公开(公告)号：US09847165B2

公开(公告)日：2017-12-19

申请号：US14877981

申请日：2015-10-08

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/04 ,  H05K1/00 ,  H05K3/00

CPC classification number: H01F27/2804 ,  H01F41/041 ,  H01F2027/2809 ,  H05K1/00 ,  H05K1/165 ,  H05K3/00 ,  H05K3/4635 ,  H05K2201/09063

Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

公开(公告)号：US20170347468A1

公开(公告)日：2017-11-30

申请号：US15604902

申请日：2017-05-25

Applicant: LG ELECTRONICS INC.

Inventor： Sangin KIM

IPC: H05K5/00 ,  H05K5/03 ,  H05K5/02 ,  H04L12/66 ,  H04W76/02 ,  H04R1/02 ,  H04L29/08 ,  H04W88/16 ,  H05K1/18 ,  H04W4/00

CPC classification number: H05K5/0017 ,  G06F1/1637 ,  G06F1/1688 ,  G06F1/181 ,  G07F17/32 ,  G07F17/3202 ,  G07F17/3223 ,  H01M2/00 ,  H04L12/282 ,  H04L12/66 ,  H04L67/141 ,  H04R1/023 ,  H04R1/025 ,  H04R5/02 ,  H04R2420/07 ,  H04W4/80 ,  H04W76/10 ,  H04W88/16 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0217 ,  H05K5/03 ,  H05K2201/09063

Abstract: A hub comprises a main body with a speaker; a communication module included in the main body; a window formed of a transparent material; a display panel for displaying a screen based on information exchanged via the communication module; and a cover housing coupled to a top of the main body and having a display panel and an opening at an upper surface thereof. The window is provided on an upper surface of the display panel, wherein a normal vector with respect to a predetermined plane in which the opening falls is at an acute angle relative to a horizontal plane, and a vector acquired by orthogonally projecting the normal vector with respect to the horizontal plane faces forward. A portion of the inner surface of the cover housing is parallel with the normal vector, and the window is provided so that an upper surface faces the direction of the normal vector.

公开(公告)号：US20170347454A1

公开(公告)日：2017-11-30

申请号：US15450131

申请日：2017-03-06

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Shiro HARASHIMA

IPC: H05K1/18 ,  H01R24/64

CPC classification number: H05K1/18 ,  H01R12/725 ,  H01R24/62 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0295 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

公开(公告)号：US20170346243A1

公开(公告)日：2017-11-30

申请号：US15262475

申请日：2016-09-12

Applicant: ACBEL POLYTECH INC.

Inventor： Wei HONG ,  Jia-Jiann HUANG ,  Hsiao-Kai CHEN ,  Chih-Chieh TSENG

IPC: H01R13/74 ,  H01R13/6594 ,  H01R13/66 ,  H05K1/11 ,  H01R13/621 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R13/748 ,  H01R13/6215 ,  H01R13/6594 ,  H01R13/665 ,  H01R13/719 ,  H05K1/0224 ,  H05K1/0231 ,  H05K1/111 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10265

Abstract: A filtered connector is mounted on a casing and includes a connection port and a filter board. An electrode plate mounted on one end of the connection port and electrically isolated from the casing is securely mounted through a through hole of the casing. The filter board has a circuit board assembly, multiple grounding spring plates and multiple filtering capacitors. The circuit board assembly has a slot to be mounted through by the electrode plate. The grounding spring plates are mounted on a surface of the circuit board assembly and electrically contact the casing. The filtering capacitors are electrically connected between the electrode plate and the grounding spring plates. As the filter board is not mounted inside the connection port, only the filter board is to be mounted without replacing the connection port, thereby lowering users' expense in installation of the filter board.

