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    Package for integrated devices
    62.
    发明授权
    Package for integrated devices 失效
    集成设备包

    公开(公告)号：US5367192A

    公开(公告)日：1994-11-22

    申请号：US165043

    申请日：1993-12-06

    Applicant: Angelo Massironi

    Inventor： Angelo Massironi

    IPC: H01L23/495 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48 ,  H05K1/08

    CPC classification number: H01L23/49548 ,  H05K3/308 ,  H01L2924/0002 ,  H05K2201/09709 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K3/3447

    Abstract: This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins to be inserted in holes of the supporting plates and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some of the contact pins are provided with protruding portions defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.

    Abstract translation: 用于固定在支撑板上，特别是印刷电路上的集成器件的封装包括插入支撑板的孔中并被焊接到其上的接触针。 为了防止包装翻倒，这可能导致部件之间的短路，至少一些接触销设置有突出部分，突出部分限定与支撑板配合的支座，以限制包装相对于板的倾斜度。

    Printed circuit board with through-hole connection
    63.
    发明授权
    Printed circuit board with through-hole connection 失效
    带通孔连接的印刷电路板

    公开(公告)号：US4787853A

    公开(公告)日：1988-11-29

    申请号：US30505

    申请日：1987-03-27

    Applicant: Yutaka Igarashi

    Inventor： Yutaka Igarashi

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42 ,  H05K1/00

    CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K3/308 ,  H05K3/3421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10704 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/0455 ,  H05K3/321 ,  H05K3/42 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A printed circuit board is disclosed which comprises a plurality of non-through holes into thickness direction in one surface of the board, a plurality of through holes in some of the non-through holes to open through opposite surface of the board and having a smaller inside diameter than the non-through holes, a plurality of first conductive lands on the periphery of the openings of the non-through holes in one surface of the board, a plurality of second conductive lands on the periphery of the openings in opposite surface of the through holes and having the smaller outside diameter than the second lands on the periphery of the openings of the non-through holes, a conductor layer in inside wall of the non-through holes and the through holes for connecting the first lands in one surface and the second conductive lands in opposite surface of board, and conductive patterns formed in one surface and opposite surface of the board respectively, which invention is capable of including the great number of the conductive patterns as necessary for mounting the electric component such as PGA or HPC without multilayering the board or going around of the conductive patterns, because of the greater number of the spaces between the second lands can be formed in opposite surface.

    Abstract translation: 公开了一种印刷电路板，其包括在板的一个表面中的厚度方向上的多个非通孔，一些非通孔中的多个通孔，通过板的相对表面打开并具有较小的 在所述板的一个表面中的所述非通孔的开口周边上的多个第一导电焊盘，所述多个第一导电焊盘在所述板的一个表面中的所述开口的周边上， 所述通孔具有比所述非通孔的开口周边上的第二焊盘小的外径，所述非通孔的内壁中的导体层和用于将一个表面中的第一焊盘连接的通孔 并且板的相对表面中的第二导电焊盘和分别形成在板的一个表面和相对表面中的导电图案，其能够包括gr 由于可以在相对的表面上形成第二焊盘之间的更大数量的空间，因此可以根据需要安装诸如PGA或HPC的电气部件的数量的导电图案，而不需要多层导电板或导电图案。

    Electronic component with lead terminals and method of manufacturing said electronic component
    64.
    发明授权
    Electronic component with lead terminals and method of manufacturing said electronic component 失效
    具有引线端子的电子部件和制造所述电子部件的方法

    公开(公告)号：US4785990A

    公开(公告)日：1988-11-22

    申请号：US891557

    申请日：1986-07-29

    Applicant: Kunikazu Nakahara ,  Kazuhiro Yasuda

    Inventor： Kunikazu Nakahara ,  Kazuhiro Yasuda

    IPC: H01G4/228 ,  H05K3/30 ,  B23K31/02

    CPC classification number: H01G4/228 ,  H05K3/308 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  Y10T29/49121

    Abstract: An electronic component with lead terminals, includes an electronic component element, electrodes respectively formed on opposite end faces of the electronic component element, and lead terminals respectively connected to the electrodes for electrical conduction, and each of the lead terminals having a large width portion formed at one end of its small width tip portion, and the large width portions of the lead terminals being conductively connected to the electrodes of the electronic component element. The disclosure is also directed to a method of manufacturing such electronic component.

