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    Multilayer printed board with a double plane spiral interconnection structure
    53.
    发明申请
    Multilayer printed board with a double plane spiral interconnection structure 失效
    多层印刷板具有双面螺旋互连结构

    公开(公告)号：US20020109573A1

    公开(公告)日：2002-08-15

    申请号：US10093482

    申请日：2002-03-11

    Applicant: NEC CORPORATION

    Inventor： Mizuki Iwanami

    IPC: H01F027/28

    CPC classification number: H01F17/0013 ,  H05K1/0298 ,  H05K1/165 ,  H05K3/4688 ,  H05K2201/086 ,  H05K2201/09336 ,  H05K2201/097

    Abstract: An inductor device having plural spiral-shaped interconnection structures connected to each other and extending in plural power source layers, the power source layers being in different levels of a multilayer printed board. The printed board having first and second current loops. The loops share part of a common current path.

    Abstract translation: 一种电感器件，具有多个螺旋形互连结构，彼此连接并在多个电源层中延伸，所述电源层处于多层印刷电路板的不同级别。 该印刷电路板具有第一和第二电流回路。 循环共享公共当前路径的一部分。

    Multi-layered printed wiring board
    54.
    发明申请
    Multi-layered printed wiring board 失效
    多层印刷线路板

    公开(公告)号：US20020108779A1

    公开(公告)日：2002-08-15

    申请号：US10046163

    申请日：2002-01-16

    Inventor： Tohru Ohsaka

    IPC: H05K001/11

    CPC classification number: H05K1/0216 ,  H05K2201/09336 ,  H05K2201/09345 ,  H05K2201/09354

    Abstract: A multi-layered printed wiring board is provided that is capable of securing required wiring density even with a decreased number of wiring layers and reducing radiation noises. The multi-layered printed wiring board has at least three wiring layers each at least having at least one power supply line or a ground line, and another kind of line, said wiring layers each having an outer edge. A ground line is formed at the outer edge of at least one of the wiring layers. A basic power supply line is formed inside the ground line. At least one power supply line extends from the basic power supply line. A plurality of electronic parts are mounted on at least one of the wiring layers. The at least one power supply line is wired to mounting positions of the electronic parts via at least one of the wiring layers.

    Abstract translation: 提供了一种多层印刷电路板，即使在布线层数量减少并且减少辐射噪声的情况下也能够确保所需的配线密度。 多层印刷电路板具有至少三个布线层，每个布线层至少具有至少一个电源线或接地线，并且另一种线，所述布线层各自具有外边缘。 在至少一个布线层的外边缘处形成接地线。 在地线内形成基本电源线。 至少一条电源线从基本电源线延伸。 多个电子部件安装在至少一个布线层上。 所述至少一个电源线经由所述布线层中的至少一个布线到所述电子部件的安装位置。

    Wiring board equipped with a line for transmitting a high frequency signal
    56.
    发明授权
    Wiring board equipped with a line for transmitting a high frequency signal 失效
    接线板配有发送高频信号的线路

    公开(公告)号：US5982256A

    公开(公告)日：1999-11-09

    申请号：US032244

    申请日：1998-02-27

    Applicant: Hiroshi Uchimura ,  Takeshi Takenoshita

    Inventor： Hiroshi Uchimura ,  Takeshi Takenoshita

    IPC: H01L21/3205 ,  H01L23/52 ,  H01P1/04 ,  H01P3/08 ,  H01P3/12 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H01P3/16

    CPC classification number: H01P3/088 ,  H01P1/047 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09845

    Abstract: A wiring board of the present invention is equipped with a laminated waveguide as a high-frequency signal transmission line. The laminated waveguide is composed of a dielectric substrate, a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate, a plurality of via-holes extending in a thickness direction in the dielectric substrate so that they electrically connect the pair of the main conductive layers, and a sub-conductive layer provided in the dielectric substrate so that it is parallel to the main conductive layers and is electrically connected to the via-holes, the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and in each row, the distance between adjacent via-holes is adjusted to less than 1/2 of a signal wavelength, a region surrounded with the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided. The transmittting line by the laminated waveguide which is formed in this wiring board has especially excellent transmitting characteristics of high-frequency signals. In addition, since this wiring board can be easily produced by a laminating technology of ceramics, this wiring board also has excellent productivity.

