公开(公告)号：US20180083253A1

公开(公告)日：2018-03-22

申请号：US15814136

申请日：2017-11-15

Applicant: Johnson Controls Technology Company

Inventor： Ronald J. Dulle

IPC: H01M2/22 ,  H05K3/32 ,  H01M10/6551 ,  H02J7/00 ,  H01M10/48 ,  H01M10/42 ,  H01M10/058 ,  H01M10/04 ,  H01M2/34 ,  H01M2/30 ,  H01M2/24 ,  H01M2/20 ,  H01M2/12 ,  H01M2/10 ,  H01H47/32 ,  G01R31/36 ,  B60R16/033 ,  B60R16/03 ,  B60L15/20 ,  B60L11/18 ,  B60L11/14 ,  B60L11/12 ,  B60L3/12 ,  B60L3/00 ,  B60L1/14 ,  B60L1/02 ,  B60L1/00 ,  H05K1/18 ,  H05K1/02 ,  H02H7/18 ,  H01R12/71 ,  H01M4/66 ,  H01M2/32 ,  G01R31/02

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L15/20 ,  B60L50/16 ,  B60L50/51 ,  B60L50/61 ,  B60L50/64 ,  B60L50/66 ,  B60L58/12 ,  B60L58/21 ,  B60L58/26 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/3835 ,  G01R31/385 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7011 ,  Y02T10/7016 ,  Y02T10/7022 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A battery module may include a housing, a plurality of battery cells disposed in the housing, a battery terminal extending from the battery module for coupling the battery module with electrical components in the vehicle, and a contactor. A voltage supplied to a relay coil in the contactor may generate a magnetic field to actuate a contactor switch. The battery module may also include a printed circuit board (PCB) disposed in the housing. The PCB may include a relay control circuit configured to control a current flowing across the relay coil, and the relay control circuit may operate in a pull-in mode to transition the contactor switch into a closed position and in a hold mode to maintain the contactor switch in the closed position.

公开(公告)号：US09922762B2

公开(公告)日：2018-03-20

申请号：US14657813

申请日：2015-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon Kim ,  Byeong Cheol Moon ,  Myeong Gi Kim ,  Jin Woo Han ,  Soo Hwan Son

IPC: H01G4/40 ,  H01F27/28 ,  H01F27/29 ,  H05K3/34

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0026 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01G4/40 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1053 ,  Y02P70/613

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

公开(公告)号：US09831482B2

公开(公告)日：2017-11-28

申请号：US14231246

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Mikhail S. Balk ,  Richard M. DeKeuster ,  Stephen D. Cash

IPC: H01M2/10 ,  H01M2/22 ,  B60R16/03 ,  H02J7/00 ,  G01R31/36 ,  H01M10/04 ,  H01M10/058 ,  H01M2/12 ,  H01M2/24 ,  H01M2/20 ,  H01M2/34 ,  H01H47/32 ,  H01M10/48 ,  H05K1/18 ,  H05K3/32 ,  B60L11/18 ,  H01M2/30 ,  H01M10/6551 ,  B60L1/00 ,  B60L1/02 ,  B60L1/14 ,  B60L3/00 ,  B60L3/12 ,  B60L11/12 ,  B60L11/14 ,  B60L15/20 ,  B60R16/033 ,  H01M10/42 ,  H01R12/71 ,  H05K1/02 ,  H02H7/18 ,  G01R31/02 ,  H01M2/32 ,  H01M4/66

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A system includes a lid disposed over battery cells in a battery module. The lid includes flexible fingers, and each of the flexible fingers aligns with a corresponding one of the battery cells. Each of the flexible fingers is configured to exert a downward force against the corresponding one of the battery cells, and the flexible fingers are configured to accommodate varying heights of the battery cells.

公开(公告)号：US20170288564A1

公开(公告)日：2017-10-05

申请号：US15467218

申请日：2017-03-23

Applicant: Keihin Corporation

Inventor： Takashi Ishii ,  Shinya Saito

IPC: H02M7/00 ,  H02M7/537 ,  H05K1/18 ,  H01L21/48 ,  H01L23/373 ,  H01L23/495 ,  H01L23/00 ,  H02P27/06 ,  H05K3/34

CPC classification number: H02M7/003 ,  H01L21/4825 ,  H01L21/4853 ,  H01L23/053 ,  H01L23/3735 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49811 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/40 ,  H01L2224/83815 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/1425 ,  H01L2924/19107 ,  H01L2924/37001 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/1053

Abstract: A second lead frame is set onto a conductive layer and a busbar. The second lead frame has holes previously formed at opposite ends thereof, and pieces of solder material or solder pieces are inserted into the holes. Then, the solder pieces are vibrated by an ultrasonically vibrating tool, whereby the solder pieces are melted without having a high temperature. The second lead frame is thus bonded to the conductive layer and the busbar. A semiconductor element and the busbar are connected by a first lead frame and the second lead frame. The connection structure thereof is such that the second lead frame to be bonded by ultrasonic bonding or other bonding methods is not directly in contact with the semiconductor element, which eliminates the risk of damage to the semiconductor element.

