公开(公告)号：US20140335706A1

公开(公告)日：2014-11-13

申请号：US14253885

申请日：2014-04-16

Applicant: Unimicron Technology Corp.

Inventor： Chih-Peng Fan ,  Yin-Hwa Cheng ,  Ching-Ho Hsieh ,  Ling-Kai Su ,  Yung-Hao Hsueh

IPC: H01R12/71

CPC classification number: H01R12/718 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/10265 ,  H05K2201/10719

Abstract: An electrical connector includes a base and an elastic terminal. The base has a recess. The elastic terminal is connected to the base and extends to the recess. The elastic terminal has a fixed end and a free end, the fixed end is connected to the base, and the free end is located at the recess and is curved. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to bend towards the bottom of the recess so that the free end leans against the bottom of the recess. The electrical connector may further include a contact protrusion connected to the elastic terminal. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to make the elastic terminal bend towards the bottom portion of the recess so that the free end leans against the bottom of the recess.

Abstract translation: 电连接器包括基座和弹性端子。 底座有一个凹槽。 弹性端子连接到基座并延伸到凹部。 弹性端子具有固定端和自由端，固定端连接到基座，自由端位于凹槽处并弯曲。 当接触件朝向凹部移动时，触头能够推动接触突起朝向凹部的底部弯曲，使得自由端靠在凹部的底部。 电连接器还可以包括连接到弹性端子的接触突起。 当接触件朝向凹部移动时，触头能够推动接触突起，以使弹性端子朝向凹部的底部弯曲，使得自由端靠在凹部的底部。

公开(公告)号：US20140268596A1

公开(公告)日：2014-09-18

申请号：US13802701

申请日：2013-03-13

Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

Inventor： Eugene M. Chow ,  Dirk DeBruyker

IPC: H05K1/02

CPC classification number: H01L23/5387 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/113 ,  H05K1/189 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H01L2924/00

Abstract: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.

Abstract translation: 用于在柔性电子器件中的IC器件之间传输信号的柔性金属互连结构形成在层叠在一起形成多层柔性衬底的两个柔性柔性材料层之间。 互连结构由连接到柔性材料层的内侧（面向）表面的两排间隔开的导电焊盘（金属岛）形成。 合适的微接触元件例如微弹簧提供滑动金属压力接触件，其在拉伸复合片材期间保持岛之间的电连接。 具体地，至少两个微接触元件附接到行中的一个中的每个金属岛，其中一个元件与相对行中的相关联的第一金属岛滑动压力接触，并且第二元件与相关联的第二元件滑动压力接触 金属岛。 岛和滑动触点可以被图案化成适应大应变的高密度迹线。

公开(公告)号：US20140226296A1

公开(公告)日：2014-08-14

申请号：US14129399

申请日：2012-02-10

Applicant: KABUSHIKI KAISHA TOYOTA , JIDOSHOKKI

Inventor： Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0263 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/18 ,  H05K3/202 ,  H05K3/4092 ,  H05K3/46 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0397 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2203/0195

Abstract: This multi-layer wiring board is provided with an insulating substrate, an inner layer copper sheet, and an outer layer copper foil. The inner layer copper sheet is disposed within the insulating substrate and has been patterned. The outer layer copper foil is disposed in a state of having been patterned at the surface of the insulating substrate, is thinner than the inner layer copper sheet, and has a cross-sectional area of the current path that is smaller than the cross-sectional area of the current path of the inner layer copper sheet. As a result, provided are: a multi-layer wiring board that can flow a large current and a smaller current while suppressing an increase in the projected area of the substrate; and a method for producing the multi-layer wiring board.

Abstract translation: 该多层布线板设置有绝缘基板，内层铜板和外层铜箔。 内层铜片设置在绝缘基板内并被图案化。 外层铜箔被设置在绝缘基板的表面被图案化的状态下，比内层铜片薄，并且具有小于横截面的电流路径的截面积 内层铜片电流通路面积。 结果，提供了：能够抑制基板的投影面积的增加而能够流过大电流和小电流的多层布线基板; 以及多层布线基板的制造方法。

公开(公告)号：US08631569B2

公开(公告)日：2014-01-21

申请号：US10572953

申请日：2004-09-20

Applicant: Dietmer Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger ,  Andreas Bensch ,  Herbert Harder ,  Andreas Kiefer ,  Klaus Peter Weinhold

