公开(公告)号：US20140209791A1

公开(公告)日：2014-07-31

申请号：US13973993

申请日：2013-08-22

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： KAI-WEN WU

IPC: G01J1/04

CPC classification number: H05K1/183 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/428 ,  G02B6/4292 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/2018

Abstract: A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate defines a positioning recess. The photoelectric unit is positioned on the substrate. The lens module includes a reflection surface, a plurality of first lenses, and a plurality of second lens. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The lens module further includes a positioning portion extending downward from a bottom surface, and the positioning portion is received in the positioning recess. The first lenses are aligned with the photoelectric unit.

Abstract translation: 光电耦合模块包括基板，光电单元和透镜模块。 基板限定了定位凹槽。 光电单元位于基板上。 透镜模块包括反射表面，多个第一透镜和多个第二透镜。 第一透镜的光轴在反射面上交叉第二透镜的光轴。 透镜模块还包括从底面向下延伸的定位部分，并且定位部分被容纳在定位凹槽中。 第一透镜与光电单元对准。

公开(公告)号：US20140185257A1

公开(公告)日：2014-07-03

申请号：US14138126

申请日：2013-12-23

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Shih-Ping HSU

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/186 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09072 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.

Abstract translation: 具有嵌入式部件的印刷电路板包括双面印刷电路板，电子部件，多个导电浆料块，绝缘层和第一布线层附近的布线层，绝缘层和靠近第二布线层的布线层 接线层。 所述双面印刷电路板包括第一布线层，基底和第二布线层。 第一布线层和第二布线层布置在基底的相对侧上。 第二布线层包括多个电接触垫。 基座定义了多个导电通孔。 每个电接触焊盘与一个对应的导电通孔对准并电连接。 导电膏块电连接到导电通孔。 电子元件电连接到导电膏块。 两个绝缘层覆盖电子部件和第二布线层。

公开(公告)号：US20140182892A1

公开(公告)日：2014-07-03

申请号：US14109913

申请日：2013-12-17

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SHIH-PING HSU

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09072 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste.

Abstract translation: 具有嵌入式部件的印刷电路板包括双面布线板，电子部件和许多导电浆料。 布线基板包括第一布线层，基底层，第一绝缘层和第二布线层。 底层具有将第一绝缘层的第二表面的一部分暴露于外部的开口。 第二布线层包括电接触垫。 导电盲孔形成在第一绝缘层中。 每个电接触垫电连接到相应的导电盲孔通孔的一端。 导电盲孔的另一端与第一表面相邻。 填充通孔形成在双面布线板中。 导电膏分别电连接到导电盲孔。 电子部件粘附并电连接到导电膏。

公开(公告)号：US08749073B2

公开(公告)日：2014-06-10

申请号：US13154565

申请日：2011-06-07

Applicant: Junichi Nakamura ,  Kentaro Kaneko ,  Shunichiro Matsumoto

Inventor： Junichi Nakamura ,  Kentaro Kaneko ,  Shunichiro Matsumoto

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19101 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/244 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/308

Abstract: A wiring board includes a structure in which a plurality of wiring layers are stacked with insulating layers interposed therebetween, a plurality of pads for mounting an electronic component, the pads being formed on an outermost insulating layer on one surface side of the structure and exposed to the surface of the outermost insulating layer, and a recessed portion formed at a place corresponding to a mounting area for the electronic component. The recessed portion is formed in the outermost insulating layer at an area between the pads to which electrode terminals of the electronic component to be mounted are to be connected, respectively.

Abstract translation: 布线基板包括多个布线层层叠有绝缘层的结构，多个用于安装电子部件的焊盘，该焊盘形成在该结构的一个表面侧上的最外侧的绝缘层上并暴露于 最外层绝缘层的表面和形成在与电子部件的安装区域对应的位置的凹部。 凹陷部分分别形成在要连接的电子部件的电极端子的焊盘之间的区域中的最外层绝缘层中。

公开(公告)号：US08686572B2

公开(公告)日：2014-04-01

申请号：US13720849

申请日：2012-12-19

Applicant: Stec, Inc.

Inventor： Mark Moshayedi

IPC: H01L21/40 ,  H05K7/00

CPC classification number: H05K1/181 ,  H01L23/50 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/0949 ,  H05K2201/10515 ,  H05K2201/10666 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A multi-chip stack module provides increased circuit density for a given surface chip footprint. Support structures are alternated with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. One aspect is a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that signals, which are common to the chips, are connected in the stack and signals, which are accessed individually, are separated within the stack.

Abstract translation: 多芯片堆叠模块为给定的表面芯片占用空间提供了增加的电路密度。 支撑结构与标准表面贴装型芯片交替形成堆叠，其中支撑结构将芯片电互连。 一个方面是用于在垂直堆叠中互连多个大致平面的芯片的结构和方法，使得在堆叠中共同连接的芯片的信号和单独访问的信号在堆栈内分离。

公开(公告)号：US20130301276A1

公开(公告)日：2013-11-14

申请号：US13938128

申请日：2013-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Hee YOO ,  Ho Sik AHN

IPC: F21V29/00

CPC classification number: F21V29/70 ,  G02F1/133603 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4069 ,  H05K2201/0209 ,  H05K2201/09072 ,  H05K2201/10106

Abstract: A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly.