    Abstract translation: 具有引线端子的电子部件包括电子部件元件，分别形成在电子元件的相对端面上的电极和分别与电极连接的导电端子，导电端子形成为宽度大的部分 在其小宽度尖端部分的一端处，并且引线端子的大宽度部分导电地连接到电子元件的电极。 本公开还涉及制造这种电子部件的方法。

    Method of mounting thick film hybrid circuits in printed circuit boards
    65.
    发明授权
    Method of mounting thick film hybrid circuits in printed circuit boards 失效
    在印刷电路板上安装厚膜混合电路的方法

    公开(公告)号：US4294007A

    公开(公告)日：1981-10-13

    申请号：US108624

    申请日：1979-12-31

    Applicant: Paul R. Ellis, Jr.

    Inventor： Paul R. Ellis, Jr.

    IPC: H01R4/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K3/366 ,  H01R12/718 ,  H01R4/028 ,  H05K3/3447 ,  H05K1/0306 ,  H05K2201/10386 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/308 ,  H05K3/306 ,  H05K3/3468 ,  Y10T29/49126 ,  Y10T29/49799 ,  Y10T29/4981

    Abstract: In this method of fabricating an electrical circuit assembly, a thick film hybrid substrate is held in an inverted position as apertured glass-ceramic beads are placed over the end leads on the substrate. A drop of liquid flux is then applied to the apertures to hold the beads in place. After the flux dries, the leads are inserted into plated-through holes in a circuit board, with the beads locating portions of the leads above the board. Following wave soldering of the board, the beads are fractured with a sharp instrument prior to a cleaning operation which removes bead parts from the soldered assembly. In this manner, the substrate is flexibly mounted in the board so that the substrate can be tilted without damaging it.

    Abstract translation: 在这种制造电路组件的方法中，当多孔玻璃陶瓷珠置于衬底上的端引线上时，厚膜混合衬底保持在倒置位置。 然后将一滴液体通量施加到孔以将珠保持在适当位置。 焊剂干燥后，将引线插入到电路板的电镀通孔中，其中引线将引线定位在板上方的部分。 在板的波峰焊之后，在清洁操作之前，珠子用尖锐的工具断裂，从焊接的组件中去除了珠子部件。 以这种方式，基板被柔性地安装在板中，使得基板可以倾斜而不损坏基板。

    Multi-position electronic component mounting
    66.
    发明授权
    Multi-position electronic component mounting 失效
    多位置电子元件安装

    公开(公告)号：US4171855A

    公开(公告)日：1979-10-23

    申请号：US803879

    申请日：1977-06-06

    Applicant: Jef Raskin

    Inventor： Jef Raskin

    IPC: H01R12/70 ,  H05K3/30 ,  H05K3/34 ,  H05K1/08

    CPC classification number: H01R12/7076 ,  H05K3/308 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2201/10484 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K3/3447

    Abstract: An electronic component is provided having mounting leads configured as concentric arcs centered about a desired axis of rotation. The leads may therefore be inserted into a mounting board, and the component rotated to a desired angle with respect to the surface of the mounting board. In some embodiments, one or more of the mounting leads is provided with tabs or other positioning elements to facilitate the positioning of the component at any of a number of selected angles relative to the mounting board.

    Abstract translation: 提供了一种电子部件，其具有被构造成围绕期望的旋转轴线居中的同心圆弧的安装引线。 因此，引线可以插入到安装板中，并且部件相对于安装板的表面旋转到期望的角度。 在一些实施例中，一个或多个安装引线设置有突片或其它定位元件，以便于相对于安装板以多个选定角度的任何一个定位元件。

    Daughter board contact
    67.
    发明授权
    Daughter board contact 失效
    子板联系

    公开(公告)号：US3941442A

    公开(公告)日：1976-03-02

    申请号：US482366

    申请日：1974-06-24

    Applicant: Lindsay Carlton Friend

    Inventor： Lindsay Carlton Friend

    IPC: H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01R13/54

    CPC classification number: H05K3/368 ,  H01R12/714 ,  H05K2201/0311 ,  H05K2201/10871 ,  H05K3/325 ,  H05K3/3447

    Abstract: An electrical connection between spaced and parallel mother and daughter boards including terminals secured to the mother board and projecting toward the daughter board having a pivot link arm with a daughter board-engaging member at the free end of the link arm and a daughter board spring contact. A number of terminals are secured to the mother board all facing in the same direction so that upon movement of the daughter board in a direction parallel to the mother board the links pivot the daughter board down toward the mother board and bring contact pads on the daughter board in engagement with the spring contacts.

    Abstract translation: 间隔和平行的母板和母板之间的电气连接包括固定到母板并且朝向子板突出的端子的端子，该端子具有在连接臂的自由端处具有子板接合构件的枢转连杆臂和子板弹簧触点 。 多个端子被固定到母板上，全部面向相同的方向，使得当子板在与母板平行的方向上移动时，连接件将子板向下枢转到母板，并将接触垫带到母体上 与弹簧触点接合。

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