公开(公告)号：US20080224786A1

公开(公告)日：2008-09-18

申请号：US12075589

申请日：2008-03-12

Applicant: James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

Inventor： James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

IPC: H03B5/04 ,  H03L1/04

CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/403 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10651

Abstract: An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.

Abstract translation: 振荡器组件包括被配置为产生频率信号的振荡器电路。 温度补偿电路与振荡器电路通信，并且适于根据温度变化调整频率信号。 振荡器和温度补偿电路位于烤箱内。 与加热器连通的加热器和温度传感器也都位于烤箱中。 温度传感器适用于根据温度变化直接控制加热器。 在一个实施例中，振荡器部件被安装到球栅阵列基板，该栅格阵列基板又安装在印刷电路板上。 在该实施例中，谐振器覆盖在球栅阵列基板上，并且盖覆盖并限定用于谐振器和球栅阵列基板的烤箱和外壳。 振荡器和温度补偿电路定义在球栅阵列基板上。

公开(公告)号：US07396701B2

公开(公告)日：2008-07-08

申请号：US11281476

申请日：2005-11-18

Applicant: Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

Inventor： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L25/162 ,  H01L23/3121 ,  H01L23/4824 ,  H01L23/5227 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0617 ,  H01L27/0629 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/045 ,  H05K2203/081 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

Abstract: A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

Abstract translation: 提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。 通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接。 通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热喷射器在280℃以上的温度进行热处理来进行。 因此，可以使用高熔点焊料将半导体芯片IC 1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。 因此，半导体芯片IC 1可以以高连接强度安装在PCB 38上。

公开(公告)号：US20080158834A1

公开(公告)日：2008-07-03

申请号：US11952406

申请日：2007-12-07

Applicant: Tomohide Ogura ,  Motoyoshi Kitagawa

Inventor： Tomohide Ogura ,  Motoyoshi Kitagawa

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3463 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1572

Abstract: A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.

Abstract translation: 模块包括：具有设置在其中的通孔的板，设置在板的下表面上的辅助板，安装在板的上表面上的第一电子部件，覆盖第一电子部件的导电盖， 电子部件安装在辅助板的上表面上。 辅助板包括密封通孔的密封部分。 第二电子部件定位在设置在板中的通孔中和辅助板的上表面上。 第二电子部件比第一电子部件高。 这个模块很薄。

公开(公告)号：US20080157295A1

公开(公告)日：2008-07-03

申请号：US11961984

申请日：2007-12-20

Applicant: Peter R. Nuytkens ,  Noureddine Hawat ,  Joseph M. Kulinets

Inventor： Peter R. Nuytkens ,  Noureddine Hawat ,  Joseph M. Kulinets

IPC: H01L23/498 ,  H01L21/98

CPC classification number: H01L25/16 ,  H01L23/552 ,  H01L2223/6688 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3442 ,  H05K2201/045 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Methods and apparatus for multichip modules having improved shielding and isolation properties.

Abstract translation: 具有改进的屏蔽和隔离性能的多芯片模块的方法和装置。

公开(公告)号：US07344918B2

公开(公告)日：2008-03-18

申请号：US11384964

申请日：2006-03-20

Applicant: Donald T. Tran

Inventor： Donald T. Tran

IPC: H01L23/02

CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/183 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10409 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

Abstract: In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

Abstract translation: 在一些示例性实施例中，集成电路，电子组件和方法提供用于向处理器供电的电流路径。 作为示例，集成电路包括具有从基座的上表面延伸的电力触点的基座。 集成电路还包括安装到基座的上表面以将基板电耦合到基座的基板。 模具安装在基板上，使得模具电耦合到基板。 基座上表面上的电源触点接合子板，使得管芯能够通过基座上表面上的电源触点从安装在子板上的电压源接收电力。

公开(公告)号：US07254027B2

公开(公告)日：2007-08-07

申请号：US11021504

申请日：2004-12-21

Applicant: Christian L. Belady ,  Gary W. Williams ,  Shaun L. Harris ,  Steven A. Belson ,  Eric C. Peterson

Inventor： Christian L. Belady ,  Gary W. Williams ,  Shaun L. Harris ,  Steven A. Belson ,  Eric C. Peterson

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract translation: 实施例包括用于系统板的处理器模块的装置，方法和系统。 在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置通过热交换从处理器散热。 第二部分设置在第一部分和系统板之间产生的空间中。 第二部分具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。

公开(公告)号：US20060221590A1

公开(公告)日：2006-10-05

申请号：US11096089

申请日：2005-03-31

Applicant: Edoardo Campini ,  Andy Saffarian ,  Marwan Khoury

Inventor： Edoardo Campini ,  Andy Saffarian ,  Marwan Khoury

IPC: H05K1/14

CPC classification number: G06F1/186 ,  G06F1/184 ,  G06F1/185 ,  H01R12/52 ,  H05K1/141 ,  H05K1/144 ,  H05K3/323 ,  H05K3/325 ,  H05K7/1429 ,  H05K2201/0314 ,  H05K2201/045