Abstract translation: 本发明的背光单元的厚度，重量和制造成本降低，但散热效率提高。 在背光单元中，柔性印刷电路板具有穿孔的至少一个通孔。 LED封装设置在与通孔对应的柔性印刷电路板的顶部上。 本发明的背光单元采用柔性印刷电路板代替金属印刷电路板作为将电流传导到LED封装的手段。 这产生了更薄和更轻的背光单元，并且还节省制造成本。 此外，LED封装通过导热粘合剂直接接合到底板上，从而确保从LED封装产生的热量更快地释放。

公开(公告)号：US08562358B2

公开(公告)日：2013-10-22

申请号：US13123030

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

IPC: H01R29/00

CPC classification number: H04Q1/136 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A patch panel (100) for use with infrastructure management systems that utilizes a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. A plurality of connective jacks (31) are mounted on the first (36) of the two circuit boards, and are interconnected to other network devices. Wires from the jacks extend to and connect with network devices and the first circuit board has a plurality of first integrated circuits (45) mounted thereon which monitor the status of the network devices connected to the jacks. The second circuit board (49) is spaced apart from the first circuit board and it includes a plurality of second integrated circuits (52) that convey the status information obtained from the network work area outlets on the network to network devices, such as switches and scanners of the network (104).

Abstract translation: 用于与利用与终端用户设备和工作区域出口相互连接的多条电缆的基础设施管理系统使用的接线板（100）以及用于监控这些终端用户设备和出口的状态的集成电路包括一对电路板 。 多个连接插座（31）安装在两个电路板的第一（36）上，并且互连到其他网络设备。 插座的电线延伸到网络设备并与其连接，并且第一电路板具有安装在其上的多个第一集成电路（45），其监测连接到插座的网络设备的状态。 第二电路板（49）与第一电路板间隔开，并且包括多个第二集成电路（52），其将从网络上的网络工作区域出口获得的状态信息传送到网络设备，诸如交换机和 网络扫描仪（104）。

公开(公告)号：US20130235573A1

公开(公告)日：2013-09-12

申请号：US13415583

申请日：2012-03-08

Applicant: Christopher P. Ricci ,  Gary Fong

Inventor： Christopher P. Ricci ,  Gary Fong

IPC: F21V13/02 ,  H05K3/30 ,  F21V29/00

CPC classification number: F21V9/06 ,  F21K9/27 ,  F21K9/278 ,  F21V21/14 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: An LED lighting assembly is provided as a drop-in replacement for standard flourescent tubes. An LED lighting assembly and corresponding method for its assembly comprises a substrate having an LED array mounted thereon. The LED array can be mounted in traditional wirebonded or flip chip arrangements. The assembly further includes a heat sink layer, a light diffusion layer, a UV filter layer, and a structural frame for supporting the assembly. The structural frame can be adjusted to replace any length flourescent tube. A voltage controller is provided to filter out voltage spikes from a power source. A microcontroller is provided for receiving any control instructions.

Abstract translation: 提供LED照明组件作为标准荧光管的替代品。 LED照明组件及其组装的相应方法包括其上安装有LED阵列的基板。 LED阵列可以安装在传统的引线键合或倒装芯片布置中。 组件还包括散热层，光扩散层，UV过滤层和用于支撑组件的结构框架。 可以调整结构框架以取代任何长度的荧光管。 提供电压控制器来滤除来自电源的电压尖峰。 提供微控制器用于接收任何控制指令。

公开(公告)号：US20130207650A1

公开(公告)日：2013-08-15

申请号：US13765381

申请日：2013-02-12

Applicant: Paul KOOP

Inventor： Paul KOOP

IPC: G01R33/07 ,  H05K3/30

CPC classification number: G01R33/072 ,  G01R33/0011 ,  H05K1/18 ,  H05K3/30 ,  H05K2201/09072 ,  H05K2201/10151 ,  H05K2201/10545 ,  Y10T29/4913

Abstract: A magnetic field sensor includes: a circuit board having a first surface, a second surface opposite to the first surface, and a recess extending from the first surface to the second surface; a Hall sensor component having a Hall sensor situated in a housing, the Hall sensor component having an active sensor area situated parallel to the first surface and in the area of the recess on the side of the second surface on the circuit board; and a first magnetic flux concentrator made of a magnetically permeable material and situated on the side of the first surface opposite to the Hall sensor component, the magnetic flux concentrator having a lateral surface which faces away from the circuit board and includes a first surface area and a lateral surface which faces toward the circuit board and includes a second surface area which is smaller than the first surface area.

Abstract translation: 磁场传感器包括：具有第一表面，与第一表面相对的第二表面和从第一表面延伸到第二表面的凹槽的电路板; 霍尔传感器部件，其具有位于壳体中的霍尔传感器，所述霍尔传感器部件具有与所述第一表面平行且位于所述电路板上的所述第二表面侧的所述凹部的区域中的有源传感器区域; 以及由导磁材料制成并位于与霍尔传感器部件相对的第一表面侧的第一磁通量集中器，该磁通量集中器具有背离电路板的侧表面，并且包括第一表面区域和 面向电路板的侧表面，并且包括比第一表面区域小的第二表面区域。

公开(公告)号：US20130008703A1

公开(公告)日：2013-01-10

申请号：US13635364

申请日：2011-04-11

Applicant: Johannes Stahr ,  Markus Leitgeb

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/32

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.

Abstract translation: 在将组件（3）集成到印刷电路板中的方法中，提供以下步骤：提供两个完整的印刷电路板元件（1,4），其更特别地由多个相互连接的层或层（6， 其中至少一个印刷电路板元件（4）具有切口或凹陷（10），将组件（3）布置成集成在一个印刷电路板元件（1）上或者在 所述至少一个印刷电路板元件，并且将所述印刷电路板元件（1,4）与所述部件（3）连接在所述切口（10）中，结果可以获得安全可靠的住宿 在印刷电路板中的部件或传感器（3）。 此外，提供一种包括集成在其中的电子部件（3）的这种类型的印刷电路板。