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公开(公告)号：US20180279514A1
公开(公告)日：2018-09-27
申请号：US15920989
申请日：2018-03-14
Applicant: Japan Display Inc.
Inventor： Masanori MAEMUKO
CPC classification number: H05K9/0026 , G02B6/0088 , G02F1/133308 , G02F2001/133314 , G02F2001/133334 , H01L51/5237 , H01R4/34 , H05K1/0215 , H05K1/117 , H05K1/147 , H05K9/0054 , H05K9/0058 , H05K2201/09063 , H05K2201/0999 , H05K2201/10128 , H05K2201/10136 , H05K2201/10371 , H05K2201/10409
Abstract: According to an aspect, a display device includes: a display panel; a housing; a printed circuit board; a boss that penetrates a first through hole in the printed circuit board and protrudes from a surface of the housing, the surface being attached to the printed circuit board; a shield cover; and a male screw. The shield cover includes: a top plate; side plates; and a contact piece formed by folding a part of one of the side plates inward and including a protrusion in contact with a ground pattern of the printed circuit board and a claw facing the top plate. The protrusion causes the claw to protrude toward the printed circuit board. The male screw is fastened to the boss from the outside of the top plate.
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公开(公告)号：US20180270997A1
公开(公告)日：2018-09-20
申请号：US15919257
申请日：2018-03-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chang Joon LEE , Yong Won LEE , Hyun Tae JANG
CPC classification number: H05K9/0024 , H05K1/0216 , H05K1/0243 , H05K1/111 , H05K1/181 , H05K9/0028 , H05K9/0033 , H05K2201/10159 , H05K2201/10371 , H05K2201/10545 , H05K2201/1056
Abstract: An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.
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23.发明申请公开(公告)号：US20180220525A1
公开(公告)日：2018-08-02
申请号：US15935899
申请日：2018-03-26
Applicant: Apple Inc.
Inventor： Yanfeng CHEN , Shankar S. PENNATHUR
CPC classification number: H05K1/0216 , H01L2924/3025 , H05K1/0218 , H05K1/18 , H05K3/284 , H05K3/30 , H05K9/00 , H05K9/0081 , H05K2201/09972 , H05K2201/10371 , H05K2203/1322 , Y10T29/49146
Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.
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公开(公告)号：US20180182723A1
公开(公告)日：2018-06-28
申请号：US15888632
申请日：2018-02-05
Applicant: Keyssa Systems, Inc.
Inventor： Mostafa Naguib Abdulla , Mohamed Sameh Mahmoud , Alan Besel , Eric Sweetman , Bojana Zivanoic , Giriraj Mantrawadi
CPC classification number: H01L23/64 , H01L24/00 , H01L2224/48091 , H01L2924/181 , H04B15/00 , H05K1/0216 , H05K1/181 , H05K9/006 , H05K2201/10371 , H01L2924/00014 , H01L2924/00012
Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.
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公开(公告)号：US09943018B2
公开(公告)日：2018-04-10
申请号：US15045841
申请日：2016-02-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Sik Park , Seung-Ki Choi , Joon Heo , Hyun-Ju Hong
CPC classification number: H05K9/002 , H01L2224/16225 , H05K1/0218 , H05K1/0259 , H05K5/0004 , H05K5/0017 , H05K9/0024 , H05K9/0039 , H05K2201/0919 , H05K2201/09354 , H05K2201/10371
Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.
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Patent Agency Ranking
公开(公告)号：US20180082556A1
公开(公告)日：2018-03-22
申请号：US15268959
申请日：2016-09-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Silvio DRAGONE , Stefano S. OGGIONI , William SANTIAGO-FERNANDEZ
CPC classification number: G08B13/2434 , G06F21/86 , G08B13/128 , G08B13/244 , H05K1/0275 , H05K1/185 , H05K5/0208 , H05K2201/10151 , H05K2201/10371
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, a tamper-detect sensor, a monitor, and a sensor connection adapter. The enclosure encloses, at least in part, one or more electronic components to be protected, and the tamper-detect sensor is disposed over an inner surface of the enclosure to facilitate defining a secure volume about the electronic component(s). The tamper-detect sensor includes sensor lines disposed over the inner surface of the enclosure, and the monitor monitors the tamper-detect sensor for a tamper event. The sensor connection adapter is coupled to the inner surface of the enclosure, and is disposed over the tamper-detect sensor within the secure volume. The sensor connection adapter facilitates electrically connecting the monitor to the sensor lines of the tamper-detect sensor.
