公开(公告)号：US20180359849A1

公开(公告)日：2018-12-13

申请号：US15805195

申请日：2017-11-07

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akira TANAKA ,  Masaya HIRASHIMA ,  Satoru YASUI ,  Shukuyo YAMADA

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/111 ,  H05K1/183 ,  H05K3/34 ,  H05K3/3442 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278

Abstract: According to one embodiment, provided are an electronic device and an electronic component protection substrate in which an electronic component is prevented from entering an irregular state. According to the electronic device of the present embodiment, an electronic component is soldered onto a pattern line of a printed circuit substrate, and a surface of the printed circuit substrate where the electronic component is disposed is formed as a recess such that the thickness of the printed circuit substrate in the recess part is thinned.

公开(公告)号：US20180352653A1

公开(公告)日：2018-12-06

申请号：US15992406

申请日：2018-05-30

Applicant: Infineon Technologies Austria AG

Inventor： Elvir Kahrimanovic ,  Wai Keung Alan Lun

IPC: H05K1/05 ,  H05K1/02 ,  H01L23/495

CPC classification number: H05K1/056 ,  H01L23/3735 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49582 ,  H05K1/0204 ,  H05K2201/068 ,  H05K2201/10166

Abstract: A power electronic device includes an Insulated Metal Substrate Printed Circuit Board (IMS PCB) and a power semiconductor device package. The power semiconductor device package includes a lead frame configured to electrically and mechanically couple the power semiconductor device package to the IMS PCB. The lead frame has a rigid configuration and is made of a lead frame material having a first thermal expansion coefficient. The IMS PCB includes an insulated metal substrate made of a substrate material having a second thermal expansion coefficient within a range of 60% to 140% of the first thermal expansion coefficient.

公开(公告)号：US20180344195A1

公开(公告)日：2018-12-06

申请号：US16057573

申请日：2018-08-07

Applicant: THALMIC LABS INC.

Inventor： Cezar Morun ,  Stephen Lake

IPC: A61B5/0492 ,  H05K1/16

CPC classification number: A61B5/0492 ,  H05K1/162 ,  H05K1/167 ,  H05K2201/10151 ,  H05K2201/10166 ,  Y10T29/4913

Abstract: Systems, articles, and methods for surface electromyography (“EMG”) sensors that combine elements from traditional capacitive and resistive EMG sensors are described. For example, capacitive EMG sensors that are adapted to resistively couple to a user's skin are described. Resistive coupling between a sensor electrode and the user's skin is galvanically isolated from the sensor circuitry by a discrete component capacitor included downstream from the sensor electrode. The combination of a resistively coupled electrode and a discrete component capacitor provides the respective benefits of traditional resistive and capacitive (respectively) EMG sensor designs while mitigating respective drawbacks of each approach. A wearable EMG device that provides a component of a human-electronics interface and incorporates such capacitive EMG sensors is also described.

公开(公告)号：US20180343739A1

公开(公告)日：2018-11-29

申请号：US15957246

申请日：2018-04-19

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： CHAO-MIN LAI ,  SHOU-TE YEN

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/0243 ,  H05K1/0248 ,  H05K1/113 ,  H05K1/114 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10712 ,  H05K2201/10734

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.

公开(公告)号：US20180307369A1

公开(公告)日：2018-10-25

申请号：US15958449

申请日：2018-04-20

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： GEUNJEONG PARK ,  Yongjun Jang ,  Byungsun Kim ,  Ahyoung Son

IPC: G06F3/041 ,  G06F3/044 ,  G06K9/00

CPC classification number: H05K1/189 ,  H01L23/5387 ,  H01L25/0657 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10166

Abstract: A display device includes: a display panel including a display area in which a plurality of pixels are arranged to display images and a non-display area around the display area. A flexible printed circuit board is connected to the display panel and a driving integrated circuit is arranged on the flexible printed circuit board. A home integrated circuit is arranged on the driving integrated circuit and overlapping the driving integrated circuit.

公开(公告)号：US20180278034A1

公开(公告)日：2018-09-27

申请号：US15763513

申请日：2016-09-09

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Tou Chin ,  Arinobu Nakamura

IPC: H02G3/16 ,  H02G3/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  B60R16/023

CPC classification number: H02G3/16 ,  B60R16/0238 ,  H02G3/03 ,  H02G3/081 ,  H05K1/115 ,  H05K1/144 ,  H05K1/183 ,  H05K7/02 ,  H05K2201/041 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10409

Abstract: A circuit assembly includes an electronic component including a plurality of terminals, a first board that is constituted by an insulating plate provided with a conductive path and an insertion hole into which the electronic component is inserted, a busbar that overlaps the first board, and a second board that is constituted by an insulating plate provided with a conductive path and overlapping the first board, at least a portion of the second board being arranged on the same level as the busbar. The plurality of terminals of the electronic component is connected to the busbar and the conductive path of the second board.

