公开(公告)号：US09929201B2

公开(公告)日：2018-03-27

申请号：US15241377

申请日：2016-08-19

Applicant: OLYMPUS CORPORATION

Inventor： Jumpei Yoneyama ,  Takahiro Shimohata

IPC: H01L27/146 ,  H01L31/02 ,  H04N5/335 ,  H05K1/11 ,  H04N5/225 ,  H05K1/02 ,  H01L31/0203

CPC classification number: H01L27/14632 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/02005 ,  H01L31/0203 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/335 ,  H05K1/028 ,  H05K1/118 ,  H05K2201/0373 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09845 ,  H05K2203/0228 ,  H05K2203/0285 ,  H05K2203/049 ,  H01L2924/00

Abstract: An image pickup apparatus is configured with an image pickup device on which a plurality of bumps are arranged in line on an outer circumferential portion of a light receiving surface; and a flexible wiring board including a plurality of inner leads each of which is configured with a distal end portion, a bending portion and a rear end portion, the distal end portion being compression-bonded to a bump, and the rear end portion being arranged parallel to a side face of the image pickup device with the bending portion interposed between the distal end portion and the rear end portion. A height of a light receiving portion side of the bumps is lower than a height of a side face side; and each of the inner leads is plastically transformed according to a shape of a top face of the bumps.

公开(公告)号：US20180065538A1

公开(公告)日：2018-03-08

申请号：US15808542

申请日：2017-11-09

Applicant: UUSI, LLC

Inventor： David W. Shank

IPC: B60Q1/00 ,  H05B33/08 ,  H05K1/14 ,  H05B37/02

CPC classification number: B60Q1/0088 ,  H01R12/62 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0854 ,  H05B33/086 ,  H05B37/0227 ,  H05K1/02 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/04 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10356

Abstract: A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.

公开(公告)号：US09840185B2

公开(公告)日：2017-12-12

申请号：US15362703

申请日：2016-11-28

Applicant: UUSI, LLC

Inventor： David W. Shank

IPC: H01R12/62 ,  H05K1/02 ,  H05K1/16 ,  B60Q1/00 ,  H05K1/14 ,  H05B37/02 ,  H05B33/08 ,  H05K1/11

CPC classification number: B60Q1/0088 ,  H01R12/62 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0854 ,  H05B33/086 ,  H05B37/0227 ,  H05K1/02 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/04 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10356

Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

公开(公告)号：US09831144B2

公开(公告)日：2017-11-28

申请号：US14428376

申请日：2013-08-28

Applicant: QUBEICON LTD.

Inventor： Shimon Podval

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/498 ,  H01L25/065 ,  H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L23/00 ,  H05K3/34

CPC classification number: H01L23/13 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/49113 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/15162 ,  H01L2924/15192 ,  H05K1/0204 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/0939 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

公开(公告)号：US20170299823A1

公开(公告)日：2017-10-19

申请号：US15512963

申请日：2015-09-10

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Naoyuki Tanaka

IPC: G02B6/42 ,  H05K1/02 ,  G02B6/122

CPC classification number: G02B6/428 ,  G02B6/122 ,  G02B6/136 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/02 ,  H05K3/0032 ,  H05K2201/09154 ,  H05K2201/10121

Abstract: An opto-electric hybrid board includes an electric circuit board in which electric wiring is formed on a front surface of an insulating layer, and an optical waveguide formed on the rear side of the electric circuit board. The optical waveguide and the electric circuit board are arranged so that left and right edges of the electric circuit board along a longitudinal direction of the optical waveguide overlap with left and right edges of the optical waveguide when viewed from above, or so that the left and right edges of the electric circuit board are on the inside of where the left and right edges of the optical waveguide are located. The opto-electric hybrid board is easy to handle owing to the reduced chance of the electric circuit board being damaged. The opto-electric hybrid board also does not cause misalignment of a core when used as a connector.