Inventor： Dietmer Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger ,  Andreas Bensch ,  Herbert Harder ,  Andreas Kiefer ,  Klaus Peter Weinhold

IPC: H01K3/10

CPC classification number: H05K13/0465 ,  H05K1/036 ,  H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10575 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: In order to secure wired components of large mass or non-uniform mass distribution safely on a circuit board, without the components needing, as currently usual, to be glued onto the circuit board or held on the circuit board with snap-in holders, integrated into a connection bore for receiving a connection wire, or pin, of an electronic component a holding mechanism for secured holding of the connection wire, or pin. The holding mechanism represents a narrowing in the connection bore to a diameter smaller than that of the connection wire, or pin. The holding mechanism can be implemented, for example, by a connection bore embodied in the form of a bore drilled from one side of the circuit board, not completely through the circuit board. In such case, edge remains as a narrowing, which securely seizes the connection pin of the relevant component and holds the component fixed to the circuit board.

Abstract translation: 为了在电路板上安全地将大质量或不均匀质量分布的有线部件安全地固定在电路板上，而不需要像现在常用的组件一样被胶合到电路板上或者用卡入式保持器固定在电路板上，集成 进入用于接收电子部件的连接线或销的连接孔，用于固定地保持连接线或销的保持机构。 保持机构表示连接孔的直径小于连接线或销的直径。 保持机构可以例如通过以电路板的一侧钻出的孔的形式而不是完全通过电路板实现的连接孔来实现。 在这种情况下，边缘保持为狭窄，其牢固地抓住相关部件的连接销并将固定在电路板上的部件保持在一起。

公开(公告)号：US20140008105A1

公开(公告)日：2014-01-09

申请号：US14021053

申请日：2013-09-09

Applicant: FURUKAWA AUTOMOTIVE SYSTEMS INC. ,  FURUKAWA ELECTRIC CO., LTD.

Inventor： Kyutaro ABE ,  Hiroyuki FUKAI ,  Yasushi KIHARA ,  Juro UTSUMI ,  Naomi TAKAHASHI

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0263 ,  H05K1/141 ,  H05K1/142 ,  H05K1/183 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10409 ,  Y10T29/49144

Abstract: A circuit board is formed such that a printed circuit board is connected to an injection molded circuit board. An internal circuit conductor is exposed at conductor part at a printed circuit board mounting part. Through holes are provided in the printed circuit board. The conductor part is formed substantially perpendicular to the circuit board mounting part, and is inserted into a through hole. A female screw part is formed in the vicinity of the conductor part in the printed circuit board mounting part. The female screw part can be screwed together with a bolt, which is a securing member. The printed circuit board is connected to the conductor part by solder. A hole is formed in advance in the vicinity of the solder on the printed circuit board. The bolt passes through the hole and is secured to the female screw part.

Abstract translation: 电路板形成为使得印刷电路板连接到注塑电路板。 内部电路导体在印刷电路板安装部的导体部露出。 印刷电路板上设有通孔。 导体部分基本上垂直于电路板安装部分形成，并被插入到通孔中。 在印刷电路板安装部分中的导体部分附近形成有内螺纹部分。 内螺纹部分可以用作为固定构件的螺栓拧紧在一起。 印刷电路板通过焊料连接到导体部分。 预先在印刷电路板上的焊料附近形成孔。 螺栓穿过孔并固定到内螺纹部分。

公开(公告)号：US20130342788A1

公开(公告)日：2013-12-26

申请号：US14012560

申请日：2013-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoon CHOI ,  Kwang-youn KIM

IPC: G02F1/1335 ,  H05B33/08

CPC classification number: G02F1/133603 ,  G02B6/0083 ,  G02B6/009 ,  G09G3/3406 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10189 ,  Y02P70/611

Abstract: A backlight apparatus includes a substrate which includes a plurality of layers. A plurality of light emitting modules are arranged on a top layer of the plurality of layers closest to a light guide panel, and a plurality of wires penetrates through the plurality of layers to electrically connect the light emitting modules and a plurality of driving units. Accordingly, the width of the substrate of an edge type backlight apparatus which can provide local dimming is reduced. Therefore, the display apparatus using the edge type backlight apparatus can be slim even if it is designed to provide local dimming.

