络清单的系统一起使用的终端单元（144）。 终端单元采用与网络插座的端接面接合的帽的形式，并且具有与其一体化的感测电路（246），使得一旦与插座接合，感测电路连接到插座的两个端子。 感测电路可以包括电阻器，电容器或电感器，其中任一个提供与网络上使用的终端用户设备的感测值不同但已经小于无穷远的已知感测值，使得系统感测何时结束 用户设备连接到网络或与网络断开连接。

公开(公告)号：US20120325524A1

公开(公告)日：2012-12-27

申请号：US13482299

申请日：2012-05-29

Applicant: Nobuyuki NAGANUMA ,  Hidetoshi Noguchi

Inventor： Nobuyuki NAGANUMA ,  Hidetoshi Noguchi

IPC: H05K1/11 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09845 ,  Y10T29/49126

Abstract: A flex-rigid wiring board has a first rigid wiring board having a first inner layer and a first terminal on the first inner layer, a second rigid wiring board having a second inner layer and a second terminal on the second inner layer, and a flexible wiring board connecting the boards and having third and fourth terminals on the flexible board. The first and second boards have openings and are positioned such that the boards are spaced apart and form a recess portion formed of the openings facing each other, the flexible board is in the recessed portion such that the first terminal is connected to the third terminal and the second terminal is connected to the fourth terminal, and the first board has an interlayer conductor through an insulation layer in the first board such that the conductor is not directly under the first terminal.

Abstract translation: 挠性刚性布线板具有第一刚性布线板，其具有第一内层和第一内层上的第一端子，第二刚性布线板，其具有第二内层和第二内层上的第二端子， 连接板的接线板和柔性板上的第三和第四端子。 第一板和第二板具有开口并且定位成使得板彼此间隔开并形成由彼此面对的开口形成的凹部，柔性板位于凹部中，使得第一端子连接到第三端子，并且 第二端子连接到第四端子，并且第一板具有穿过第一板中的绝缘层的层间导体，使得导体不直接在第一端子下方。

公开(公告)号：USRE42785E1

公开(公告)日：2011-10-04

申请号：US12790380

申请日：2010-05-28

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H02H9/00

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

Abstract translation: 提供一种半导体模块，其包括节拍散热器，与散热器热耦合的至少两个半导体以及电连接到半导体的多个导电引线。 至少一个导电引线对于两个半导体是共同的。半导体模块还包括电耦合到至少一个半导体的终端电阻器。 还教导了制造半导体模块的方法，由此提供多个导电引线。 至少两个半导体电耦合到多个导电引线，其中至少一个导电引线对于两个半导体都是共同的。 然后将半导体热耦合到散热器。 随后，终端电阻器电耦合到至少一个半导体。