公开(公告)号：US10085368B2

公开(公告)日：2018-09-25

申请号：US15528603

申请日：2015-11-06

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Shogo Mori ,  Naoki Kato ,  Hiroshi Yuguchi ,  Yoshitaka Iwata ,  Masahiko Kawabe ,  Yuri Otobe

IPC: H05K7/20 ,  H01L21/48 ,  H02M7/42 ,  H05K7/14 ,  H02M7/00 ,  H01L23/29 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02 ,  H02M1/32

CPC classification number: H05K7/20927 ,  H01L21/4846 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/473 ,  H01L23/5389 ,  H01L2224/32221 ,  H01L2924/0002 ,  H02M7/003 ,  H02M7/42 ,  H02M2001/327 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/185 ,  H05K3/4697 ,  H05K7/14 ,  H05K7/20263 ,  H05K7/20436 ,  H05K2201/1003 ,  H05K2201/10166 ,  H01L2924/00

Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

公开(公告)号：US10082428B2

公开(公告)日：2018-09-25

申请号：US15659009

申请日：2017-07-25

Applicant: Renesas Electronics America Inc.

Inventor： Tetsuo Sato ,  Ryotaro Kudo

IPC: G01K7/00 ,  G01K1/02 ,  G01K3/00 ,  G01K7/01 ,  G06F1/20 ,  G06F1/26 ,  H01L23/34 ,  H05K1/02 ,  G01K3/14

CPC classification number: G01K7/00 ,  G01K1/026 ,  G01K3/00 ,  G01K7/01 ,  G01K2003/145 ,  G06F1/206 ,  G06F1/26 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/0262 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2203/163 ,  Y02D10/16 ,  H01L2924/00

Abstract: An apparatus, in one embodiment, can include a configuration including a plurality of heat generation devices. The apparatus also includes a plurality of thermal sensors respectively, operably connected to each of the plurality of heat generation devices, wherein each thermal sensor of the plurality of thermal sensors includes a respective output terminal configured to provide a voltage representative of the temperature of the respective heat generation device. The apparatus further includes an output circuit configured to output the highest temperature information among the heat generation devices. The output terminals of the plurality of thermal sensors are tied together. A corresponding method is also discussed.

公开(公告)号：US10071880B2

公开(公告)日：2018-09-11

申请号：US14768526

申请日：2013-02-21

Applicant: OTIS ELEVATOR COMPANY

Inventor： Andreas Tutat ,  Ibrahim Ia Atalmis ,  Herbert Horbrügger ,  Marvin Dehmlow

IPC: B66B1/06 ,  B66B1/30 ,  B66B11/00 ,  H01H71/10 ,  H05K1/02

CPC classification number: B66B1/302 ,  B66B1/306 ,  B66B1/308 ,  B66B11/002 ,  H01H71/10 ,  H05K1/0206 ,  H05K1/0265 ,  H05K2201/10166 ,  H05K2201/10416 ,  Y02B50/127

Abstract: A drive unit for an elevator system, the drive unit including a multilayer, power circuit board; a first DC link formed in a layer of the power circuit board; a second DC link formed in a layer of the power circuit board; a first switch having a first terminal, the first switch mounted to a surface of the power circuit board; a first via electrically coupling the first terminal to the first DC link; a second switch having a second terminal, the second switch mounted to the surface of the power circuit board; and a second via electrically coupling the second terminal to the second DC link; the first via conducting heat from the first switch to the first DC link; the second via conducting heat from the second switch to the second DC link.

公开(公告)号：US10070514B2

公开(公告)日：2018-09-04

申请号：US15339037

申请日：2016-10-31

Applicant: Ellenberger & Poensgen GmbH

Inventor： Wolfgang Ullermann ,  Peter Meckler ,  Manuel Engewald ,  Matthias Schwarz ,  Ewald Schneider ,  Markus Miklis

IPC: H05K1/02 ,  H01L25/07 ,  H02M7/00 ,  H01L23/00 ,  F02N11/08 ,  H05K3/34

CPC classification number: H05K1/0263 ,  F02N11/087 ,  F02N2011/0874 ,  H01H45/00 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/00 ,  H05K3/3421 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2924/00

Abstract: A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.