Abstract: A method according to one embodiment may include providing a circuit board having a connector footprint including a plurality of electrical contacts and providing a mezzanine card including a first plurality of conductive traces on a first side of the mezzanine card. The method of this embodiment may also include providing a first wiring board disposed between at least a portion of the circuit board and at least a portion of the mezzanine card. The first wiring board may electrically couple at least a portion of the electrical contacts of the connector footprint to at least a portion of the conductive traces of the mezzanine card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract translation: 根据一个实施例的方法可以包括提供具有包括多个电触点的连接器封头的电路板，并且提供夹层卡，该夹层卡在夹层卡的第一侧上包括第一多个导电迹线。 该实施例的方法还可以包括提供设置在电路板的至少一部分与夹层卡的至少一部分之间的第一布线板。 第一布线板可以将连接器覆盖区的电触点的至少一部分电耦合到夹层卡的导电迹线的至少一部分。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US20060126297A1

公开(公告)日：2006-06-15

申请号：US11011328

申请日：2004-12-13

Applicant: Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson

Inventor： Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson

IPC: H05K7/20

CPC classification number: H01L23/367 ,  G06F1/189 ,  G06F1/20 ,  H01L25/105 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H01L2924/00

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract translation: 实施例包括用于系统板的处理器模块的装置，方法和系统。 电子模块可拆卸地连接到系统板。 电子模块具有第一和第二部分。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置在处理器和系统板之间延伸。 第二部分连接在第一部分的顶部，并且具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。

公开(公告)号：US20050098868A1

公开(公告)日：2005-05-12

申请号：US10704793

申请日：2003-11-12

Applicant: Chih-Huang Chang ,  Shih-Chang Lee

Inventor： Chih-Huang Chang ,  Shih-Chang Lee

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H05K3/42 ,  H01L23/02

CPC classification number: H05K1/144 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/045 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/10378

Abstract: A multi-chips module assembly package mainly comprises a first package, a second package and an intermediate substrate. The intermediate substrate includes an opening, at least a via and a plurality of circuit layers, wherein the second package is accommodated in the opening. The via has an inner wall, and a plurality of separated electrically conductive layers, which is formed on the inner wall and connected with the corresponding circuit layers. The first package electrically connects with the second package through the intermediate substrate, and the intermediate substrate is interposed between the first package and the second package. At least an insulator is formed in the via, and the separated electrically conductive layers are separated from each other. After the intermediate substrate is interposed between the first package and the second package, there will be not enough space between the intermediate substrate, the first package and the second package for disposing conductive devices therein. Therefore, the first package will be electrically connected to the second package through the separated electrically conductive layers of the intermediate substrate for providing more conductive devices disposed and interposed between the intermediate substrate, the first package and the second package.

Abstract translation: 多芯片模块组装封装主要包括第一封装，第二封装和中间基板。 中间基板包括开口，至少通孔和多个电路层，其中第二封装容纳在开口中。 通孔具有内壁和多个分离的导电层，其形成在内壁上并与相应的电路层连接。 第一包装通过中间基板与第二包装电连接，并且中间基板插入在第一包装和第二包装之间。 至少在通孔中形成绝缘体，并且分离的导电层彼此分离。 在中间基板插入在第一封装和第二封装之间之后，中间基板，第一封装和第二封装之间将没有足够的空间用于在其中设置导电器件。 因此，第一封装将通过中间衬底的分离的导电层电连接到第二封装，用于提供设置和介于中间衬底，第一封装和第二封装之间的更多导电器件。

公开(公告)号：US20050074243A1

公开(公告)日：2005-04-07

申请号：US10980790

申请日：2004-11-04

Applicant: Yasuhide Kuroda ,  Masakazu Kishi ,  Yoshinori Nakane ,  Satoru Yamada ,  Kenichiro Tsubone ,  Yuji Miyaki ,  Shigeichi Izumi ,  Kazuhiro Suzuki

Inventor： Yasuhide Kuroda ,  Masakazu Kishi ,  Yoshinori Nakane ,  Satoru Yamada ,  Kenichiro Tsubone ,  Yuji Miyaki ,  Shigeichi Izumi ,  Kazuhiro Suzuki

IPC: H05K9/00 ,  G02B6/42 ,  H01L23/02 ,  H01L25/00 ,  H01L31/02 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H04B10/00

CPC classification number: H05K1/144 ,  G02B6/4201 ,  G02B6/4277 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/145 ,  H05K3/308 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/045 ,  H05K2201/09809 ,  H05K2201/10121 ,  H05K2201/10446 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Abstract translation: 提供了可以实现小型化，高性能和降低成本的光学模块。 光模块包括光电元件，处理由光电元件光电转换的高速信号的高速信号处理部分和处理低速信号的低速信号处理部分。 高速信号处理部分和低速信号处理部分在垂直方向上彼此重叠并且彼此电连接。