公开(公告)号：US09780465B1

公开(公告)日：2017-10-03

申请号：US15270816

申请日：2016-09-20

Applicant: Jeffrey David Hartman

Inventor： Jeffrey David Hartman

IPC: H01R12/00 ,  H01R12/52 ,  H01R13/24 ,  H01R43/02 ,  H01R43/26 ,  H01R107/00

CPC classification number: H01R12/722 ,  H01R12/737 ,  H05K1/14 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4617 ,  H05K3/4682 ,  H05K2201/046 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/10189 ,  H05K2203/0228

Abstract: An angled circuit board connector includes a unitary connector block having first and second board-contacting faces. The first and second board-contacting faces are arranged relative to each other at an operative angle. The connector block includes a block body. The first and second board-contacting faces face outward from the block body. A first connector port is located on the first board-contacting face. A second connector port is located on the second board-contacting face. A connector trace extends through at least a portion of the block body between the first and second board-contacting faces. The connector trace electrically connects the first and second connector ports.

公开(公告)号：US09772101B2

公开(公告)日：2017-09-26

申请号：US14478327

申请日：2014-09-05

Applicant: Molex, LLC

Inventor： Yi-Tse Ho

IPC: F21S4/00 ,  F21V21/00 ,  F21V29/83 ,  F21V19/00 ,  F21V29/77 ,  H05K1/02 ,  H05K3/18 ,  F21K9/232 ,  F21V3/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  F21Y115/10 ,  F21Y107/40

CPC classification number: F21V29/83 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09154 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2203/107

Abstract: An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

公开(公告)号：US20170181273A1

公开(公告)日：2017-06-22

申请号：US15379778

申请日：2016-12-15

Applicant: Fujitsu Technology Solutions Intellectual Property GmbH

Inventor： Wilhelm Neukam

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/20 ,  H05K7/14

CPC classification number: H05K1/0275 ,  H05K1/0284 ,  H05K1/03 ,  H05K3/20 ,  H05K5/0208 ,  H05K7/1427 ,  H05K2201/0388 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/09681

Abstract: An assembly includes a carrier and an electrically conductive mesh, wherein the carrier includes a side surface with an edge, the electrically conductive mesh is attached to the side surface and extends over the edge of the side surface, and the edge has a radius at least as big as a minimal bending radius of electric lines of the electrically conductive mesh.

公开(公告)号：US20170084976A1

公开(公告)日：2017-03-23

申请号：US15364899

申请日：2016-11-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuo IKEMOTO ,  Yuki WAKABAYASHI ,  Shigeru TAGO

IPC: H01P3/08 ,  H05K1/11 ,  H01R12/62 ,  H05K3/46 ,  H01P11/00 ,  H05K1/02 ,  H05K3/36

CPC classification number: H01P3/082 ,  H01P3/08 ,  H01P11/003 ,  H01R12/62 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/115 ,  H05K1/118 ,  H05K1/147 ,  H05K3/0052 ,  H05K3/363 ,  H05K3/4623 ,  H05K3/4632 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/097 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10204 ,  Y10T29/49016

Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

公开(公告)号：US20160358964A1

公开(公告)日：2016-12-08

申请号：US15241377

申请日：2016-08-19

Applicant: OLYMPUS CORPORATION

Inventor： Jumpei YONEYAMA ,  Takahiro SHIMOHATA

IPC: H01L27/146 ,  H01L31/02

CPC classification number: H01L27/14632 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/02005 ,  H01L31/0203 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/335 ,  H05K1/028 ,  H05K1/118 ,  H05K2201/0373 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09845 ,  H05K2203/0228 ,  H05K2203/0285 ,  H05K2203/049 ,  H01L2924/00

Abstract: An image pickup apparatus is configured with an image pickup device on which a plurality of bumps are arranged in line on an outer circumferential portion of a light receiving surface; and a flexible wiring board including a plurality of inner leads each of which is configured with a distal end portion, a bending portion and a rear end portion, the distal end portion being compression-bonded to a bump, and the rear end portion being arranged parallel to a side face of the image pickup device with the bending portion interposed between the distal end portion and the rear end portion. A height of a light receiving portion side of the bumps is lower than a height of a side face side; and each of the inner leads is plastically transformed according to a shape of a top face of the bumps.

Abstract translation: 图像拾取装置配置有图像拾取装置，多个凸块在光接收表面的外周部分上排成一列; 以及柔性布线板，其具有多个内部引线，每个内部引线被构造为具有前端部，弯曲部和后端部，所述前端部被压接在凸块上，所述后端部配置 平行于图像拾取装置的侧面，其中弯曲部分插入在远端部分和后端部分之间。 凸块的受光部侧的高度低于侧面侧的高度; 并且每个内引线根据凸块的顶面的形状进行塑性变形。