公开(公告)号：US20150327359A1

公开(公告)日：2015-11-12

申请号：US14651578

申请日：2013-12-09

Applicant: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Mikal Tuominen ,  Martin Fischeneder

IPC: H05K1/02 ,  H01P3/08

CPC classification number: H05K1/0253 ,  H01P3/08 ,  H05K1/0225 ,  H05K1/0245 ,  H05K2201/09272 ,  H05K2201/0969

Abstract: A printed circuit board that includes conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in an insulation material, whereby a conductive ground plan layer, separated by the insulation material and lying in a predetermined distance (d) from the at least one signal line includes a ground plane area associated to and extending along the at least one signal line, the conductive layer associated to and extending along the at least one signal line is provided with openings therein. Preferably the openings are spaces between conducting stripes, extending, seen from above, across the at least one signal line, the conducting stripes being integrally connected with the conductive remainder of the conductive layer.

Abstract translation: 一种印刷电路板，其包括由介电材料的绝缘层分隔的导电层，至少一个导电层被图案化并且具有嵌入在绝缘材料中的至少一个信号线，由此由绝缘材料分开并且位于 在距离至少一个信号线的预定距离（d）中包括与所述至少一个信号线相关联并且沿着所述至少一个信号线延伸的接地平面区域，与所述至少一条信号线相关联并沿其延伸的导电层在其中设置有开口 。 优选地，开口是导电条之间的空间，从上方观察，穿过至少一个信号线延伸，导电条与导电层的导电剩余部分整体连接。

公开(公告)号：US09159697B2

公开(公告)日：2015-10-13

申请号：US14219042

申请日：2014-03-19

Applicant: Wistron Corporation

Inventor： Hui-Ying Chou ,  Lee-Chieh Kang

IPC: H01L21/4763 ,  H01L21/44 ,  H01L23/00 ,  H01L23/13

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/528 ,  H01L23/53204 ,  H05K3/0005 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0969 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract translation: 提供了一种形成对应于SMT部件的焊盘的空隙的方法。 该方法包括以下步骤：将一个或多个条件参数输入到搜索单元。 参考条件参数，搜索单元搜索所有的焊盘，以获得预选的焊盘组。 提供判断单元以确定预先选择的焊盘组中的每个焊盘是否满足预定的处理要求以生成要处理的焊盘组。 执行单元参照要处理的一组焊盘的角坐标来执行空隙形成步骤，以便在与焊盘的角部相对应的接触表面的部分处形成至少一个空隙。 在一个实施例中，相应地在接触表面处形成与被处理组的每个焊盘的各个角相关的四个空隙。

公开(公告)号：US20150282323A1

公开(公告)日：2015-10-01

申请号：US14663921

申请日：2015-03-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi Shimizu ,  Wataru Kaneda ,  Akio Rokugawa

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/0222 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/116 ,  H05K3/26 ,  H05K3/381 ,  H05K3/4673 ,  H05K3/4676 ,  H05K2201/0191 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09227 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2203/0514

Abstract: A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

Abstract translation: 布线基板包括形成在芯层的一个表面上的第一布线层，形成在芯层的一个表面上以覆盖第一布线层的第一绝缘层，嵌入第一绝缘层中的通孔布线， 第二布线层，形成在第一绝缘层的第一表面上，以及比形成在第一绝缘层的第一表面上的第一绝缘层更薄的第二绝缘层，以覆盖第二布线层。 第一布线层包括焊盘和设置在焊盘周围的平面层。 通孔布线的一个端面从第一绝缘层的第一表面露出并直接接合到第二布线层。 通孔布线的另一个端面直接接合到第一绝缘层中的焊盘。

公开(公告)号：US20150280303A1

公开(公告)日：2015-10-01

申请号：US14735298

申请日：2015-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO

IPC: H01P3/00

CPC classification number: H01P3/003 ,  H01P1/20363 ,  H01P3/08 ,  H01P3/085 ,  H03H7/38 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727

Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

Abstract translation: 柔性高频信号传输线包括电介质体，其包括层叠的柔性电介质层。 信号线设置在电介质体中。 接地导体布置在电介质体中，以经由一个电介质层与信号线相对。 接地导体是梯形结构，包括沿着信号线交替布置的多个开口和多个桥。 信号线的特征阻抗在多个桥中的两个相邻桥之间变化，使得信号线的特性阻抗从最小值上升到中间值，并从最大值下降到中间值 并以此顺序达到最小值。

公开(公告)号：US09030840B2

公开(公告)日：2015-05-12

申请号：US13635606

申请日：2011-03-16

Applicant: Michael Heim ,  Sigmund Braun

Inventor： Michael Heim ,  Sigmund Braun

IPC: H05K7/06 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

Abstract: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).