    Abstract translation: 本发明的布线基板配置有层叠波导作为高频信号传输线。 层压波导由电介质基板，层叠在电介质基板的上表面和下表面上的一对主导电层构成，多个通孔在电介质基板中沿厚度方向延伸，使得它们电连接 所述一对主导电层和设置在所述电介质基板中的副导电层，使得其与所述主导电层平行并且与所述通孔电连接，所述多个所述通孔形成两行延伸 在信号传输方向上彼此具有相互的距离，并且在每一行中，相邻通孔之间的距离被调整为小于信号波长的+ E，fra 1/2 + EE，被该对包围的区域 的主导电层和两列通孔形成信号传输区域，并且在信号传输区域的外侧的两侧设置有副导电层。 在该布线基板上形成的层叠波导的发送线具有特别优异的高频信号的发送特性。 此外，由于可以通过陶瓷的层压技术容易地制造该布线板，所以该布线基板也具有优异的生产率。

    Mounting structure for electronic component
    57.
    发明授权
    Mounting structure for electronic component 失效
    电子元器件的安装结构

    公开(公告)号：US5532658A

    公开(公告)日：1996-07-02

    申请号：US362805

    申请日：1994-12-22

    Applicant: Ken Tonegawa ,  Harufumi Mandai ,  Teruhisa Tsuru ,  Mitsuhide Katou ,  Koji Furutani

    Inventor： Ken Tonegawa ,  Harufumi Mandai ,  Teruhisa Tsuru ,  Mitsuhide Katou ,  Koji Furutani

    IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H01P5/00 ,  H01L23/48

    CPC classification number: H05K1/0243 ,  H05K1/0239 ,  H05K1/18 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09581 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/1006 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K3/28 ,  H05K3/305 ,  H05K3/3436 ,  Y02P70/611

    Abstract: An electronic component which is employed in the frequency range in the microwave band or above is mounted on a circuit board. The circuit board comprises two linear transmission line members, a ground electrode, and an electric insulating substrate provided with the transmission line members and the ground electrode on its major surface. The electronic component comprises external electrodes which are formed on its side surfaces. Holding patches which are formed on the lower surface of the electronic component are bonded to the ground electrode by solder members, thereby fixing the electronic component to the circuit board. At this time, small clearances are defined between the electronic component and the circuit board through the solder members, whereby the external electrodes are electromagnetically coupled with the transmission line members and the ground electrode through the clearances respectively. Thus, it is possible to obtain a mounting structure for an electronic component, which can suppress development of unnecessary inductance components.

    Abstract translation: 在微波波段以上的频率范围内使用的电子部件安装在电路基板上。 电路板包括两个线性传输线构件，接地电极和在其主表面上设置有传输线构件和接地电极的电绝缘基板。 电子部件包括形成在其侧表面上的外部电极。 形成在电子部件的下表面上的保持贴片通过焊料接合到接地电极，从而将电子部件固定到电路板。 此时，通过焊料部件在电子部件和电路基板之间形成小的间隙，由此外部电极分别通过间隙与传输线部件和接地电极电磁耦合。 因此，可以获得能够抑制不必要的电感成分的发展的电子部件的安装结构。

    Circuit board having printed thereon conductive patterns to be connected with input and output lead wires of acoustic surface wave filter element
    59.
    发明授权
    Circuit board having printed thereon conductive patterns to be connected with input and output lead wires of acoustic surface wave filter element 失效
    印刷有导电图案的电路板，与声表面波滤波器元件的输入和输出引线连接

