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公开(公告)号：US09974201B1
公开(公告)日：2018-05-15
申请号：US15337841
申请日：2016-10-28
Applicant: General Electric Company
Inventor： Michael Joseph Schutten , Robert James Thomas , Maja Harfman Todorovic
CPC classification number: H05K5/0247 , H01B17/265 , H01G4/35 , H02M1/44 , H05K1/0243 , H05K1/0296 , H05K1/162 , H05K1/167 , H05K7/1402 , H05K7/1427 , H05K9/0018 , H05K2201/09036 , H05K2201/0999
Abstract: A feedthrough includes a flange comprising an inner cylindrical surface and a planar mounting surface. The inner cylindrical surface defines a cylindrical passage within the flange. The feedthrough further includes a printed circuit board (“PCB”) mounted on the planar mounting surface of the flange, and an electrically conductive element that extends through the cylindrical passage of the flange.
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公开(公告)号：US20180102329A1
公开(公告)日：2018-04-12
申请号：US15831554
申请日：2017-12-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. BUSBY , Silvio DRAGONE , Michael A. GAYNES , Kenneth P. RODBELL , William SANTIAGO-FERNANDEZ
CPC classification number: H01L23/576 , G06F21/87 , H01L21/4803 , H01L23/053 , H01L23/08 , H01L23/573 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/8385 , H01L2924/0665 , H01L2924/1434 , H01L2924/15192 , H01L2924/16251 , H01L2924/16588 , H05K1/0275 , H05K1/0284 , H05K1/0306 , H05K1/181 , H05K3/303 , H05K3/46 , H05K2201/09036 , H05K2201/0999 , H05K2201/10159 , H05K2201/10371
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).
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公开(公告)号：US20180070435A1
公开(公告)日：2018-03-08
申请号：US15806456
申请日：2017-11-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirofumi SHINAGAWA , Shigeru TAGO
CPC classification number: H05K1/025 , H05K1/0216 , H05K1/0219 , H05K1/0225 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/0313 , H05K1/0393 , H05K1/115 , H05K3/4632 , H05K3/4635 , H05K3/4685 , H05K2201/0129 , H05K2201/0141 , H05K2201/09036 , H05K2203/063
Abstract: A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.
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24.发明申请公开(公告)号：US20180065202A1
公开(公告)日：2018-03-08
申请号：US15259921
申请日：2016-09-08
Applicant: Raytheon Company
Inventor： Matthew H. Summers , Jeremy C. Danforth , David G. Garrett , Dmitry V. Knyazev , Stephen M. Baggs , Gaines S. Gibson
CPC classification number: B23K1/0016 , B23K35/0244 , B23K2101/36 , B33Y10/00 , B33Y80/00 , F42B10/661 , H01R4/02 , H01R4/027 , H01R12/51 , H01R12/57 , H01R13/6658 , H01R43/02 , H05K1/0272 , H05K3/3494 , H05K2201/09036 , H05K2203/081
Abstract: A method of making an electrical connection includes soldering using channels in a receptacle to direct hot air (or another hot gas) to effect soldering where the electrical connection is to be made. The connection may be made between device electrical contacts of an electrical device, and other contacts, such as receptacle contacts of the receptacle. The connection may be a blind connection, one in which the connected ends of the contacts are hidden or unable to be directly physically accessed, when the connection is made. The electrical connection may be made between device contacts of an electrical device that is inserted into the receptacle, and receptacle electrical contacts that are part of the receptacle. The channels for directing the hot gas to where the soldering occurs may be parts of the receptacle, for example being produced during additive manufacture of the receptacle.
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公开(公告)号：US09888583B2
公开(公告)日：2018-02-06
申请号：US14815413
申请日：2015-07-31
Applicant: MINEBEA CO., LTD.
Inventor： Dohaku Inamori , Takashi Kashino
CPC classification number: H05K1/118 , H05K1/0393 , H05K1/113 , H05K1/116 , H05K1/147 , H05K3/363 , H05K2201/09036 , H05K2201/0969 , H05K2201/09745 , H05K2203/1178
Abstract: There is provided a flexible printed circuit board. The flexible printed circuit board includes: a flexible insulation layer having a first surface and a second surface; a first land which is conductive and which is provided on the first surface of the flexible insulation layer; and a conductive member which is provided on the second surface of the flexible insulation layer. A recess is formed on the first land.