Abstract translation: 本发明涉及一种包括电和/或电子模块（10）和电路载体（12）的装置，其中电和/或电子模块（10）的至少一个电连接线（14）可以容纳在 电路载体（12）的凹部（16）。 该装置包括至少一个夹紧元件（18a，18b，18c，18d），一旦其已经被引入到凹部（16）中就将至少一个连接线（14）固定在凹部（16）中。

公开(公告)号：US20150103499A1

公开(公告)日：2015-04-16

申请号：US14577333

申请日：2014-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki GOUCHI

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0287 ,  H05K1/0292 ,  H05K1/0293 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/24 ,  H05K3/4007 ,  H05K3/4092 ,  H05K3/4632 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10007 ,  H05K2201/10159 ,  H05K2201/10984 ,  H05K2201/2072 ,  H05K2203/0271 ,  H05K2203/063 ,  H05K2203/08

Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

Abstract translation: 为了防止电子部件和多层基板的接合强度的降低，电子部件嵌入式模块可以包括具有多个焊盘的电子部件和包括多个树脂层的多层基板和用于容纳电子部件的空腔 零件。 多层基板可以包括具有多个第一图案导体和空间的第一树脂层和具有第二图案导体和多个第三图案导体的第二树脂层。 多个第三图案导体可以与第一图案导体或垫中的任一个导通，其中第二树脂层被放置在第一树脂层上。 第二图案导体可以布置在具有间隙的第一衬垫周围，并且第二树脂层存在于第二图案导体和至少一个第一衬垫之间。

公开(公告)号：US20150102494A1

公开(公告)日：2015-04-16

申请号：US14219042

申请日：2014-03-19

Applicant: Wistron Corporation

Inventor： Hui-Ying Chou ,  Lee-Chieh Kang

IPC: H01L23/00 ,  H01L23/13

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/528 ,  H01L23/53204 ,  H05K3/0005 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0969 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract translation: 提供了一种形成对应于SMT部件的焊盘的空隙的方法。 该方法包括以下步骤：将一个或多个条件参数输入到搜索单元。 参考条件参数，搜索单元搜索所有的焊盘，以获得预选的焊盘组。 提供判断单元以确定预先选择的焊盘组中的每个焊盘是否满足预定的处理要求以生成要处理的焊盘组。 执行单元参照要处理的一组焊盘的角坐标来执行空隙形成步骤，以便在与焊盘的角部相对应的接触表面的部分处形成至少一个空隙。 在一个实施例中，相应地在接触表面处形成与被处理组的每个焊盘的各个角相关的四个空隙。

公开(公告)号：US08963672B2

公开(公告)日：2015-02-24

申请号：US14129148

申请日：2012-06-21

Applicant: Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

Inventor： Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H01F27/29 ,  H01F27/28 ,  H05K1/11 ,  H05K3/20 ,  H05K1/16 ,  H05K1/02

CPC classification number: H05K1/115 ,  H01F27/2804 ,  H05K1/0265 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/118 ,  H05K1/165 ,  H05K3/20 ,  H05K2201/0305 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/09745

Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.

Abstract translation: 该布线板设置有绝缘芯基板，第一导体图案，第二导体图案和导电材料。 第一导体图案和第二导体图案粘附到绝缘芯基板。 第二导体图案具有第一表面和第二表面。 第二导体图案具有凹部和通孔。 通向第一表面的凹部的开口和通向第一表面的通孔的开口相互连接。 第一导体图案位于凹部的开口处。 第一导体图案和第二导体图案通过导电材料电连接，导电材料从通孔的开口填充到第二表面。

公开(公告)号：US20150048906A1

公开(公告)日：2015-02-19

申请号：US14531058

申请日：2014-11-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Satoshi ISHINO ,  Jun SASAKI

IPC: H01P3/08 ,  H01P11/00 ,  H01P3/02

CPC classification number: H01P3/08 ,  H01P3/02 ,  H01P3/085 ,  H01P5/028 ,  H01P11/003 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/113 ,  H05K1/147 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727 ,  Y10T29/49123

Abstract: A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.

Abstract translation: 高频信号线包括具有柔性的第一基底层，设置在第一基底层上的线性信号线，并且包括具有第一宽度的第一线部分和具有大于第一宽度的第二宽度的第二线部分，以及 沿第一线部分设置在第一基底层上的第一加强导体。

公开(公告)号：US20150042605A1

公开(公告)日：2015-02-12

申请号：US14250239

申请日：2014-04-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Wan Jae Lee

IPC: G06F3/046

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  H01R12/62 ,  H05K1/118 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/0969

Abstract: Disclosed herein is a touch sensor module including: a base substrate having a plurality of electrode pads formed on one surface thereof; a flexible cable including terminal parts formed so as to correspond to the plurality of electrode pads and electrically connected to the plurality of electrode pads to transfer a signal to the outside and including penetration parts disposed between the terminal parts; and a conductive layer including conductive balls disposed between the electrode pads and the terminal parts and electrically connecting the electrode pads and the terminal parts to each other.

Abstract translation: 这里公开了一种触摸传感器模块，包括：基底基板，其在其一个表面上形成有多个电极焊盘; 柔性电缆，包括形成为对应于所述多个电极焊盘并且电连接到所述多个电极焊盘的端子部分，以将信号传送到外部并且包括设置在所述端子部分之间的穿透部分; 以及导电层，其包括设置在电极焊盘和端子部之间的导电球，并且将电极焊盘和端子部彼此电连接。