    公开(公告)号：US4250473A

    公开(公告)日：1981-02-10

    申请号：US886607

    申请日：1978-03-14

    Applicant: Tomoji Gemba

    Inventor： Tomoji Gemba

    IPC: H01R12/00 ,  H03H9/145 ,  H05K1/02 ,  H05K3/34 ,  H05K9/00 ,  H03H9/04 ,  H01L41/04 ,  H03H9/26 ,  H03H9/32

    CPC classification number: H05K1/0243 ,  H03H9/14597 ,  H05K9/0039 ,  H05K1/0219 ,  H05K2201/0792 ,  H05K2201/09336 ,  H05K2201/10083 ,  H05K2201/10969 ,  H05K3/3447

    Abstract: An acoustic surface wave filter element provided with two input and two output pins connected with the input and the output interdigital electrodes, respectively and an earth pin connected with a filter element shield casing is disposed on one surface of a circuit board, with the five pins extending through corresponding through holes in the circuit board to the other surface of the circuit board on which the pins are connected with corresponding conductive circuit patterns of the circuit board. The circuit patterns include a first signal pattern to be connected with one of the input pins, a first earth pattern connected with the other of the input pins, a second and a third signal pattern connected with one and another of the output pins, and a second earth pattern connected with the earth pin of the filter element. The first and the second signal pattern have end portions opposedly positioned to each other, and an earth pattern portion is positioned between the opposed end portions of the first and the second signal pattern to connect the first and the second earth pattern with each other. Portions of the patterns positioned beneath the filter element are arrayed symmetrically about an axis lying on the center of the terminal of the end portion of the first signal pattern and external between the second and third signal patterns.

    Abstract translation: 一个声表面波滤波器元件分别设置有与输入和输出叉指电极相连的两个输入和两个输出引脚，一个与滤波器元件屏蔽壳连接的接地引脚设置在电路板的一个表面上，其中五个引脚 延伸通过电路板中相应的通孔延伸到电路板的与电路板的相应导电电路图形连接的另一个表面。 电路图案包括要与输入引脚之一连接的第一信号图案，与另一个输入引脚连接的第一接地图案​​，与一个和另一个输出引脚连接的第二和第三信号图案，以及 第二接地图与过滤元件的接地销连接。 第一和第二信号图案具有彼此相对定位的端部，并且接地图案部分位于第一和第二信号图案的相对端部之间，以将第一和第二接地图彼此连接。 位于过滤器元件下方的图案的部分围绕位于第一信号图案的端部的端子的中心上的轴对称地排列，并且在第二和第三信号图案之间是外部的。

    Multi-level printed circuit boards and memory modules including the same
    60.
    发明授权
    Multi-level printed circuit boards and memory modules including the same 有权

    公开(公告)号：US12075560B2

    公开(公告)日：2024-08-27

    申请号：US17741510

    申请日：2022-05-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jong-Hyun Seok ,  Yong-Jin Kim ,  Kyeongseon Park ,  Hwanwook Park

    IPC: H05K1/02 ,  H01P3/08 ,  H01L25/18 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/025 ,  H01P3/08 ,  H01L25/18 ,  H05K1/117 ,  H05K1/18 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09336 ,  H05K2201/09672 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545

    Abstract: A printed circuit board includes a first electrically conductive reference plane configured to distribute a first reference voltage applied thereto across a surface area of the first reference plane, and a second electrically conductive reference plane extending parallel to the first reference plane, and configured to distribute a second reference voltage applied thereto across a surface area of the second reference plane. A first layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more first signal lines extending adjacent the first reference plane. The first layer is divided into: (i) a first region in which the one or more first signal lines are disposed, (ii) a second region containing an additional plane that is configured to receive a third voltage and has smaller surface area relative to the surface areas of the first and second reference planes, and (iii) a third region containing a dielectric layer. A second layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more second signal lines extending adjacent the second reference plane. The second signal lines have linewidths that vary as a function of whether they are vertically aligned with the first region, the second region, or the third region.

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