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Patent Agency Ranking
公开(公告)号：US09883578B1
公开(公告)日：2018-01-30
申请号：US15386234
申请日：2016-12-21
Applicant: Deere & Company
Inventor： Thomas J. Roan , Brij N. Singh
IPC: H05K1/02
CPC classification number: H05K1/0201 , H05K1/0209 , H05K1/0272 , H05K2201/06 , H05K2201/064 , H05K2201/09036
Abstract: An electrical assembly comprises a dielectric substrate and a metallic conductive trace overlying the substrate. The metallic conductive trace has a hollow cross-section that forms a duct. An annular member protrudes from the metallic conductive trace. The annular member has an opening in communication with the duct, the opening for receiving pressurized air or gas.
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27.发明申请公开(公告)号：US20180007796A1
公开(公告)日：2018-01-04
申请号：US15201323
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： John J. BROWNE , Andrew MACLEAN , Shawna M. LIFF
IPC: H05K3/34
CPC classification number: H05K3/34 , G06F13/00 , H05K1/0293 , H05K1/141 , H05K2201/0305 , H05K2201/042 , H05K2201/09036 , H05K2201/10181 , H05K2201/10189 , H05K2201/10212 , H05K2203/1115 , H05K2203/173
Abstract: Techniques and mechanisms for controlling configurable circuitry including an antifuse. In an embodiment, the antifuse is disposed in or on a substrate, the antifuse configured to form a solder joint to facilitate interconnection of circuit components. Control circuitry to operate with the antifuse is disposed in, or at a side of, the same substrate. The antifuse is activated based on a voltage provided at an input node, where the control circuitry automatically transitions through a pre-determined sequence of states in response to the voltage. The pre-determined sequence of states coordinates activation of one or more fuses and switched coupling one or more circuit components to the antifuse. In another embodiment, multiple antifuses, variously disposed in or on the substrate, are configured each to be activated based on the voltage provided at an input node.
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公开(公告)号：US20170359906A1
公开(公告)日：2017-12-14
申请号：US15614618
申请日：2017-06-06
Applicant: NIHON DEMPA KOGYO CO., LTD.
Inventor： Tomoyuki HOSODA , Junichi ARAI
IPC: H05K3/34 , H03B5/32 , H03H3/02 , H03H9/02 , H01L23/049
CPC classification number: H05K3/3442 , H01L23/049 , H03B5/32 , H03H3/02 , H03H9/02 , H03H9/0538 , H05K1/144 , H05K2201/042 , H05K2201/09036 , H05K2201/09472 , H05K2201/10068 , H05K2201/10075 , H05K2201/10303 , H05K2201/10318
Abstract: An electronic device includes a first board, a second board, and support pillars. The support pillars hold the first board and the second board mutually separated. The first board has a first surface on which an electronic component is mounted. The first board has a second surface that includes depressed portions into which the support pillars extending from the second board are inserted.
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公开(公告)号：US09839138B2
公开(公告)日：2017-12-05
申请号：US14481273
申请日：2014-09-09
Applicant: Inktec Co., Ltd.
Inventor： Kwang Choon Chung , Ji Hoon Yoo , Su-Han Kim , Byung Hun Kim
CPC classification number: H05K3/1258 , C23C18/165 , C23C18/1868 , C23C18/204 , H05K1/092 , H05K1/097 , H05K3/0026 , H05K3/107 , H05K3/245 , H05K2201/0112 , H05K2201/0376 , H05K2201/09036 , H05K2203/0568 , H05K2203/072 , H05K2203/0723 , H05K2203/1126
Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
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公开(公告)号：US20170347453A1
公开(公告)日：2017-11-30
申请号：US15336904
申请日：2016-10-28
Applicant: FUJI XEROX CO., LTD.
Inventor： Shigemi OHTSU
CPC classification number: H05K1/144 , H05K1/028 , H05K1/111 , H05K1/117 , H05K3/243 , H05K3/363 , H05K2201/0154 , H05K2201/068 , H05K2201/09036 , H05K2201/09172 , H05K2201/09781 , H05K2201/10977
Abstract: Provided is a wiring board including a substrate formed of an insulation material, and plural conductive patterns including plural electrodes arranged on a surface of the substrate along an end surface of the substrate, and plural wiring patterns connected to the plural electrodes, respectively, wherein the substrate includes a notch formed between electrode groups each of which includes a predetermined number of the electrodes.
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