公开(公告)号：US08995145B2

公开(公告)日：2015-03-31

申请号：US13504807

申请日：2010-10-28

Applicant: Sumio Kagimura ,  Hiroshi Doumae

Inventor： Sumio Kagimura ,  Hiroshi Doumae

IPC: H05K3/32 ,  H01R4/34 ,  H01R12/51 ,  H01R12/58 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/32 ,  H01R4/34 ,  H01R12/515 ,  H01R12/585 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10962

Abstract: A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block includes a terminal connection part to be directly connected to the power module, and a wire connection part to be connected to the electrical wire. In the printed circuit board, a hole having an orthographic projection area larger than that of the terminal connection part as viewed in plane is formed. The terminal connection part is positioned below or above the hole of the printed circuit board.

Abstract translation: 电路板单元包括印刷电路板和安装在印刷电路板上并将功率模块和电线连接在一起的端子块。 端子块包括要直接连接到电源模块的端子连接部分和要连接到电线的电线连接部分。 在印刷电路板中，形成具有比平面上的端子连接部的正交投影面积大的正交投影面积的孔。 端子连接部位于印刷电路板的孔的下方或上方。

公开(公告)号：US20150072195A1

公开(公告)日：2015-03-12

申请号：US14230678

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Edward J. Soleski ,  Mikhail S. Balk ,  Lisa L. Winders ,  Richard M. DeKeuster ,  John P. Dinkelman

IPC: H01M10/48 ,  H01M10/04

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A battery module and a method of manufacture are provided. The battery module may include a printed circuit board (PCB) assembly. The PCB assembly may include a PCB designed to be disposed in a battery module for controlling operations of the battery module. The PCB may also include voltage sensing circuitry. In addition, the PCB assembly may include a bus bar cell interconnect. The bus bar cell interconnect may electrically couple batteries of the battery module. The PCB assembly may also include a voltage sense connection tab. The voltage sense connection tab may carry a voltage between a bus bar cell interconnect of the battery module and the voltage sensing circuitry on the PCB.

Abstract translation: 提供电池模块和制造方法。 电池模块可以包括印刷电路板（PCB）组件。 PCB组件可以包括设计成设置在电池模块中以控制电池模块的操作的PCB。 PCB还可以包括电压感测电路。 此外，PCB组件可以包括汇流条单元互连。 母线电池互连可以电连接电池模块的电池。 PCB组件还可以包括电压感测连接片。 电压感测连接片可以在电池模块的汇流条单元互连和PCB上的电压感测电路之间承载电压。

公开(公告)号：US20140374149A1

公开(公告)日：2014-12-25

申请号：US14303790

申请日：2014-06-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Masaki SANADA ,  Syota MIKI

IPC: H05K1/11

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/8182 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0338 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of copper and tin or a tin layer; and a second metal layer formed on the first metal layer and including a gold layer.

Abstract translation: 衬垫结构包括绝缘层; 形成在所述绝缘层的一个表面上并且包括铜和锡或锡层的金属间化合物层的第一金属层; 以及形成在第一金属层上并且包括金层的第二金属层。

公开(公告)号：US08848385B2

公开(公告)日：2014-09-30

申请号：US13200672

申请日：2011-09-28

Applicant: Thomas P. Warwick ,  James V. Russell

Inventor： Thomas P. Warwick ,  James V. Russell

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0233 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

Abstract translation: 本公开涉及减少包含RF设备的印刷电路板（PCB）中的不期望的RF噪声。 隔离滤波器嵌入在包含RDF设备的PCB中。 通过将隔离滤波器放置在尽可能靠近RF器件的位置，以便显着减少不必要的RF噪声，这是由于通孔和PCB结构中的平面之间的不可避免的耦合。

公开(公告)号：US20140273552A1

公开(公告)日：2014-09-18

申请号：US13844501

申请日：2013-03-15

Applicant: Sanka GANESAN ,  Timothy M. SWETTLEN ,  Gary B. LONG ,  Donald T. TRAN ,  Jill D. MURFIN ,  David D. AMIR

Inventor： Sanka GANESAN ,  Timothy M. SWETTLEN ,  Gary B. LONG ,  Donald T. TRAN ,  Jill D. MURFIN ,  David D. AMIR

IPC: H05K1/14

CPC classification number: H01R43/0249 ,  H01R43/205 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/144 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/2009

Abstract: Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.

