公开(公告)号：US20030107444A1

公开(公告)日：2003-06-12

申请号：US09971973

申请日：2001-10-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsutomu Ieki ,  Yutaka Ida

IPC: H03B005/00

CPC classification number: H03B5/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0237 ,  H05K1/141 ,  H05K1/162 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/049 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a voltage controlled oscillator providing a strip line resonator in the inside layer of a multilayer substrate and less in the dispersion of oscillation frequency by humidity. SOLUTION: Polytetrafluoroethylene is used as the core material of the multilayer substrate. Since the polytetrafluoroethylene has smaller water absorptivity than glass epoxy, the change of dielectricity to the change of humidity. As a result, also the change of the resonant frequency of the strip line resonator formed in the inside layer of the multilayer substrate is small, as a result, also the change of oscillation frequency becomes small. Then, since the change of the oscillation frequency is small, control voltage sensitivity can be reduced, and thus, C/N characteristics is improved. Then, since also the property of the polytetrafluoroethylene material itself is small in dielectric loss comparing with the glass epoxy and also specific dielectricity is small, the Q of resonant system is improved, and thereby, the C/N characteristics is improved too.

Abstract translation: 要解决的问题：提供一种在多层基板的内层中提供带状线谐振器的压控振荡器，并且在通过湿度的振荡频率的分散中较少。 解决方案：使用聚四氟乙烯作为多层基板的芯材。 由于聚四氟乙烯具有比玻璃环氧树脂更小的吸水率，因此介电性变化对湿度的变化。 结果，形成在多层基板的内层中的带状线谐振器的谐振频率的变化也小，结果也振荡频率的变化也变小。 然后，由于振荡频率的变化小，所以可以降低控制电压灵敏度，从而提高C / N特性。 而且，与玻璃环氧树脂相比，由于聚四氟乙烯材料本身的介电损耗小，所以介电特性小，所以谐振系统的Q值提高，C / N特性也提高。

公开(公告)号：US5272597A

公开(公告)日：1993-12-21

申请号：US883360

申请日：1992-05-15

Applicant: Alfred G. Staples ,  Gerald E. Roberts

Inventor： Alfred G. Staples ,  Gerald E. Roberts

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K3/301 ,  H05K1/0243 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K3/3421

Abstract: A clip for surface-mounting a coupled-dual resonator crystal to a circuit board includes an elongated housing shaped complementary to the housing of the crystal and having an opening along a side for receiving the crystal. A tab spaces first and second shielding portions which overlie the end of the crystal housing. A first shield portion engages the middle ground terminal of the crystal shielding the input and output terminals, while the second shield extends from the first shield to overlie the output terminal, likewise shielding it from the input terminal. Distal portions of the input, output and common terminals, together with pads at the opposite end of the clip, mount the clip mechanically to the surface of a circuit board.

Abstract translation: 用于将耦合双谐振器晶体表面安装到电路板的夹子包括成形为与晶体壳体互补的细长壳体，并具有沿着用于接收晶体的一侧的开口。 凸片将第一和第二屏蔽部分覆盖在晶体壳体的端部上。 第一屏蔽部分接合屏蔽输入和输出端子的晶体的中间接地端子，而第二屏蔽件从第一屏蔽件延伸以覆盖输出端子，同样屏蔽输入端子。 输入，输出和公共端子的远端与夹子相对端的焊盘一起，将夹子机械地安​​装到电路板的表面。

公开(公告)号：US4480384A

公开(公告)日：1984-11-06

申请号：US351098

申请日：1982-02-23

Applicant: Jean Bolzt ,  Jean-Pierre Calame

Inventor： Jean Bolzt ,  Jean-Pierre Calame

IPC: H03H9/02 ,  G04G17/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0243 ,  G04G17/04 ,  H05K1/184 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49579

Abstract: An elongate opening is formed in the substrate of the printed circuit, from which project lugs formed in the copper layer on the substrate. The lugs are shaped to form a supporting cradle for the resonator which is soldered or stuck to the lugs with its base in contact with the end of the opening. Two conductive tracks extend across the opening to two resonator terminals, in the form of pins, to which they are soldered.

Abstract translation: 在印刷电路的基板中形成一个细长的开口，从基底上的铜层中形成突出的凸起。 凸耳被成形为形成用于谐振器的支撑支架，其被焊接或粘附到凸耳上，其底部与开口的端部接触。 两个导电轨道穿过开口延伸到两个谐振器端子，以引脚的形式被焊接到它们。

公开(公告)号：US20240260167A1

公开(公告)日：2024-08-01

申请号：US18415119

申请日：2024-01-17

Applicant: CANON KABUSHIKI KAISHA

Inventor： KOJI NOGUCHI ,  MITSUTOSHI HASEGAWA ,  SATORU HIGUCHI

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498 ,  H01R12/62 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H01L23/49838 ,  H01R12/62 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/181 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10068

Abstract: A printed wiring board has a first conductive layer including a second electrode group bonded to a first electrode group of a flexible printed circuit board, and a second conductive layer, and a plane including the second conductive layer includes a first region including a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary, and a first boundary portion is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of four sides in a prescribed direction, and a second boundary portion is positioned within a range of 0.5 times or more and 5 times or less the length of the short in a prescribed direction, and a density of the second conductive layer in the first region is higher than that in the second region.

