公开(公告)号：US20150189765A1

公开(公告)日：2015-07-02

申请号：US14506251

申请日：2014-10-03

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

IPC: H05K3/36 ,  B23K37/04 ,  B23K1/00 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K37/04 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R12/61 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0311 ,  H05K2201/058 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/0228 ,  H05K2203/043 ,  H05K2203/16

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

Abstract translation: 本发明的实施例包括柔性电路板互连和相关的方法。 在一个实施例中，本发明包括将多个柔性电路板连接在一起的方法，包括在第一柔性电路板的上表面和第二柔性电路板的下表面之间施加焊料组合物的步骤; 将第一柔性电路板的上表面和第二柔性电路板的下表面保持在一起; 并且用热源回流焊料组合物，以将第一柔性电路板和第二柔性电路板结合在一起，以分别形成长度大于第一柔性电路板或第二柔性电路板的长度的柔性电路板条。 在一个实施例中，本发明包括用于将柔性电路板保持在一起的电路板夹，所述夹具包括u形紧固件; 连接到U形紧固件的弹簧张力臂; 以及连接到弹簧张力臂的连接机构。 本文还包括其它实施例。

公开(公告)号：US20140311791A1

公开(公告)日：2014-10-23

申请号：US14206750

申请日：2014-03-12

Applicant: HIQ SOLAR, INC.

Inventor： Andre P. WILLIS

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.

Abstract translation: 具有诸如焊盘的部件连接焊盘的印刷线路板，为表面安装电路部件提供热应力补偿以及制造这种焊盘的方法。 部件连接焊盘包括相对的多个导电指状物组，它们在其远端相互连接并且在它们的近端分开，在它们的近端具有用于安装单个表面安装电路部件的表面。

公开(公告)号：US08665057B2

公开(公告)日：2014-03-04

申请号：US12899941

申请日：2010-10-07

Applicant: Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

Inventor： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

IPC: H01H85/36 ,  H01H37/76

CPC classification number: H01H37/761 ,  H05K1/0201 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/341 ,  H05K3/3415 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/10265

Abstract: An electronic circuit includes a conductor path on a circuit board, and at least one SMD component, electronic component and/or electromechanical component mounted on the circuit board and connected to the conductor path. A circuit connection is established via a soldered joint and a spring-loaded or stressed springy contact bridge that provides fuse protection. In the event of excessive power dissipation or high temperature, the soldered joint melts or softens and the contact bridge springs open to interrupt the circuit.

Abstract translation: 电子电路包括电路板上的导体路径和安装在电路板上并连接到导体路径的至少一个SMD组件，电子组件和/或机电组件。 通过焊接接头和弹簧加载或应力弹性接触桥建立电路连接，提供保险丝保护。 在功耗过高或温度过高的情况下，焊接接头熔化或软化，接触桥弹簧打开以中断电路。

公开(公告)号：US20130319739A1

公开(公告)日：2013-12-05

申请号：US13598503

申请日：2012-08-29

Applicant: Shawn X. ARNOLD

Inventor： Shawn X. ARNOLD

IPC: H01R24/00 ,  H01R43/00 ,  H05K1/00 ,  H01R13/62 ,  H05K1/16

CPC classification number: H01R12/714 ,  H01R12/732 ,  H05K1/117 ,  H05K1/142 ,  H05K3/365 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/1034 ,  H05K2201/1059 ,  Y10T156/10 ,  Y10T156/1052

Abstract: A spring finger interconnection system can include a plug and a receptacle. In one embodiment, the plug can include spring finger contacts configured to carry electrical signals. The receptacle can include a cavity to receive the plug and the cavity can be constructed with printed circuit board fabrication techniques. In one embodiment, the cavity can be formed, at least in part, in a pre-impregnation layer and a first and a second layer can be disposed above and below the pre-impregnation layer to further form the cavity. In one embodiment, contacts can be arranged on the first layer to contact the spring fingers when the plug is inserted into the cavity. In another embodiment, contacts can be arranged on both the first and the second layers. In yet another embodiment, the cavity can be shaped to aid in contact-to-spring finger alignment when the plug is inserted in the cavity.

