中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

527 records (took 0.018 seconds)

    Conductive circuit structure having an electrically conductive surface fixed by collar walls
    84.
    发明授权
    Conductive circuit structure having an electrically conductive surface fixed by collar walls 失效
    导电电路结构，其具有由套环壁固定的导电表面

    公开(公告)号：US06490169B1

    公开(公告)日：2002-12-03

    申请号：US09717402

    申请日：2000-11-22

    Applicant: Hiroshi Watanabe

    Inventor： Hiroshi Watanabe

    IPC: H05K114

    CPC classification number: H01R12/79 ,  H02G5/04 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K3/202 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09854 ,  H05K2201/09863

    Abstract: An electrically conductive circuit conductor 2 is disposed on an insulating resin substrate 1, an electrically conductive surface 3 of the circuit conductor is exposed from the resin substrate continuously in a longitudinal direction, and both side portions 4 of the conductive surface are covered and fixed by collar walls 5 of the resin substrate. A bus bar or an electrically conductive resin material is used as the circuit conductor 2. The bus bar 2 is insert-molded onto the resin substrate. The electrically conductive resin material is poured and solidified in a groove portion in the resin substrate. A contact terminal on a mating circuit side or electrical component side is brought into contact with the conductive surface of the circuit conductor 2. A second circuit board is laminated on the resin substrate, and an insertion hole for allowing the conductive surface of the circuit conductor 2 to be exposed is provided in the second circuit board, and the contact terminal is inserted in the insertion hole. Other contact terminals on the mating circuit side or electrical component side are brought into contact with circuits of the second circuit board.

    Abstract translation: 导电电路导体2设置在绝缘树脂基板1上，电路导体的导电表面3沿着纵向连续地从树脂基板露出，并且导电表面的两个侧部4被覆盖并固定在 树脂基板的环状壁5。 母线或导电树脂材料用作电路导体2.汇流条2插入模制在树脂基片上。 导电性树脂材料在树脂基板的槽部注入并凝固。 匹配电路侧或电气元件侧的接触端子与电路导体2的导电表面接触。第二电路板层叠在树脂基板上，并且插入孔用于允许电路导体的导电表面 2被设置在第二电路板中，并且接触端子插入到插入孔中。 匹配电路侧或电气部件侧的其他接触端子与第二电路板的电路接触。

    Deformation-resistant mounting structure of portable device
    85.
    发明授权
    Deformation-resistant mounting structure of portable device 失效

    公开(公告)号：US06490165B2

    公开(公告)日：2002-12-03

    申请号：US09987325

    申请日：2001-11-14

    Applicant: Manabu Mizusaki

    Inventor： Manabu Mizusaki

    IPC: H05K714

    CPC classification number: H05K1/0271 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10409 ,  H05K2201/10598

    Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

    Method and apparatus for soldering and soldering land of a printed circuit board
    86.
    发明授权
    Method and apparatus for soldering and soldering land of a printed circuit board 失效
    用于焊接和焊接印刷电路板的焊盘的方法和装置

    公开(公告)号：US06471109B2

    公开(公告)日：2002-10-29

    申请号：US09912311

    申请日：2001-07-26

    Applicant: Masayoshi Muramatsu ,  Kenichi Watanabe

    Inventor： Masayoshi Muramatsu ,  Kenichi Watanabe

    IPC: B23K3702

    CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2201/10969

    Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

    Abstract translation: 一对烙铁以预定间隔固定在滑板上。 烙铁一体地移动，以相对于传送带沿矩形方向往复运动。 其中一个烙铁被传送到传送带的工作位置，另一个与传送带分离。 虽然其中一个烙铁焊接电路板，另一个被清洁。 电路板具有插入和焊接金属板的狭缝。 对于狭缝，设置由主焊盘和副焊盘构成的焊接区域。 主槽沿着狭缝的较长一侧形成。 子区域沿着狭缝的较短侧从主体区域延伸。 焊缝不会形成在狭缝周围，因此当电路板浸焊时狭缝不被焊料封闭。

    Pin connector
    87.
    发明申请
    Pin connector 审中-公开
    针连接器

    公开(公告)号：US20020146921A1

    公开(公告)日：2002-10-10

    申请号：US09828773

    申请日：2001-04-09

    Inventor： Qun Lu ,  Dayu Qu ,  Alan J. Eaton ,  Bryant E. Palmer

    IPC: H05K001/00

    CPC classification number: H01R12/58 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10871

    Abstract: A pin connector system includes a pin portion having a first cross-sectional geometry, wherein the pin portion passes through a pin passage in a first printed circuit board. The pin passage has a second cross-sectional geometry, wherein the combination of the first and second cross-sectional geometries forms a first solder passage for allowing solder to flow through the first printed circuit board.

