公开(公告)号：US20170062021A1

公开(公告)日：2017-03-02

申请号：US15351600

申请日：2016-11-15

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/04

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Abstract translation: 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US20160291723A1

公开(公告)日：2016-10-06

申请号：US14947563

申请日：2015-11-20

Applicant: Japan Display Inc.

Inventor： Hayato Kurasawa ,  Keisuke Asada ,  Tatsuya Ide ,  Koji Ishizaki

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F2203/04108 ,  G06F2203/04112 ,  H05K1/028 ,  H05K1/117 ,  H05K1/147 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10128

Abstract: [Problem] To prevent detachment of overcoat layer which covers at least a part of a terminal formed on a substrate.[Measure to solve the problem] According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the conductive adhesion layer covers the coating layer, the metal material that forms the terminal includes a shape that the metal material is partly removed.

Abstract translation: [解决问题的措施]根据一个实施例，检测装置包括基板，检测电极，由金属材料形成的端子，引线，涂层，导电粘合层和电路板。 引线连接电极和端子。 涂层覆盖电极和引线，部分覆盖端子。 粘合层覆盖从涂层露出的端部的一部分并覆盖涂层的一部分。 电路板连接到端子，粘合层插入其间。 至少在导电粘合层覆盖涂层的重叠区域中，形成端子的金属材料包括部分去除金属材料的形状。

公开(公告)号：US09462676B2

公开(公告)日：2016-10-04

申请号：US13508401

申请日：2010-11-04

Applicant: Kent E. Regnier

Inventor： Kent E. Regnier

IPC: H03H7/09 ,  H05K1/02 ,  H01R13/6469 ,  H01R13/66 ,  H01R107/00 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K1/0227 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6625 ,  H01R13/6633 ,  H01R2107/00 ,  H03H7/09 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/115 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2203/0307

Abstract: A multi-layer circuit member includes first and second electrically connected reference regions. At least a portion of a signal conductor is in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions.

Abstract translation: 多层电路构件包括第一和第二电连接的参考区域。 信号导体的至少一部分接近第一区域，电路部件接近第二区域。 在第一和第二电连接区域之间存在增加阻抗的区域。

公开(公告)号：US09355779B2

公开(公告)日：2016-05-31

申请号：US13872297

申请日：2013-04-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo Hattori ,  Isamu Fujimoto

IPC: H01G4/228 ,  H01G4/30 ,  H01G4/232 ,  H05K3/34 ,  H05K1/18 ,  H01G4/12 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: In an electronic component, a first outer electrode is provided on a first side surface and a second outer electrode is provided on a second side surface. Each of the first and second outer electrodes includes first and second electrode portions that are arranged at positions other than end portions and a center of the first or second side surface in a first direction.

Abstract translation: 在电子部件中，第一外部电极设置在第一侧面上，第二外部电极设置在第二侧面上。 第一和第二外部电极中的每一个包括第一和第二电极部分，其布置在第一方向上的除了端部之外的位置和第一或第二侧表面的中心。

公开(公告)号：US09332640B2

公开(公告)日：2016-05-03

申请号：US14113597

申请日：2012-04-17

Applicant: Angelika Schingale ,  Frank Baur

Inventor： Angelika Schingale ,  Frank Baur

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/02

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H05K1/0272 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/09781 ,  Y02P70/611 ,  H01L2924/00

Abstract: A contact area is provided on a carrier for connection to a mating contact area on a further carrier using an adhesive containing conductive particles. The contact area includes at least one recess forming a drain channel for the adhesive, extending from one edge of the contact area to an opposing edge and having a width being less than an average diameter of the particles. Alternatively, the contact area includes boreholes extending from a main surface to an opposing main surface and having diameters being approximately equal to or smaller than the average diameter of the particles in at least one direction and a cavity is formed in the carrier beneath the contact area. Alternatively, integral moldings forming a turf structure are provided on the contact area and distances between the moldings are equal to or smaller than the average diameter of the particles in at least one direction.

Abstract translation: 接触区域设置在载体上，用于使用含有导电颗粒的粘合剂连接到另一载体上的配合接触区域。 接触区域包括形成用于粘合剂的排出通道的至少一个凹部，从接触区域的一个边缘延伸到相对的边缘并且具有小于颗粒的平均直径的宽度。 或者，接触区域包括从主表面延伸到相对的主表面的钻孔，并且其直径在至少一个方向上大约等于或小于颗粒的平均直径，并且空腔形成在接触区域下方的载体中 。 或者，形成草皮结构的整体模制品设置在接触区域上，并且模制品之间的距离等于或小于颗粒在至少一个方向上的平均直径。

公开(公告)号：US20160057855A1

公开(公告)日：2016-02-25

申请号：US14784754

申请日：2014-04-11

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Peter Riel

IPC: H05K1/02 ,  H05K1/03 ,  B23K35/02 ,  H05K3/30 ,  H05K3/34 ,  B23K1/008 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0272 ,  B23K1/0016 ,  B23K1/008 ,  B23K35/025 ,  H05K1/0269 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3431 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10121 ,  H05K2203/0445 ,  H05K2203/048 ,  H05K2203/0571 ,  H05K2203/166 ,  Y02P70/611 ,  Y02P70/613

Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.

