公开(公告)号：US12154702B1

公开(公告)日：2024-11-26

申请号：US16653228

申请日：2019-10-15

Applicant: Ampcera Inc.

Inventor： James Emery Brown ,  Hui Du ,  Chen Chen ,  Sumin Zhu

IPC: B05D1/00 ,  H01B1/12 ,  H01B13/00 ,  H01B13/30 ,  B05D1/18

Abstract: A method for manufacturing a freestanding solid state ionic conductive membrane includes forming a solid state ionic conductive membrane on a removable support substrate and removing the removable support substrate to provide the freestanding solid state ionic conductive membrane.

公开(公告)号：US12145172B2

公开(公告)日：2024-11-19

申请号：US17989718

申请日：2022-11-18

Applicant: Zhejiang Deyan New Materials Technology Co. Ltd.

Inventor： Congwu Ling ,  Yanqing Zhu ,  Chen Ling ,  Hongjin Zhang

IPC: A41D19/04 ,  B05D1/00 ,  B05D1/02 ,  B05D7/02 ,  B05D3/02

Abstract: The present disclosure relates to a manufacturing process of a silicone glove, the silicon glove is divided into a liner, a glove blank and a silicon layer from the inside to the outside, and liquid silicon is sprayed on a surface of the glove blank for once; when spraying the liquid silicon, the glove blank also rotates around its axis while horizontally moving on an assembly line; during spraying, a liquid silicon outflow channel at least includes a finger gap spraying port and a tiger mouth spraying port that are arranged fixedly; an arranging length of the finger gap spraying port is greater than or equal to a length of a finger area of the glove blank; an arranging length of the tiger mouth spraying port is greater than or equal to a length of a tiger mouth area of the glove blank.

公开(公告)号：US20240351020A1

公开(公告)日：2024-10-24

申请号：US18581696

申请日：2024-02-20

Applicant: Wisconsin Alumni Research Foundation

Inventor： Chao Li ,  Jiaquan Yu ,  Theodorus Evan de Groot ,  David James Beebe

IPC: B01L3/00 ,  B05D1/00 ,  B05D5/08

CPC classification number: B01L3/502 ,  B05D1/60 ,  B05D5/08 ,  B01L2300/166

Abstract: Systems, methods, compositions of matter, and kits for undermedia repellency are disclosed. In some cases, these involve a first volume of a first liquid presented in a second volume of a second liquid above a first location of a first surface. The first liquid, second liquid, and first location can have properties sufficient to give rise to undermedia perfect liquid repellency.

公开(公告)号：US12116466B2

公开(公告)日：2024-10-15

申请号：US17605095

申请日：2020-04-22

Applicant: NIKON-ESSILOR CO., LTD. ,  SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Katsuyoshi Takeshita ,  Hideyuki Wakiyasu ,  Tomohiro Ito ,  Tomonori Miyamoto ,  Masayoshi Tokuda

IPC: C08J7/04 ,  B05D1/00 ,  B05D3/10 ,  B05D5/08 ,  C03C17/34 ,  C09D183/04 ,  G02B1/111 ,  G02B1/14 ,  G02B1/18

CPC classification number: C08J7/042 ,  B05D1/60 ,  B05D3/10 ,  B05D5/086 ,  C03C17/3405 ,  C09D183/04 ,  G02B1/111 ,  G02B1/14 ,  G02B1/18 ,  B05D2203/35 ,  B05D2506/10 ,  B05D2518/10 ,  C03C2217/73

Abstract: An object of the present invention is to provide a laminate which has a substrate, an intermediate layer, and a water-repellent layer laminated in this order, and has excellent abrasion resistance. The present invention is a laminate comprising: a substrate (s) having an anti-reflection layer; an intermediate layer (c) placed on the anti-reflection layer side of the substrate; and a water-repellent layer (r), in this order, wherein the intermediate layer (c) is a cured layer of a mixture composition (cc) of an organosilicon compound (C), or a vapor deposition layer of the organosilicon compound (C), the organosilicon compound (C) contains a silicon atom together with an amino group and/or an amine skeleton, the water-repellent layer (r) is a cured layer of a mixture composition (ca) of an organosilicon compound (A) in which a monovalent group having a perfluoropolyether structure is bound to a silicon atom through a linking group or without a linking group located therebetween, and a hydrolyzable group is bound to the silicon atom through a linking group or without a linking group located therebetween, and the laminate satisfies the following requirement (1),



(1) a water sliding angle is not larger than 50° after a abrasion resistance test in which a 200 g load per 1.5 cm×1.5 cm area is applied to a surface on the water-repellent layer (r) side of the laminate and the surface is rubbed 20,000 times.

