公开(公告)号：US09497883B2

公开(公告)日：2016-11-15

申请号：US14223668

申请日：2014-03-24

Applicant: Yokoyama Tetsuo ,  Sanamoto Masashi

Inventor： Yokoyama Tetsuo ,  Sanamoto Masashi

IPC: H05B6/04 ,  H05B6/06 ,  H05K1/02 ,  H05K7/06 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K7/20 ,  H05K1/0203 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/10166

Abstract: A noise suppression circuit board design to provide a power supply to an inductive heating element is disclosed. The noise suppression circuit provides a configuration for a multi-layer circuit board that has radiation noise emissions below the CISPR 11 (limits and methods of measurements of radio disturbance characteristics of industrial, scientific and medical (ISM) radio-frequency equipment) thresholds in the 30 MHz to 1 GHz frequency range.

Abstract translation: 公开了一种用于向感应加热元件提供电源的噪声抑制电路板设计。 噪声抑制电路为具有低于CISPR 11的辐射噪声发射（工业，科学和医疗（ISM）射频设备的无线电干扰特性的限制和测量方法）阈值的多层电路板提供了一个配置。 30 MHz至1 GHz频率范围。

公开(公告)号：US09478488B2

公开(公告)日：2016-10-25

申请号：US14154291

申请日：2014-01-14

Applicant: Intel Corporation

Inventor： Damion T. Searls ,  Edward P. Osburn

IPC: H05K1/11 ,  H05K1/14 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/49844 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10166 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In one embodiment, the present invention includes a semiconductor device mounted to a first side of a circuit board; and at least one voltage regulator device mounted to a second side of the circuit board, the second side opposite to the first side. Examples of the voltage regulator devices include output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

Abstract translation: 在一个实施例中，本发明包括安装到电路板的第一侧的半导体器件; 以及安装到电路板的第二侧的至少一个电压调节器装置，第二侧与第一侧相对。 电压调节器装置的示例包括输出滤波器，电感器，电容器等。 在某些实施例中，器件可以位于半导体器件的正下方。

公开(公告)号：US20160295682A1

公开(公告)日：2016-10-06

申请号：US15090207

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi Tashima

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

Abstract translation: 电子控制单元包括基板，电子元件，散热器，盖子，蓄热器和螺钉。 在基板上形成布线图形。 电子部件安装在基板上，并在其通电时产生热量。 散热器沿其厚度方向设置在基板的一侧。 盖由树脂制成，并且在其厚度方向上设置在基板的另一侧。 蓄热器固定在基板侧的盖的一部分上，并且与盖侧的基板的表面接触。 螺钉的一端连接到散热器。 螺杆的中心部分沿其厚度方向穿过穿过基底的孔插入。 螺杆的另一端连接到蓄热器。

公开(公告)号：US09461549B2

公开(公告)日：2016-10-04

申请号：US14339859

申请日：2014-07-24

Applicant: DENSO CORPORATION

Inventor： Yuuki Takemoto ,  Katsutoyo Misawa ,  Yuuichi Handa ,  Syotarou Yamasaki ,  Syuji Kurauchi ,  Kenta Hatakenaka

IPC: H01F5/00 ,  H02M3/00 ,  H02M3/335 ,  B60L11/00 ,  H02M3/337 ,  H05K1/18 ,  H05K1/02

CPC classification number: H02M3/33507 ,  B60L11/00 ,  B60L15/007 ,  B60L2210/10 ,  H01F5/00 ,  H02M3/00 ,  H02M3/337 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10515 ,  Y02T10/645 ,  Y02T10/7216

Abstract: An electric power source device has a transformer, a primary-side semiconductor module, a secondary-side semiconductor module, a secondary-side electrical component, a base plate and a circuit substrate on which substrate-side electrical components are mounted. The primary-side semiconductor module has a larger exterior size than the secondary-side electrical component. The primary-side semiconductor module and the secondary-side electrical component form a stacked section. In the stacked section, the secondary-side electrical component is stacked, in a vertical direction, i.e. a direction of a normal line of a mounting surface of the base plate, on the primary-side semiconductor module. The primary-side semiconductor module is directly mounted on the mounting surface. At least a part of the substrate-side electrical components is arranged inside of the primary-side semiconductor module in a horizontal direction, and inside of a second surface of the stacked section toward the mounting surface along the normal line.

Abstract translation: 电源装置具有安装有基板侧电气部件的变压器，初级侧半导体模块，二次侧半导体模块，二次侧电气部件，基板以及电路基板。 初级侧半导体模块具有比次级侧电气部件更大的外部尺寸。 初级侧半导体模块和次级侧电气部件形成堆叠部。 在堆叠部分中，次级侧电气元件在初级侧半导体模块上沿垂直方向，即基板的安装表面的法线方向堆叠。 初级侧半导体模块直接安装在安装面上。 基板侧电气部件的至少一部分在水平方向配置在一次侧半导体模块的内部，在堆叠部的第二面的内侧沿着法线配置在安装面上。

公开(公告)号：US20160286639A1

公开(公告)日：2016-09-29

申请号：US15037266

申请日：2014-10-21

Applicant: ZF FRIEDRICHSHAFEN AG

Inventor： Wilfried LASSMANN ,  Michael SPERBER

IPC: H05K1/02 ,  H01L23/552 ,  H05K1/09 ,  H01L23/498

CPC classification number: H05K1/0265 ,  H01L23/49822 ,  H01L23/552 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/09 ,  H05K2201/0723 ,  H05K2201/09254 ,  H05K2201/09327 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/10166 ,  H01L2924/00

Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.