公开(公告)号：US20180175274A1

公开(公告)日：2018-06-21

申请号：US15578472

申请日：2016-06-02

Applicant: WISOL CO., LTD.

Inventor： Jung Rae NOH ,  Jae Hyung CHOI ,  Yo Sep CHOI

IPC: H01L41/04 ,  H02N2/04 ,  H05K1/18

CPC classification number: H01L41/042 ,  H01L41/094 ,  H02N2/04 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/10068 ,  H05K2203/0292

Abstract: A piezoelectric vibration module includes a vibration plate adapted to have one end fixed and the other end not fixed and driven in a vertical direction based on the fixed first end, a first piezoelectric element attached to the top or bottom of the vibration plate and adapted to generate a vibration power when power is applied, and a weight formed in the other end of the top or bottom of the vibration plate and adapted to control the vibration frequency of the piezoelectric vibration module. The first piezoelectric element is attached to the top or bottom of the vibration plate with a predetermined interval from a fixed point at the one end of the vibration plate.

公开(公告)号：US20180159499A1

公开(公告)日：2018-06-07

申请号：US15803699

申请日：2017-11-03

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Hidetaro NAKAZAWA ,  Takashi MATSUDA

IPC: H03H9/02 ,  H03H9/05 ,  H05K1/02 ,  H03H9/72

CPC classification number: H03H9/02834 ,  H03H9/02102 ,  H03H9/02535 ,  H03H9/0523 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1085 ,  H03H9/72 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0243 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2203/1327

Abstract: An electronic component includes: a first substrate; a second substrate that includes a functional element formed on a lower surface of the second substrate, the second substrate being mounted on the first substrate so that the functional element faces an upper surface of the first substrate across an air gap; and an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate.

公开(公告)号：US09883589B2

公开(公告)日：2018-01-30

申请号：US14764795

申请日：2014-07-30

Applicant: KYOCERA Corporation

Inventor： Kouichi Kawasaki

IPC: H05K7/10 ,  H05K1/11 ,  H01L23/13 ,  H01L23/498 ,  H01L23/24 ,  H01L23/00 ,  H05K3/34 ,  H05K1/18 ,  H05K1/02 ,  H01R9/00 ,  H01L23/48 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

公开(公告)号：US20150373846A1

公开(公告)日：2015-12-24

申请号：US14764795

申请日：2014-07-30

Applicant: KYOCERA CORPORATION

Inventor： Kouichi KAWASAKI

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

Abstract translation: 布线板具有绝缘基板和在绝缘基板上的平面图中彼此相邻设置的多个电极，电极在外周具有开口，并且具有从外周到内部的狭缝，以及 在彼此相邻的两个电极中，一个电极中的狭缝具有与另一个电极的外周相交的中心线。

公开(公告)号：US20150188024A1

公开(公告)日：2015-07-02

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki ISHIGAMI ,  Hidefumi NAKAMURA ,  Yukihiko SHIOHARA ,  Taku KAWASAKI ,  Fumiaki AKAHANE

IPC: H01L41/047 ,  H01L41/053 ,  B22F3/105 ,  H01L41/29 ,  B22F5/12 ,  H05K1/03 ,  H01L41/333

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。

公开(公告)号：US08836095B2

公开(公告)日：2014-09-16

申请号：US13392540

申请日：2011-03-11

Applicant: Yoshiki Maeda ,  Tsuyoshi Kusai

Inventor： Yoshiki Maeda ,  Tsuyoshi Kusai

IPC: H05K5/06 ,  H05K1/11 ,  H01L23/053 ,  H03H9/10

CPC classification number: H03H9/1021 ,  H01L23/053 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16195 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/10068 ,  Y02P70/613 ,  H01L2924/00

Abstract: A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face.

Abstract translation: 电子部件组件的基座保持电子部件元件。 底座在平面图中具有矩形形状的底面。 底座包括在底面上具有矩形形状的一对端子电极。 该一对端子电极用导电接合材料接合在外部电路基板上。 该对端子电极具有相互对称的形状。 每个端子电极具有与底面的长边相邻或在其长边的边缘上的长边。 每个端子电极的长边平行于底面的长边设置。 每个端子电极的长边长度大于底面长边长度的一半。