Abstract translation: 背光装置包括具有多层的基板。 多个发光模块布置在最靠近导光板的多个层的顶层上，并且多根导线穿过多层以电连接发光模块和多个驱动单元。 因此，可以提供能够提供局部调光的边缘型背光装置的基板的宽度。 因此，即使设计为提供局部调光，使用边缘型背光装置的显示装置也可以是纤细的。

公开(公告)号：US08476532B2

公开(公告)日：2013-07-02

申请号：US13272877

申请日：2011-10-13

Applicant: Naofumi Kitano ,  Tetsuya Esaki

Inventor： Naofumi Kitano ,  Tetsuya Esaki

IPC: H05K1/00

CPC classification number: H05K1/0215 ,  H05K1/0224 ,  H05K1/147 ,  H05K2201/0397 ,  H05K2201/09681

Abstract: A multilayer flexible printed circuit board disclosed in the present application is a multilayer flexible printed circuit board in which a ground layer, an insulating layer and a signal wiring layer in which signal wiring is formed are laminated in sequence, with the multilayer flexible printed circuit board including a protruding portion protruding laterally, and a ground that is electrically connected to the ground layer being formed on at least one surface of the protruding portion, in order to have shielding properties that can cope with high speed signal transmission performed via the signal wiring layer.

Abstract translation: 本申请中公开的多层柔性印刷电路板是多层柔性印刷电路板，其中依次层叠形成信号布线的接地层，绝缘层和信号布线层，多层柔性印刷电路板 包括横向突出的突出部分和在突出部分的至少一个表面上形成的与接地层电连接的接地，以便具有能够应付经由信号布线层执行的高速信号传输的屏蔽特性 。

公开(公告)号：US08441806B2

公开(公告)日：2013-05-14

申请号：US12894968

申请日：2010-09-30

Applicant: Kiyotaka Tsukada ,  Tetsuya Muraki

Inventor： Kiyotaka Tsukada ,  Tetsuya Muraki

IPC: H01R9/00

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post.

Abstract translation: 电路板包括用于电连接到半导体器件的第一电极的第一导电柱，连接到第一导电柱的第一金属板，用于电连接到半导体器件的第二电极的第二导电柱，第二金属 板，连接到第二导电柱，用于电连接到半导体器件的第三电极的第三导电柱，以及连接到第三导电柱的第三金属板。

公开(公告)号：US20130100691A1

公开(公告)日：2013-04-25

申请号：US13695966

申请日：2011-06-24

Applicant: Frank Singer ,  Thomas Haug ,  Alexander Sauerer

Inventor： Frank Singer ,  Thomas Haug ,  Alexander Sauerer

IPC: F21V29/00 ,  B60Q1/04

CPC classification number: H01L33/64 ,  B60Q1/04 ,  F21K9/00 ,  F21S41/141 ,  F21S41/19 ,  F21V29/70 ,  F21Y2115/10 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/021 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10106 ,  H01L2924/00

Abstract: In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink.

Abstract translation: 在至少一个实施例中，光电子照明模块包括电路板，开口正好通过。 电路板包括用于将照明模块机械地紧固到外部散热器的紧固装置。 照明模块的载体安装在开口中。 至少一个光电半导体芯片位于载体顶部上，并通过载体与电路板电连接。 此外，电路板与载体牢固地机械连接。 电路板另外设计成在载体上施加机械力并将载体压靠在外部散热器上。 载体被设计成搁置在载体底部平坦抵靠外部散热器的位置。

公开(公告)号：US20130063903A1

公开(公告)日：2013-03-14

申请号：US13635606

申请日：2011-03-16

Applicant: Michael Heim ,  Sigmund Braun

Inventor： Michael Heim ,  Sigmund Braun

IPC: H05K7/06

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

Abstract: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).

Abstract translation: 本发明涉及一种包括电和/或电子模块（10）和电路载体（12）的装置，其中电和/或电子模块（10）的至少一个电连接线（14）可以容纳在 电路载体（12）的凹部（16）。 该装置包括至少一个夹紧元件（18a，18b，18c，18d），一旦其已经被引入到凹部（16）中就将至少一个连接线（14）固定在凹部（16）中。