Abstract:
There is provided an electron microscope capable of measuring aberration with high accuracy. The electron microscope (100) comprises: an electron beam source (10) for producing an electron beam (EB); an illumination lens system (101) for focusing the electron beam (EB) onto a sample (S); a scanner (12) for scanning the focused electron beam (EB) over the sample (S); an aperture stop (30) having a plurality of detection angle-limiting holes (32) for extracting rays of the electron beam (EB) having mutually different detection angles from the electron beam (EB) transmitted through the sample (S); and a detector (20) for detecting the rays of the electron beam (EB) passed through the aperture stop (30).
Abstract:
Methods and systems for temporal compressive sensing are disclosed, where within each of one or more sensor array data acquisition periods, one or more sensor array measurement datasets comprising distinct linear combinations of time slice data are acquired, and where mathematical reconstruction allows for calculation of accurate representations of the individual time slice datasets.
Abstract:
A scanning electron microscopy system for mitigating charging artifacts includes a scanning electron microscopy sub-system for acquiring multiple images from a sample. The images include one or more sets of complementary images. The one or more sets of complementary images include a first image acquired along a first scan direction and a second image acquired along a second scan direction opposite to the first scan direction. The system includes a controller communicatively coupled to the scanning electron microscopy sub-system. The controller is configured to receive images of the sample from the scanning electron microscopy sub-system. The controller is further configured to generate a composite image by combining the one or more sets of complementary images.
Abstract:
A method of using a Charged Particle Microscope comprising: A specimen holder, connected to a positioning stage, for holding a specimen; A source, for producing a beam of charged particles; An illuminator, for directing said beam so as to irradiate the specimen; A detector, for detecting a flux of radiation emanating from the specimen in response to said irradiation, comprising the following steps: Providing the microscope with an interferential optical position sensor for determining a position of said specimen holder relative to a reference; Providing an automatic controller with a time-dependent position signal from said optical position sensor; Invoking said controller to use said signal to produce a vibration profile for the microscope.
Abstract:
A method, computer product and system for optimization of configurable parameters of inspection tools are provided. The method includes applying a heuristic that utilizes a prioritized sequence of selections of configurable parameters. For each configuration setting of the heuristic the method includes providing a set of local scan images of a list of DOIs, calculating an optimization target function and updating the configuration settings with the best value of each scanned parameter according to said prioritization heuristic. The method includes outputting the one or more updated configuration settings to a recipe file.
Abstract:
This invention provides a system and a method for calibrating charge-regulation module in vacuum environment. Means for mounting the charge-regulation module provides motions to the charge-regulation module such that a beam spot, illuminated by the charge-regulation module, on a sample surface can be moved to a pre-determined position which is irradiated by a charged particle beam.
Abstract:
This invention provides a system and a method for calibrating charge-regulation module in vacuum environment. Means for mounting the charge-regulation module provides motions to the charge-regulation module such that a beam spot, illuminated by the charge-regulation module, on a sample surface can be moved to a pre-determined position which is irradiated by a charged particle beam.
Abstract:
An object of the present invention is to provide a method and an apparatus capable of measuring a potential of a sample surface by using a charged particle beam, or of detecting a compensation value of a variation in an apparatus condition which changes due to sample charging, by measuring a sample potential caused by irradiation with the charged particle beam. In order to achieve the object, a method and an apparatus are provided in which charged particle beams (2(a), 2(b)) emitted from a sample (23) are deflected by a charged particle deflector (33) in a state in which the sample (23) is irradiated with a charged particle beam (1), and information regarding a sample potential is detected by using a signal obtained at that time.
Abstract:
The present invention provides a composite charged particle beam device which is provided with two or more charged particle beam columns and enables high-resolution observation while a sample is placed at the position of a cross point. The present invention has the following configuration. A composite charged particle beam device is provided with a plurality of charged particle beam columns (101a, 102a), and is characterized in that a sample (103) is disposed at the position of an intersection point (171) where the optical axes of the plurality of columns intersect, a component (408a, 408b) that forms the tip of an objective lens of the charged particle beam column (102a) is detachable, and by replacing the component (408a, 408b), the distance between the intersection point (171) and the tip of the charge particle beam column can be changed.
Abstract:
The present application discloses methods, systems and devices for using charged particle beam tools to inspect and perform lithography on a substrate using a combination of vectoring to move a beam to features to be imaged, and raster scanning to obtain an image of the feature(s). The inventors have discovered that it is highly advantageous to use an extra step, a fast raster scan to image the substrate at a lower resolution, to determine which features receive priority for inspection; this extra step can reduce total inspection time, enhance inspection results, and improve beam alignment and manufacturing yield. Using multiple beam-producing columns, with multiple control computers local to the columns, provides various synergies. Preferably, miniature, non-magnetic, electrostatically-driven columns are used.