Abstract translation: 多功能高电流电路板包括具有用于传导电流的多个层的导电层，包括用于切换电负载的至少一个电源断路器的开关层，包括至少一个控制元件的控制层，以控制 至少一个电源断路器，用于屏蔽电流传导层与控制层和开关层的至少一个屏蔽元件。

公开(公告)号：US09444015B2

公开(公告)日：2016-09-13

申请号：US14743910

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H05B33/08 ,  H01L33/38 ,  G09G3/32 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  H01L33/62 ,  F21Y105/00 ,  F21Y113/00 ,  H01L33/20 ,  H01L33/40

CPC classification number: H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US09439533B2

公开(公告)日：2016-09-13

申请号：US14038966

申请日：2013-09-27

Applicant: Nestec S.A.

Inventor： Stefan Etter ,  Urs Gaudenz ,  Gilles Gavillet ,  Thomas Hodel ,  Alexandre Kollep ,  Peter Möri ,  Renzo Moser ,  Peter Preisig ,  Robin Schwab

IPC: A01K63/06 ,  H05B3/78 ,  A47J31/44 ,  A47J31/54 ,  F24H1/10 ,  F24H9/20 ,  H05K1/18 ,  H05K3/30 ,  A47J31/40 ,  H01H37/52

CPC classification number: A47J31/441 ,  A47J31/407 ,  A47J31/542 ,  A47J31/545 ,  F24H1/101 ,  F24H9/2028 ,  H01H37/52 ,  H05K1/18 ,  H05K3/306 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/105 ,  H05K2201/2036

Abstract: A liquid food of beverage preparation machine that includes an electric supply circuit connectable to an electric power source; a heater powered by the electric supply circuit; and a thermal fuse device in thermal communication with the heater and associated with the electric supply circuit, the fuse device being arranged to interrupt the electric supply circuit from the power source when the heater exceeds a temperature limit. The thermal fuse device is reversible and includes a switch for automatically interrupting the electric supply circuit when the heater exceeds the temperature limit, the switch being operable by a user to close the electric supply circuit when the heater has a temperature that has returned below the temperature limit.

Abstract translation: 1.一种饮料制备机的液体食品，包括可连接到电源的电源电路; 由供电电路供电的加热器; 以及与所述加热器热连通并与所述电源电路相关联的热熔丝装置，所述保险丝装置被布置成当所述加热器超过温度限制时从所述电源中断所述供电电路。 热保险丝装置是可逆的，并且包括用于当加热器超过温度限制时自动中断供电电路的开关，当加热器的温度已经回到低于温度时，开关可由用户操作以闭合供电电路 限制。

公开(公告)号：US20160219705A1

公开(公告)日：2016-07-28

申请号：US15005345

申请日：2016-01-25

Applicant: Infineon Technologies AG

Inventor： Reinhold Bayerer

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/142 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/144 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/04 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/1059 ,  H01L2924/00

Abstract: A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.

Abstract translation: 功率半导体模块装置包括具有可控功率半导体部件的半导体模块，布置在半导体模块外部的第一印刷电路板（PCB），以及布置在半导体模块外部并具有第二PCB的控制单元。 控制单元被配置为控制可控功率半导体部件。 可控功率半导体部件具有形成功率半导体部件的负载路径的第一负载端子和第二负载端子，以及用于控制负载路径的控制端子。 第一个PCB具有与负载路径串联连接的导体轨道。 第一和第二PCB彼此间隔开并且通过销彼此电连接。

公开(公告)号：US20160219689A1

公开(公告)日：2016-07-28

申请号：US15091564

申请日：2016-04-05

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Hideyo NAKAMURA ,  Masafumi HORIO

IPC: H05K1/02 ,  H05K1/03 ,  H01L25/065 ,  H05K1/18

CPC classification number: H05K1/025 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/73265 ,  H02M7/003 ,  H02M7/487 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/1053 ,  H01L2924/00014

Abstract: A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second circuit board on which a second switching element and a second diode connected in inverse parallel are mounted, a printed circuit board disposed opposite the first circuit board and the second circuit board, and a plurality of conductive posts which electrically connect the first switching element, the second switching element, the first diode, the second diode, the first circuit board, or the second circuit board and metal layers of the printed circuit board. The first switching element and the second switching element are connected in anti-series to form a bidirectional switch.

Abstract translation: 一种半导体器件包括：第一电路板，其上安装有逆并联连接的第一开关元件和第一二极管;第二电路板，其上安装有并联连接的第二开关元件和第二二极管，印刷电路板 与第一电路板和第二电路板相对设置的多个导电柱，将第一开关元件，第二开关元件，第一二极管，第二二极管，第一电路板或第二电路板电连接的多个导电柱，以及 印刷电路板的金属层。 第一开关元件和第二开关元件反串联连接以形成双向开关。

公开(公告)号：US09380698B1

公开(公告)日：2016-06-28

申请号：US14644183

申请日：2015-03-10

Applicant: VivaLnk Limited (Cayman Islands)

Inventor： Jiang Li ,  Junfeng Mei

IPC: G06K7/08 ,  G06K19/02 ,  G06K19/06 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14 ,  A61B5/00 ,  H04B1/3827 ,  H04B5/00

CPC classification number: H05K1/0283 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6825 ,  A61B5/6828 ,  A61B5/6829 ,  A61B5/6833 ,  A61B2562/046 ,  H04B1/385 ,  H04B2001/3866 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1316

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.