公开(公告)号：US12110418B2

公开(公告)日：2024-10-08

申请号：US17289322

申请日：2019-11-12

Applicant: LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST)

Inventor： Nicolas Boscher ,  Giuseppe Bengasi ,  Kamal Baba

IPC: C09D5/24 ,  B05D1/00 ,  C09D165/00 ,  H01B1/12 ,  H10K85/10

CPC classification number: C09D5/24 ,  B05D1/60 ,  C09D165/00 ,  H01B1/128 ,  H10K85/111

Abstract: A conductive coating comprising polymers of meso-meso, β-β doubly linked fused and/or meso-β, β-meso doubly linked fused and/or meso-meso, β-β, β-βtriply linked fused (poly)porphyrins. A method for forming on a substrate a thin conductive coating of polymers of meso-meso, β-β doubly and/or meso-β, β-meso doubly and/or meso- meso, β-β, β-β triply linked fused (poly)porphyrins, the method comprising the steps of providing a substrate in a vacuum chamber, performing on the substrate an oxidative chemical vapour deposition reaction with an oxidant and at least one porphyrin monomer.

公开(公告)号：US20240326087A1

公开(公告)日：2024-10-03

申请号：US18620152

申请日：2024-03-28

Applicant: COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Pierre MONTMEAT ,  Franck FOURNEL ,  Thierry ENOT

IPC: B05D1/00 ,  B05D3/02

CPC classification number: B05D1/005 ,  B05D3/0254 ,  B05D2203/30

Abstract: A method for rectifying a polymer film including the steps of: a) providing a first substrate including a front surface, the front surface having a surface energy less than approximately 22 mJ/m2, b) spreading a thermoplastic polymer on the front surface leading to the formation of a polymer film and at least one dewetted zone of the front surface, c) providing a second substrate including a non-stick surface, d) bonding the polymer film and the non-stick surface leading to the formation of a bonding interface having an adhesion energy lower than the adhesion energy between the polymer film and the front surface, e) applying a creep treatment so that the at least one dewetted zone of the front surface is covered by creep of the polymer film, and f) disassembly at the bonding interface so as to obtain the front surface completely covered by the rectified polymer film.

公开(公告)号：US12099294B2

公开(公告)日：2024-09-24

申请号：US16650510

申请日：2018-09-28

Applicant: University of Massachusetts

Inventor： James J. Watkins ,  Irene R. Howell

IPC: G03F7/00 ,  B05D1/00 ,  C23C16/04 ,  C23C16/40 ,  C23C16/455

CPC classification number: G03F7/0002 ,  B05D1/005 ,  C23C16/045 ,  C23C16/405 ,  C23C16/45525

Abstract: Various embodiments disclosed relate to methods of manufacturing textured surfaces nanoimprint lithography with nanoparticulate inks. The present invention provides methods that allow flexible patterning of substrates with features having complex geometries.

公开(公告)号：US20240307914A1

公开(公告)日：2024-09-19

申请号：US18603922

申请日：2024-03-13

Applicant: FLOSFIA INC.

Inventor： Makoto SHIMIZU ,  Hiroshi SHIHO ,  Hiroyuki ANDO ,  Naoyuki TSUKAMOTO ,  Yuji KATO

IPC: B05D1/00 ,  C09D4/00

CPC classification number: B05D1/60 ,  B05D1/005 ,  C09D4/00 ,  B05D2203/30

Abstract: The present disclosure provides a film formation method having an excellent mass productivity.
The present disclosure provides a film formation method using one aqueous solution or different aqueous solutions containing at least one of a metal complex having two or more different ligands and a metal complex having same ligands and substituents as well as a gallium compound, in which the metal complex having the two or more different ligands has nitrogen atom, and the metal complex having the same ligands and substituents has a halogen atom.

公开(公告)号：US12085903B2

公开(公告)日：2024-09-10

申请号：US17703950

申请日：2022-03-24

Applicant: Subrat Sahu

Inventor： Subrat Sahu

IPC: G05B13/04 ,  B05D1/00 ,  G05B13/02

CPC classification number: G05B13/048 ,  B05D1/00 ,  G05B13/0265 ,  G05B13/042

Abstract: A method, device, and system for configuring a coating machine for coating a surface of a product using a coating substance are provided. The method includes determining a value associated with one or more parameters from a plurality of parameters associated with the coating operation. The method also includes predicting a value associated with at least one attribute associable with the coating substance based on the determined value associated with the one or more parameters using a trained machine learning model. The method includes configuring the coating machine for coating the surface using the coating substance based on the predicted value associated with the at least one attribute associable with the coating substance. The method also includes initiating a coating operation at the configured coating machine for coating the surface of the product using the coating substance.

公开(公告)号：US20240253079A1

公开(公告)日：2024-08-01

申请号：US18633581

申请日：2024-04-12

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Yuji TANAKA ,  Masaya ASAI ,  Masahiko HARUMOTO ,  Koji KANEYAMA

IPC: B05D1/00 ,  B05C11/08 ,  B05C11/10 ,  B05D1/36 ,  B05D3/00 ,  C23F1/00 ,  C23F1/08 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: B05D1/005 ,  B05C11/08 ,  B05C11/10 ,  B05C11/1039 ,  B05D1/36 ,  B05D3/007 ,  C23F1/00 ,  C23F1/08 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67742 ,  H01L21/68707

Abstract: A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.