公开(公告)号：US09801282B2

公开(公告)日：2017-10-24

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K3/18 ,  H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

公开(公告)号：US20170303386A1

公开(公告)日：2017-10-19

申请号：US15098533

申请日：2016-04-14

Applicant: L-3 Communications Corporation

Inventor： Gerald COLES

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/0216 ,  H05K2201/0187 ,  H05K2201/0723 ,  H05K2201/09063 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A printed circuit board (PCB), electronic assembly, and method are provided. A PCB adapted to receive a radio frequency (RF) chip includes one or more features that extend through at least a portion of the depth of the PCB. The features are filled with an RF absorber composite comprising a binder and an RF absorber material. The features are positioned in the PCB to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.

公开(公告)号：US20170294835A1

公开(公告)日：2017-10-12

申请号：US15536846

申请日：2014-12-18

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： Mattias ANDERSSON ,  Martin ETSARE ,  Per FERM ,  Roger HOFFSTRÖM ,  Igor PEREZ-URIA

IPC: H02M1/44 ,  H03H7/42 ,  H02M1/12

CPC classification number: H02M1/44 ,  H01F2017/065 ,  H02M1/12 ,  H02M1/126 ,  H02M2001/0064 ,  H03H7/427 ,  H03H2001/0035 ,  H05K1/141 ,  H05K1/18 ,  H05K9/00 ,  H05K2201/086 ,  H05K2201/09063

Abstract: The invention is directed towards a power source interface module for electronic circuits supplied by power from a power source as well as a power supply arrangement for electronic circuits comprising such a power source interface module. The module comprises a first circuit board carrying components, the first circuit board comprising a number of stacked circuit board layers as well as at least two openings, at least a part of a filter comprising at least one pair of magnetically coupled inductive coils, a core with two core legs, each core leg stretching through a corresponding opening in the circuit board, wherein each coil is wound around a corresponding core leg, the turns of the coils stretch through the circuit board layers, and each layer between an upper outer layer and a lower outer layer comprises at least a part of one turn.

公开(公告)号：US09788428B2

公开(公告)日：2017-10-10

申请号：US15135248

申请日：2016-04-21

Applicant: Innodisk Corporation

Inventor： Chih-Hsing Chen ,  Hsiao-Yu Wang

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: The invention provides a stacked structure comprising a master circuit board and at least two slave circuit boards. The master circuit board comprises a plurality of connecting seats. Each slave circuit board is equipped with a connector, and defined with a plurality of post-production process areas. Wherein the connector of each slave circuit board is disposed on one of post-production process areas, and inserted into the corresponding connecting seat. When the connector of the slave circuit board must be through other slave circuit boards in order to insert the corresponding connecting seat, the post-production process areas that are disposed on other slave circuit boards and impede the connection between the connector and the corresponding connecting seat will be cut into hollow areas. Accordingly, the connector of the slave circuit board is capable of inserting the corresponding connecting seat through the hollow areas of other slave circuit boards.

公开(公告)号：US09788426B2

公开(公告)日：2017-10-10

申请号：US15327476

申请日：2015-07-10

Applicant: FUJIKURA LTD. ,  DDK Ltd.

Inventor： Yuki Ishida ,  Masayuki Suzuki ,  Harunori Urai

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/77

CPC classification number: H05K1/115 ,  H01R12/77 ,  H01R12/78 ,  H01R12/88 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09409

Abstract: A printed wiring board including: a first substrate on which a plurality of pads to be connected to a connector is arranged to form a front array and a rear array in two rows; a second substrate that is laminated on the first substrate and formed with first wirings connected to first pads of the front array and second wirings connected through vias to second pads of the rear array; engageable parts that are to be engaged with engagement parts of the connector; and one or more reinforcement layers that are provided at the frontward side in the connecting direction than the engageable parts of the first substrate and/or the second substrate. The wirings each have a part formed to have a constant width along the inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width in the inserting direction of the connector.

公开(公告)号：US09780471B2

公开(公告)日：2017-10-03

申请号：US15313401

申请日：2015-05-18

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Nicolaas Antonie Van Rijswijk

IPC: H01R12/73 ,  H05K1/14 ,  H05K1/11 ,  H05K3/36 ,  H01R12/70

CPC classification number: H01R12/737 ,  H01R12/7023 ,  H05K1/11 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).