Abstract translation: 弹簧手指互连系统可以包括插头和插座。 在一个实施例中，插头可以包括配置成承载电信号的弹簧爪触点。 容器可以包括用于接收插头的空腔，并且空腔可以由印刷电路板制造技术构成。 在一个实施例中，空腔可以至少部分地形成在预浸渍层中，并且可以在预浸渍层的上方和下方设置第一和第二层以进一步形成空腔。 在一个实施例中，当插头插入空腔时，触头可布置在第一层上以接触弹簧指。 在另一个实施例中，触点可以布置在第一和第二层上。 在另一个实施例中，当插头插入空腔时，空腔可被成形为有助于接触弹簧对准。

公开(公告)号：US20130255993A1

公开(公告)日：2013-10-03

申请号：US13430992

申请日：2012-03-27

Applicant: Shu-Li HSIEH

Inventor： Shu-Li HSIEH

IPC: H01B7/00

CPC classification number: H05K1/0215 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2421 ,  H01R2101/00 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/10295 ,  H05K2201/10371 ,  Y10T24/13 ,  Y10T24/45251

Abstract: The present invention relates to a partition post used on a printed circuit board, which comprises an insulation post member and an electric conductive spring. The top and the bottom of the insulation post member are respectively and protrudingly installed with an upper and a lower connection rings, and the bottom surface of the lower connection ring is longitudinally extended with an arrow-shaped elastic buckle claw; the electric conductive spring is sleeved on the insulation post member, the top and the bottom thereof are respectively installed with an upper and a lower guide parts composed of plural spiral rings and at the locations corresponding to the upper and the lower connection rings; so static electricity and/or noise signal generated by each electric component on the printed circuit board can be transmitted through the electric conductive spring to the electric conductive member and thereby providing a grounding effect.

Abstract translation: 本发明涉及一种在印刷电路板上使用的分隔柱，其包括绝缘柱构件和导电弹簧。 绝缘柱构件的顶部和底部分别突出地安装有上连接环和下连接环，并且下连接环的底表面以箭头形弹性扣爪纵向延伸; 导电弹簧套在绝缘柱构件上，其顶部和底部分别安装有由多个螺旋环组成的上和下引导部分以及与上连接环和下连接环相对应的位置; 因此印刷电路板上的每个电气部件产生的静电和/或噪声信号可以通过导电弹簧传递到导电部件，从而提供接地效果。

公开(公告)号：US20130183862A1

公开(公告)日：2013-07-18

申请号：US13786412

申请日：2013-03-05

Applicant: Super Talent Technology, Corp.

Inventor： Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma

IPC: H01R12/71 ,  H05K3/36

CPC classification number: H05K3/3484 ,  G06F1/1632 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01R12/57 ,  H01R12/71 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/361 ,  H05K3/4007 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49128 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads, and several extended purpose contact springs disposed on an upper side of a PCB. A single-shot molding process is used to form a molded housing over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The EUSB device is optionally used as a modular insert that is mounted onto a metal or plastic case to provide a EUSB assembly having a plug shell similar to a standard USB male connector.

公开(公告)号：US08475180B2

公开(公告)日：2013-07-02

申请号：US13145267

申请日：2010-11-04

Applicant: Hideo Yumi

Inventor： Hideo Yumi

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01R4/64 ,  H01R12/57 ,  H01R12/718 ,  H01R13/2428 ,  H01R2101/00 ,  H05K3/34 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A conductive component includes a tubular body having at least one of at least one through-hole which penetrates the tubular body from outside to inside thereof; and at least one notch which is cut in from an edge of the tubular body, which are formed at least one predetermined portion on the tubular body. The tubular body includes a first portion, which includes a solder joint portion, and a second portion, which includes a contact portion. The first portion and the second portion are located on the opposite sides from one another with the at least one predetermined portion sandwiched therebetween. The tubular body further includes at least one spring portion which includes the at least one predetermined portion.

Abstract translation: 导电部件包括管状体，其具有至少一个从外部至内部穿过管状体的通孔中的至少一个; 以及从管状体的边缘切割出的至少一个凹口，其形成在管状体上的至少一个预定部分。 管体包括包括焊接部分的第一部分和包括接触部分的第二部分。 第一部分和第二部分彼此相对设置，其中至少一个预定部分夹在其间。 管状体还包括至少一个包括至少一个预定部分的弹簧部分。

公开(公告)号：US20130120947A1

公开(公告)日：2013-05-16

申请号：US13678898

申请日：2012-11-16

Applicant: Dawning Leading Technology Inc.