Abstract translation: 描述了堆叠的柔性电缆组件及其制造。 一个组件包括电耦合到第一柔性电缆的第一柔性电缆和第二柔性电缆。 组件还包括电连接到第一柔性电缆的连接器。 第一柔性电缆位于连接器和第二柔性电缆之间。 描述和要求保护其他实施例。

公开(公告)号：US20140211439A1

公开(公告)日：2014-07-31

申请号：US13900758

申请日：2013-05-23

Applicant: Texas Instruments Incorporated

Inventor： Mark Allen Gerber

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K7/02 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49117 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.

Abstract translation: 电路组件包括具有衬底电路，相对的顶部和底部衬底表面以及延伸穿过衬底的衬底孔的衬底。 电路组件还包括电连接到基板电路的分立组件组件和附接到分立组件的支撑构件。 离散部件的至少一部分物理地安装在基板孔中。

公开(公告)号：US20140175266A1

公开(公告)日：2014-06-26

申请号：US13757061

申请日：2013-02-01

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： KAI-WEN WU

IPC: H01L25/16

CPC classification number: H01S5/02248 ,  H01L2224/48137 ,  H01S5/02276 ,  H01S5/4025 ,  H05K1/0243 ,  H05K3/328 ,  H05K2201/10121 ,  H05K2201/1053 ,  H05K2203/049

Abstract: A circuit board assembly includes a printed circuit board (PCB), at least two laser diodes, a number of first bonding wires, at least two photo diodes and a number of second bonding wires. The PCB includes a mounting surface, a first connecting pad, and a second connecting pad, both the first connecting pad and the second connecting pad are positioned on the mounting surface. The at least two laser diodes and the driving chip mounted on the first connecting pad. The first bonding wires each electrically connects the laser diodes to the driving chip. The photo diodes and the transimpedance amplifier mounted on the second connecting pad. The second bonding wires each electrically connects the photo diodes to the transimpedance amplifier.

Abstract translation: 电路板组件包括印刷电路板（PCB），至少两个激光二极管，多个第一接合线，至少两个光电二极管和多个第二接合线。 PCB包括安装表面，第一连接焊盘和第二连接焊盘，第一连接焊盘和第二连接焊盘均位于安装表面上。 所述至少两个激光二极管和所述驱动芯片安装在所述第一连接焊盘上。 第一接合线将激光二极管电连接到驱动芯片。 光电二极管和跨阻放大器安装在第二连接焊盘上。 第二接合线将光电二极管电连接到跨阻放大器。

公开(公告)号：US20140130347A1

公开(公告)日：2014-05-15

申请号：US13765650

申请日：2013-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Yeol PARK ,  Suk Jin Ham ,  Jung Tae Park ,  Seung Heon Han ,  Jung Eun Noh

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/4913

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括： 形成包括形成在主体的至少一侧的电极的电子部件; 在电极的上部形成端子和主体的上部; 提供其中形成空腔的基板; 将形成有端子的电子部件安装在基板的空腔中; 以及在所述基板的上部和所述电子部件的上部形成积聚层。

公开(公告)号：US20140003015A1

公开(公告)日：2014-01-02

申请号：US14016707

申请日：2013-09-03

Applicant: Shinji WATANABE ,  Nobuhiro MIKAMI ,  Junya SATO ,  Kenichiro FUJII ,  Katsumi ABE ,  Atsumasa SAWADA

Inventor： Shinji WATANABE ,  Nobuhiro MIKAMI ,  Junya SATO ,  Kenichiro FUJII ,  Katsumi ABE ,  Atsumasa SAWADA

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/023 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/32 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09436 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  H05K2203/302 ,  Y02P70/611 ,  H01L2924/00

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract translation: 本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。 在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。 弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。 基座部分13a由绝缘材料形成。 半导体封装20安装在焊盘部分15a上。

公开(公告)号：US20120327625A1

公开(公告)日：2012-12-27

申请号：US13602326

申请日：2012-09-04

Applicant: Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H05K7/06

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

Abstract translation: 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部与第二导电段电连接。