公开(公告)号：US09743519B2

公开(公告)日：2017-08-22

申请号：US14883792

申请日：2015-10-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyofumi Takai ,  Hidenori Obiya ,  Shinya Hitomi

IPC: H05K1/18 ,  H05K1/14 ,  H01L23/12 ,  H01L23/13 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H01L23/552 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01L23/24

CPC classification number: H05K1/147 ,  H01L23/12 ,  H01L23/13 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/552 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/042 ,  H05K2201/10007 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A filter circuit component includes desired frequency characteristics without being influenced by a parasitic inductance and a parasitic capacitance, and since the ground terminal of the filter circuit component connected to the mounting electrode of the high-frequency component is connected to the ground electrode of the high-frequency component through the via conductors of the high-frequency component at the shortest distance, the packing density of the filter circuit component is significantly increased and the occurrence of an unnecessary parasitic inductance and an unnecessary parasitic capacitance is prevented. The filter circuit component is mounted on the high-frequency component to obtain the desired frequency characteristics without the influence of a parasitic inductance and a parasitic capacitance. Since the component is located in a space surrounded by the inner peripheral surface of the supporting frame body, the packing density of components mounted on the high-frequency component is increased.

公开(公告)号：US09716060B2

公开(公告)日：2017-07-25

申请号：US14692769

申请日：2015-04-22

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shih-Chao Chiu ,  Chun-Hsien Lin ,  Yu-Cheng Pai ,  Wei-Chung Hsiao ,  Ming-Chen Sun ,  Tzu-Chieh Shen ,  Chia-Cheng Chen

IPC: H01L23/498 ,  H05K3/00 ,  H05K3/32 ,  H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H05K1/02 ,  H05K3/10 ,  H05K3/46 ,  H01L23/31 ,  H01L21/683

CPC classification number: H01L23/49838 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/189 ,  H05K3/0026 ,  H05K3/007 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives.

公开(公告)号：US09648746B2

公开(公告)日：2017-05-09

申请号：US14663445

申请日：2015-03-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Sang Soo Park

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0233 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is provided a composite electronic component and a board having the same, and the composite electronic component may include: an interposer board, and first and second electronic components mounted on upper and lower surfaces of the interposer board, respectively, and first and second electronic components are electrically connected to each other by an electrical connection part provided on the interposer board.

公开(公告)号：US09607935B2

公开(公告)日：2017-03-28

申请号：US12427133

申请日：2009-04-21

Applicant: Liane Martinez ,  Neil McLellan ,  Silqun Leung ,  Gabriel Wong

Inventor： Liane Martinez ,  Neil McLellan ,  Silqun Leung ,  Gabriel Wong

IPC: H05K7/00 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L23/50 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/0562 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/145 ,  H05K3/3442 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00014

Abstract: Various semiconductor chip packages with undermounted passive devices and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a first side of a carrier substrate where the carrier substrate includes a second side opposite the first side. At least one passive device is coupled to the second side of the carrier substrate. The at least one passive device includes at least one first terminal electrically coupled to the semiconductor chip and at least one second terminal adapted to couple to a printed circuit board.

公开(公告)号：US09559047B2

公开(公告)日：2017-01-31

申请号：US13654447

申请日：2012-10-18

Applicant: Infineon Technologies Austria AG

Inventor： Martin Standing ,  Milko Paolucci

IPC: H01L21/50 ,  H01L23/498 ,  H01L23/367 ,  H01L25/16 ,  H05K1/02 ,  H01L23/36 ,  H05K1/18

CPC classification number: H01L23/49822 ,  H01L23/36 ,  H01L23/367 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.

Abstract translation: 器件和技术的代表性实现提供了设置在分层印刷电路板（PCB）内的芯片芯片的改进的热性能。 无源元件可以策略地位于PCB的一个或多个表面上。 无源部件可以被布置成将由芯片管芯产生的热量从芯片管芯移出。

公开(公告)号：US09485878B2

公开(公告)日：2016-11-01

申请号：US13956293

申请日：2013-07-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Soo Lee

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K3/4697 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/181 ,  H05K1/185 ,  H05K3/3436 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.

Abstract translation: 本发明涉及具有电子部件的基板结构体和具有电子部件的基板结构体的制造方法，能够通过将第一电子部件的第一端子和第二端子的第二端子 第二电子部件彼此直接接触或通过焊料彼此直接接触，以使电子部件之间的路径最小化。