Inventor： Diann-Fang LIN

IPC: H05K7/06 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K7/06 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5388 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0652 ,  H01L2224/04042 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1531 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/306 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/09481 ,  H05K2201/10295 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention discloses an electrical device with a connection interface, a circuit board thereof, and a method for manufacturing the same. The electrical device with a connection interface includes: a circuit board on which a first circuit layer and a second circuit layer are formed and the second circuit layer has plural terminal pads, wherein a cavity is formed in the terminal pads and extends to the first circuit layer, and a metal layer is disposed in the cavity and connected to the first circuit layer and the terminal pads and defines an opening; a semiconductor chip electrically connected to the first circuit layer; and a conductive element interlaid in the opening. The electrical device with a connection interface does not need to be formed by assembling a terminal module because the conductive element is directly mounted on the circuit board.

Abstract translation: 本发明公开了一种具有连接接口的电气设备及其电路板及其制造方法。 具有连接接口的电气设备包括：电路板，其上形成有第一电路层和第二电路层，并且第二电路层具有多个端子焊盘，其中在端子焊盘中形成空腔并延伸到第一电路 层，并且金属层设置在空腔中并连接到第一电路层和端子焊盘并限定开口; 电连接到第一电路层的半导体芯片; 以及插入开口中的导电元件。 具有连接接口的电气设备不需要通过组装端子模块来形成，因为导电元件直接安装在电路板上。

公开(公告)号：US20120268854A1

公开(公告)日：2012-10-25

申请号：US13503983

申请日：2010-09-09

Applicant: Andreas Schmidtlein

Inventor： Andreas Schmidtlein

IPC: H02H5/04 ,  H05K3/30

CPC classification number: H05K1/0201 ,  H01H37/761 ,  H01H2037/046 ,  H01H2037/763 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10757 ,  H05K2203/0271 ,  H05K2203/176 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An electronic component has an integrated protective device which responds in the event of a thermal overload and interrupts a current flow through the component. The protective device has an electrical terminal which may be brought under spring pretension by intrinsic resilience and assumes a mounting position in the pretensioned state and a current interrupting position in the untensioned state.

Abstract translation: 电子部件具有集成的保护装置，其在热过载的情况下响应并且中断通过部件的电流。 保护装置具有电气端子，其可以通过内在的弹性而处于弹簧预张紧状态，并且处于处于预张紧状态的安装位置和处于未张紧状态的电流中断位置。

公开(公告)号：US08251707B2

公开(公告)日：2012-08-28

申请号：US13123036

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

IPC: H01R29/00

CPC classification number: H01R13/6658 ,  H01R12/67 ,  H01R24/64 ,  H01R25/006 ,  H01R2201/04 ,  H04L41/12 ,  H04Q1/136 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A structure for use with data network management systems uses a plurality of cables interconnecting patch panels, network devices and end-user devices and further utilizes integrated circuits to monitor the status of these end-user devices. The structure includes respective primary (36) and secondary (45) circuit boards. A plurality of connective jacks (31) are mounted on the primary circuit board and these jacks are interconnected to switches and other patch panels within the network. Wires from the jacks extend to and connect with end-user devices and a secondary circuit board is spaced apart from the primary circuit board so as to define a hollow nest (42) within the patch panel assembly that houses and protects integrated circuits (45, 52) and the like.

Abstract translation: 用于数据网络管理系统的结构使用互连接线板，网络设备和最终用户设备的多条电缆，并且还利用集成电路来监视这些终端用户设备的状态。 该结构包括相应的初级（36）和次级（45）电路板。 多个连接插座（31）安装在主电路板上，并且这些插孔与网络内的交换机和其他接线板互连。 插座的电线延伸到终端用户设备并与其连接，并且次级电路板与主电路板间隔开，以便在接线板组件内限定一个中空的座（42），该中空座（42）容纳和保护集成电路 52）等。