    Abstract translation: 针连接器系统包括具有第一横截面几何形状的销部分，其中销部分穿过第一印刷电路板中的销通道。 销通道具有第二横截面几何形状，其中第一和第二横截面几何形状的组合形成第一焊料通道，以允许焊料流过第一印刷电路板。

    Mother substrate, substrate element and method for manufacturing the same
    88.
    发明授权
    Mother substrate, substrate element and method for manufacturing the same 有权
    母体衬底，衬底元件及其制造方法

    公开(公告)号：US06369335B1

    公开(公告)日：2002-04-09

    申请号：US09525075

    申请日：2000-03-14

    Applicant: Masaya Wajima

    Inventor： Masaya Wajima

    IPC: H01N909

    CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  Y10T29/49137 ,  H01L2924/00

    Abstract: A method for manufacturing substrate elements includes providing a mother substrate, forming at least one elongated through-hole on the mother substrate such that an entire longitudinal end surface of the first substrate element and a portion of a lateral surface of the second substrate element are exposed, forming an electrode pattern on the inner surface of the at least one elongated through-hole, and cutting the mother substrate along lines extending in the vicinity of the longitudinal ends of the at least one elongated through-hole and in a direction that is substantially perpendicular to the longitudinal axis of the elongated through-hole.

    Abstract translation: 一种用于制造衬底元件的方法包括：提供母体衬底，在母体衬底上形成至少一个细长的通孔，使得第一衬底元件的整个纵向端表面和第二衬底元件的侧表面的一部分露出 在所述至少一个细长通孔的内表面上形成电极图案，并且沿着在所述至少一个细长通孔的纵向端部附近延伸的线沿着基本上 垂直于细长通孔的纵向轴线。

    Oscillator module having a multi-layered base with a cover
    90.
    发明授权
    Oscillator module having a multi-layered base with a cover 失效
    振荡器模块具有带盖的多层底座

    公开(公告)号：US6034571A

    公开(公告)日：2000-03-07

    申请号：US149482

    申请日：1998-09-08

    Applicant: Masao Uno

    Inventor： Masao Uno

    IPC: H03B1/00 ,  H03B1/04 ,  H03B5/02 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K5/00 ,  H05K9/00 ,  H05K7/06

    CPC classification number: H05K5/0095 ,  H05K3/403 ,  H05K9/0022 ,  H05K1/0243 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10075 ,  H05K2201/10371 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/42

    Abstract: An oscillator includes a multi-layered base. Circuit patterns are formed on a first main surface and the inside of the multi-layered base. Holes through which wiring patterns of the individual layers of the base are connected are formed within the multi-layered base. Electronic components are mounted on the first main surface of the multi-layered base. First and second reverse electrodes, which serve as external terminals to be connected to an external source, are formed on a second main surface of the multi-layered base. The first reverse electrode serves as a ground electrode, and the second reverse electrodes serve as terminal electrodes. The reverse electrodes are electrically connected to the circuit patterns via the holes. The reverse electrodes are located farther inward than the lateral surfaces of the multi-layered base. A shield cover is placed to tightly cover the first main surface of the multi-layered base. It is thus possible to provide a miniaturized, less expensive, and easy-to-mount oscillator module in which unwanted radiation characteristics are improved.

    Abstract translation: 振荡器包括多层基座。 电路图案形成在第一主表面和多层基底的内部。 在多层基体内形成基底的各层的布线图案连接的孔。 电子部件安装在多层基体的第一主表面上。 用作连接到外部源的外部端子的第一和第二反向电极形成在多层基底的第二主表面上。 第一反向电极用作接地电极，第二反向电极用作端子电极。 反向电极经由孔电连接到电路图案。 反向电极位于比多层基底的侧表面更靠内侧。 放置一个屏蔽罩以紧密地覆盖多层底座的第一主表面。 因此，可以提供小型化，便宜且易于安装的振荡器模块，其中改善了不需要的辐射特性。

Patent Agency Ranking