Abstract translation: 在要放置部件的区域中的PCB基板的导电层的表面中设置一个或多个通道。 这些通道可以帮助减少或防止回流焊接过程中部件在通道中的焊膏材料的表面张力/毛细管力的移动。 这样的通道也可以例如由图像处理系统使用，以促进部件的精确定位和/或对准。 图像处理系统可以单独使用通道的位置，或者与诸如焊接掩模或其它对准标记的其它特征组合，以高精度地定位和/或对齐部件。

公开(公告)号：US20160005683A1

公开(公告)日：2016-01-07

申请号：US14748970

申请日：2015-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hai LIU

IPC: H01L23/498

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15323 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/244 ,  H05K3/46 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A printed circuit board for a semiconductor package including a printed circuit board body, a plurality of ball lands on one surface of the printed circuit board body, a first plating layer on a portion of each of the ball lands, and a second plating layer on another portion of each of the ball lands may be provided. An upper surface of the first plating layer may be coplanar with an upper surface of the second plating layer.

Abstract translation: 一种用于半导体封装的印刷电路板，包括印刷电路板主体，印刷电路板主体的一个表面上的多个球形区域，每个球场的一部分上的第一镀层和第二镀层 可以设置每个球场的另一部分。 第一镀层的上表面可以与第二镀层的上表面共面。

公开(公告)号：US09147796B2

公开(公告)日：2015-09-29

申请号：US14618955

申请日：2015-02-10

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Chih-Chen Lai

IPC: H01L33/48 ,  H01L33/00

CPC classification number: H01L33/005 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10984 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method for manufacturing an SMT LED device includes steps: providing an LED with two solder slugs extending downwardly from a bottom thereof; providing a circuit board with two first solder pads spaced from each other thereon, the first solder pads each defining a positioning hole therein corresponding to a position of each of the two solder slugs, forming a pair of second solder pads on the circuit board by directly and physically contacting with the circuit board; putting the solder slugs into the positioning holes; subjecting the circuit board and the LED to a reflow soldering, during which the solder slugs are first melted and then solidified to electrically and mechanically connect with the first and second solder pads thereby connecting the LED and the circuit board together.

Abstract translation: 一种用于制造SMT LED器件的方法包括以下步骤：向LED提供从其底部向下延伸的两个焊料块; 为电路板提供彼此间隔开的两个第一焊盘，所述第一焊盘各自在其中限定对应于两个焊料块中的每一个的位置的定位孔，通过直接在电路板上形成一对第二焊盘 并与电路板物理接触; 将焊料块塞入定位孔; 使电路板和LED经受回流焊接，在此期间焊料块首先熔化然后固化以与第一和第二焊盘电连接和机械连接，从而将LED和电路板连接在一起。

公开(公告)号：US20150155429A1

公开(公告)日：2015-06-04

申请号：US14618955

申请日：2015-02-10

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： CHIH-CHEN LAI

IPC: H01L33/00 ,  H01L33/48

CPC classification number: H01L33/005 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10984 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method for manufacturing an SMT LED device includes steps: providing an LED with two solder slugs extending downwardly from a bottom thereof; providing a circuit board with two first solder pads spaced from each other thereon, the first solder pads each defining a positioning hole therein corresponding to a position of each of the two solder slugs, forming a pair of second solder pads on the circuit board by directly and physically contacting with the circuit board; putting the solder slugs into the positioning holes; subjecting the circuit board and the LED to a reflow soldering, during which the solder slugs are first melted and then solidified to electrically and mechanically connect with the first and second solder pads thereby connecting the LED and the circuit board together.

Abstract translation: 一种用于制造SMT LED器件的方法包括以下步骤：向LED提供从其底部向下延伸的两个焊料块; 为电路板提供彼此间隔开的两个第一焊盘，所述第一焊盘各自在其中限定对应于两个焊料块中的每一个的位置的定位孔，通过直接在电路板上形成一对第二焊盘 并与电路板物理接触; 将焊料块塞入定位孔; 使电路板和LED经受回流焊接，在此期间焊料块首先熔化然后固化以与第一和第二焊盘电连接和机械连接，从而将LED和电路板连接在一起。

公开(公告)号：US08913401B2

公开(公告)日：2014-12-16

申请号：US13922349

申请日：2013-06-20

Applicant: Fuji Xerox Co., Ltd.

Inventor： Daisuke Iguchi

IPC: H05K1/11 ,  H05K7/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K1/0243 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/162 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09345 ,  H05K2201/09663

Abstract: A multilayer wiring board includes a signal electrode, a first power supply electrode, and a ground electrode, which are connected to a first element that outputs a signal, an electrode connected to a second element that receives the signal, a ground layer that serves as a return path for a return current of the signal, a first power supply layer that is disposed adjacent to the ground layer with a dielectric layer interposed therebetween and supplies electric power to the first element, and a second power supply layer that is provided independently of the first power supply layer and supplies electric power to the second element. The first power supply layer causes the return current to return to the first element through the first power supply electrode as a displacement current between the ground layer and the first power supply layer.

Abstract translation: 多层布线板包括信号电极，第一电源电极和接地电极，它们连接到输出信号的第一元件，连接到接收信号的第二元件的电极，用作 用于所述信号的返回电流的返回路径，与所述接地层相邻设置有电介质层并且向所述第一元件提供电力的第一电源层和与所述第一电源层独立地设置的第二电源层， 第一电源层并且向第二元件供电。 第一电源层使返回电流通过第一电源电极返回到第一元件，作为接地层和第一电源层之间的位移电流。