公开(公告)号：US3780433A

公开(公告)日：1973-12-25

申请号：US3780433D

申请日：1972-05-01

Applicant: AMP INC

Inventor： LYNCH J

IPC: H01R4/02 ,  H05K3/34 ,  H01R43/00

CPC classification number: H01R12/58 ,  H01R4/02 ,  H05K3/3447 ,  H05K2201/1081 ,  H05K2201/10848 ,  H05K2201/10984 ,  Y10T29/49149

Abstract: A connector post or pin is disclosed which is particularly suitable for use with printed circuit board assemblies. The post includes a coined portion which is designed to permit the pin to be easily inserted into holes of a predetermined size in printed circuit boards, and to increase the quality of a solder joint between the post and the printed circuit board. A solder stripe is placed on each post in the coined region to facilitate soldering of the posts to conductive portions of the printed circuit board. The posts are attached in groups to break-away carrier strips to aid in the rapid assembly of large numbers of posts to printed circuit boards. The posts may also include provisions for coupling them to multilayered printed circuit assemblies. A method of fabricating the coined post is also disclosed which converts a post with normally an interference fit in a printed circuit board aperture to a post which is freely received in the aperture together with masses of solder adhered to said post.

Abstract translation: 公开了一种连接器柱或销，其特别适用于印刷电路板组件。 该柱包括设计成允许销易于插入到印刷电路板中的预定尺寸的孔中的模制部分，并且提高柱和印刷电路板之间的焊接接头的质量。 在打印区域中的每个柱上放置焊料条以便于将柱焊接到印刷电路板的导电部分。 这些柱子分组连接以分离载体条，以帮助将大量柱体快速组装到印刷电路板上。 柱子还可以包括用于将它们耦合到多层印刷电路组件的规定。 还公开了一种制造造型柱的方法，其将通常在印刷电路板孔中的过盈配合的柱转换成自由接收在孔中的柱以及粘附到所述柱的焊料块。

公开(公告)号：US3230612A

公开(公告)日：1966-01-25

申请号：US21576162

申请日：1962-07-23

Applicant: AMP INC

Inventor： POTTER ROSSITER R ,  FULLER GLENWOOD A ,  ROBERT ULLMANN

IPC: H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0426 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/10401 ,  H05K2201/1081 ,  H05K2201/10916 ,  Y10T29/49139 ,  Y10T29/49149 ,  Y10T29/49183

公开(公告)号：US3076164A

公开(公告)日：1963-01-29

申请号：US74183258

申请日：1958-06-13

Applicant: AMP INC

Inventor： ROBERT ULLMAN ,  KINKAID ROBERT J

IPC: H01R12/58 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/58 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4046 ,  H05K2201/10401 ,  H05K2201/1081 ,  H05K2201/10916

公开(公告)号：US09775242B2

公开(公告)日：2017-09-26

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H01L21/60 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L21/48 ,  H05K5/00 ,  H01R13/04 ,  H01L23/498 ,  H05K3/40 ,  H01L23/373 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

公开(公告)号：US09728869B2

公开(公告)日：2017-08-08

申请号：US15124519

申请日：2015-02-25

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/00 ,  H01R12/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01R12/58 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10818

Abstract: The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

公开(公告)号：US09629245B2

公开(公告)日：2017-04-18

申请号：US14405094

申请日：2013-05-23

Applicant: SAGEMCOM BROADBAND SAS

Inventor： Stephane Kohn

IPC: F16B37/06 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

公开(公告)号：US20150282297A1

公开(公告)日：2015-10-01

申请号：US14730720

申请日：2015-06-04

Applicant: Tyco Electronics AMP Korea Ltd.

Inventor： Yang Yun Choi ,  Ok Ky Beak

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0213 ,  H05K1/092 ,  H05K1/116 ,  H05K1/182 ,  H05K3/244 ,  H05K3/325 ,  H05K3/423 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0979 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2203/0723 ,  H05K2203/073

Abstract: A printed circuit board has a substrate having a circuit pattern; a primary component receiving hole positioned on the substrate and having an inner surface electrically connected with the circuit pattern; and at least one secondary component receiving hole positioned on the substrate around the primary component receiving hole, and having an inner surface electrically connected with the circuit pattern and the inner surface of the primary component receiving hole.

Abstract translation: 印刷电路板具有具有电路图案的基板; 主要部件接收孔，其位于所述基板上并且具有与所述电路图案电连接的内表面; 以及至少一个辅助部件容纳孔，位于基体周围的主要部件容纳孔上，并且具有与电路图案和主要部件容纳孔的内表面电连接的内表面。

公开(公告)号：US20150144387A1

公开(公告)日：2015-05-28

申请号：US14407402

申请日：2013-06-09

Applicant: SCHNEIDER TOSHIBA INVERTER EUROPE SAS

Inventor： Jing Chen

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G2/065 ,  H05K1/111 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4015 ,  H05K5/0239 ,  H05K7/1432 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/06 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: An electrical apparatus, comprising a circuit board, and a capacitor installed on the circuit board; the capacitor is detachably installed on the circuit board. The capacitor can be conveniently detached from the circuit board; therefore, a damaged capacitor can be easily replaced with a new capacitor, saving cost by avoiding the problem in the prior art that the entire electrical apparatus is discarded or causes downtime for repairs due to a damaged capacitor.

Abstract translation: 一种电气设备，包括电路板和安装在电路板上的电容器; 电容器可拆卸地安装在电路板上。 电容器可以方便地从电路板上拆下; 因此，可以容易地用新的电容器替换损坏的电容器，通过避免现有技术中的问题，整个电气设备被丢弃或由于损坏的电容器导致维修停机，从而节省成本。

公开(公告)号：US09030840B2

公开(公告)日：2015-05-12

申请号：US13635606

申请日：2011-03-16

Applicant: Michael Heim ,  Sigmund Braun

Inventor： Michael Heim ,  Sigmund Braun

IPC: H05K7/06 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

Abstract: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).

Abstract translation: 本发明涉及一种包括电和/或电子模块（10）和电路载体（12）的装置，其中电和/或电子模块（10）的至少一个电连接线（14）可以容纳在 电路载体（12）的凹部（16）。 该装置包括至少一个夹紧元件（18a，18b，18c，18d），一旦其已经被引入到凹部（16）中就将至少一个连接线（14）固定在凹部（16）中。

公开(公告)号：US08300422B2

公开(公告)日：2012-10-30

申请号：US12762123

申请日：2010-04-16

Applicant: Osamu Nagasaki

Inventor： Osamu Nagasaki

IPC: H05K7/02 ,  H01L41/107

CPC classification number: H05K3/3468 ,  G03G15/80 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/111 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/099 ,  H05K2201/10083 ,  H05K2201/10689 ,  H05K2201/1081 ,  H05K2203/044 ,  H05K2203/046 ,  H01L2924/00

Abstract: An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.

Abstract translation: 电子设备例如包括具有电子部件和压电元件的电路板，向电子部件和压电元件中的至少一个赋予参考电位的基准电位图形以及连接到基准电极的焊接焊盘 潜在的模式。 在电路板上，电子部件在将压电元件和电子部件安装在焊锡焊盘上时位于电路基板的输送方向的下游侧，压电元件位于输送路径的上游侧 方向。