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公开(公告)号：US20180042148A1
公开(公告)日：2018-02-08
申请号：US15663098
申请日：2017-07-28
Applicant: Sony Interactive Entertainment Inc.
Inventor： Ichiro Sasaki , Keiichi Aoki
CPC classification number: H05K9/0024 , H05K1/181 , H05K5/0247 , H05K2201/10356 , H05K2201/10371 , H05K2201/10393 , H05K2201/10409
Abstract: An electronic apparatus includes a support member, and a cable mounted on the support member. The support member includes a first clamp portion and a second clamp portion mounting the cable on the support member. The first clamp portion includes a first portion being located at upper side of the cable and restricting upward movement of the cable. The second clamp portion is located on the lower side of the cable. At least part of an upper surface of the second clamp portion is located at a level superior to a lower surface of the first portion of the first clamp portion.
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公开(公告)号：US09888561B2
公开(公告)日：2018-02-06
申请号：US14804486
申请日：2015-07-21
Applicant: Apple Inc.
Inventor： Ryan C. Perkins , Trevor J. Ness , Tyler S. Bushnell , Steven P. Cardinali
IPC: H05K1/16 , H05K1/02 , H01L23/60 , H05K1/18 , H05K7/00 , H05K9/00 , H01L31/048 , H01L23/00 , H01L23/28 , H05K1/14 , H05K3/28
CPC classification number: H05K1/0218 , H01L23/28 , H01L23/564 , H01L23/60 , H01L31/048 , H01L2224/16225 , H01L2924/181 , H05K1/147 , H05K1/167 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0133 , H05K2201/0707 , H05K2201/10098 , H05K2201/10151 , H05K2201/10371 , H05K2201/10977 , H05K2203/1316 , H01L2924/00012
Abstract: Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered.
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公开(公告)号：US09854678B2
公开(公告)日：2017-12-26
申请号：US15366595
申请日：2016-12-01
Applicant: Samsung Electronics Co., Ltd. , POCONS CO., LTD.
Inventor： Byoung-ryoul Song , Eui-suck Sung
CPC classification number: H05K1/181 , H01R4/48 , H01R13/6594 , H05K1/0215 , H05K3/325 , H05K3/4015 , H05K9/0032 , H05K2201/10189 , H05K2201/10356 , H05K2201/10371 , H05K2201/10393
Abstract: An electronic device is provided which includes a printed circuit board (PCB) including a non-conductive layer that forms at least a portion of a first surface, and a conductive layer arranged between the first surface and a second surface, an electronic component arranged on a first area of the first surface of the PCB, a conductive shield structure arranged on the PCB to cover the first area and the electronic component on the PCB, a support structure connected to the PCB and including a first part that faces a portion of one side of the conductive shield structure, and a cable extending along the one side of the conductive shield structure, inserted between the support structure and the portion of the one side of the conductive shield structure, and including at least one conductive line and an insulation layer that covers the at least one conductive line.
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公开(公告)号：US09854664B2
公开(公告)日：2017-12-26
申请号：US15347228
申请日：2016-11-09
Applicant: Continental Automotive Systems, Inc.
Inventor： Thomas Brey
IPC: H05K7/20 , H05K1/02 , H05K1/18 , H05K5/02 , H01L23/473
CPC classification number: H05K1/023 , H05K1/0203 , H05K1/181 , H05K5/0221 , H05K9/0032 , H05K2201/10371
Abstract: An assembly for providing electromagnetic interference (EMI) shielding and for dissipating heat from electronic components. The assembly including: a metallic frame including a wall extending upwardly from a circuit board; an EMI shield having a top with holes and having sidewalls that surround the top, extend downwardly, and are attachable to the wall of the frame in a first latched position and in a second, un-latched position; a layer of thermally-conductive, viscous heat sink grease on the top of the EMI shield and filling holes in the top of the EMI shield, heat sink grease in the holes being in direct physical contact with the top surface of the at least one electronic component when the EMI shield is in the second, un-latched position; and a heat sink on top of and in direct physical contact with the heat sink grease on top of the EMI shield.
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