公开(公告)号：US20180116078A1

公开(公告)日：2018-04-26

申请号：US15789184

申请日：2017-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju MUN ,  Keon KUK ,  Ji-woon YEOM

IPC: H05K9/00 ,  H05K1/11 ,  H05K1/18 ,  H01L23/552 ,  H05K3/40

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4007 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/10371 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/163

Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

公开(公告)号：US09894753B2

公开(公告)日：2018-02-13

申请号：US15611849

申请日：2017-06-02

Applicant: ROHM CO., LTD.

Inventor： Tomohiro Ikuta

IPC: H04B1/38 ,  H05K1/02 ,  H05K7/02 ,  H05K1/14 ,  H04B1/44

CPC classification number: H05K1/0243 ,  H04B1/44 ,  H05K1/144 ,  H05K1/148 ,  H05K7/026 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.

公开(公告)号：US20180042103A1

公开(公告)日：2018-02-08

申请号：US15783191

申请日：2017-10-13

Applicant: Laird Technologies, Inc.

Inventor： John Song ,  George William Rhyne

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

公开(公告)号：US09839127B2

公开(公告)日：2017-12-05

申请号：US14793384

申请日：2015-07-07

Applicant: Heung Kyu Kwon ,  Kyoung Mook Lim

Inventor： Heung Kyu Kwon ,  Kyoung Mook Lim

IPC: H05K1/18 ,  G01R31/28 ,  G06F1/16 ,  H01L23/552 ,  H01L25/065 ,  H01L23/31 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  G01R31/2884 ,  G06F1/1613 ,  G06F1/1637 ,  H01L23/3121 ,  H01L23/552 ,  H01L25/065 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06596 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0268 ,  H05K1/112 ,  H05K2201/10159 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state.

公开(公告)号：US20170332485A1

公开(公告)日：2017-11-16

申请号：US15154077

申请日：2016-05-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  Silvio DRAGONE ,  Michael J. FISHER ,  Michael A. GAYNES ,  David C. LONG ,  Kenneth P. RODBELL ,  William SANTIAGO-FERNANDEZ ,  Thomas WEISS

IPC: H05K1/02 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K1/0275 ,  G06F21/87 ,  H05K1/181 ,  H05K1/185 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.

公开(公告)号：US20170328392A1

公开(公告)日：2017-11-16

申请号：US15595631

申请日：2017-05-15

Applicant: Kathrein Werke KG

Inventor： Jörg Langenberg ,  Florian Leinenbach ,  Philipp Ponn

IPC: F16B5/00 ,  F16B5/02

CPC classification number: F16B5/0024 ,  F16B5/02 ,  H01Q21/08 ,  H01Q21/26 ,  H05K3/0061 ,  H05K3/3447 ,  H05K9/006 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/093 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/10371 ,  H05K2201/2036

Abstract: What is provided is an adapter plate for HF structures, which is set up for being disposed between a back of a circuit board and a reflector, wherein the adapter plate is electrically conductive, and the adapter plate has an opening or a cavity at every location where an element is passed through the circuit board to the side of the adapter plate, wherein at least one element is passed through the circuit board exclusively for ground contacting.

公开(公告)号：US20170311438A1

公开(公告)日：2017-10-26

申请号：US15490012

申请日：2017-04-18

Applicant: Laird Technologies, Inc.

Inventor： Mohammadli Khorrami ,  Paul Francis Dixon ,  George William Rhyne

IPC: H05K1/02 ,  H01L23/64 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L23/552 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H01L23/3114 ,  H01L23/552 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/85 ,  H01L2924/141 ,  H01L2924/1615 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0233 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0003 ,  H05K9/0028 ,  H05K2201/0707 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.

公开(公告)号：US20170273173A1

公开(公告)日：2017-09-21

申请号：US15611849

申请日：2017-06-02

Applicant: ROHM CO., LTD.

Inventor： Tomohiro IKUTA

IPC: H05K1/02 ,  H04B1/44 ,  H05K7/02 ,  H05K1/14

CPC classification number: H05K1/0243 ,  H04B1/44 ,  H05K1/144 ,  H05K1/148 ,  H05K7/026 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.

公开(公告)号：US09769934B2

公开(公告)日：2017-09-19

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro Miyao ,  Hideki Ishigami ,  Yukihiko Shiohara ,  Tetsuya Otsuki ,  Hidefumi Nakamura

IPC: B32B3/10 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

公开(公告)号：US09756719B2

公开(公告)日：2017-09-05

申请号：US15141722

申请日：2016-04-28

Applicant: KYOCERA Document Solutions Inc.

Inventor： Yasuyoshi Kobayashi

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0216 ,  H05K9/0022 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: Provided is an electronic equipment which can effectively reduce unexpected unnecessary radiation. In the electronic equipment, a circuit board on which a noise source that is an electronic part becoming a source of the unnecessary radiation is mounted and a circuit board mounting plate on which the circuit board is mounted are disposed substantially parallel with a space put therebetween. In the electronic equipment, a partition plate is disposed, which functions as a noise reflecting surface on which an indirect wave emitted from the noise source towards the circuit board mounting plate is reflected. Further, an indirect wave dispersing member is disposed between the circuit board and the circuit board mounting plate so as to block spacing between the noise source and the partition plate.