公开(公告)号：JP2004128497A

公开(公告)日：2004-04-22

申请号：JP2003334361

申请日：2003-09-25

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： EGITTO FRANK D ,  FARQUHAR DONALD S ,  MARKOVICH VOYA R ,  MARK D POLIKS ,  POWELL DOUGLAS O

IPC: H01L23/12 ,  G02F1/1347 ,  H01L21/48 ,  H01L23/373 ,  H05K3/46

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer interconnection structure using a LCP dielectric layer and a method for forming the structure. SOLUTION: Each of a first and second LCP (liquid crystal polymer) dielectric layers is bonded directly to each of a first and second opposed layers of a heat conduction layer without an extrinsic adhesive material that bonds the heat conduction layer to either of a first and second LCP dielectric layers. Alternatively, each of a first and second 2S1P substructures is bonded directly to each of a first and second opposed layers of a LCP dielectric bonding layer without an extrinsic adhesive material that bonds the LCP dielectric bonding layer to either of the first and second 2S1P substructures. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供使用LCP介电层的多层互连结构和形成该结构的方法。 解决方案：第一和第二LCP（液晶聚合物）电介质层中的每一个直接结合到导热层的第一和第二相对层中的每一个，而不需要将导热层粘合到 第一和第二LCP电介质层。 或者，第一和第二2S1P子结构中的每一个直接结合到LCP电介质结合层的第一和第二相对层中的每一个上，而不会将LCP电介质结合层结合到第一和第二2S1P子结构中的任一个的外在粘合材料。 版权所有（C）2004，JPO

公开(公告)号：JP2001326470A

公开(公告)日：2001-11-22

申请号：JP2001087939

申请日：2001-03-26

Applicant: IBM

Inventor： DONS FRANCIS J JR ,  FARQUHAR DONALD S ,  FOUST ELIZABETH ,  ROBERT M JAPPU ,  JONES GERALD W ,  JOHN S KURIIJU ,  ROBERT D SEBESUTA ,  DAVID B STONE ,  JAMES R WILCOCKS

IPC: H05K1/02 ,  H01L23/12 ,  H01L23/14 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide an electronic package and a method of manufacturing the electronic package. SOLUTION: A package 10 is provided with a semiconductor chip 12 and a multilayer interconnection structure 18 having an allyl surface layer. The semiconductor chip 12 has a plurality of contact members 16 on one surface, and is connected with the inside of the multilayer interconnection structure 18 by using a plurality of solder connecting members 20. The multilayer interconnection structure 18 is constituted so as to electrically and interconnect circuits of a board 100 by using a plurality of other solder connecting members 47 and has a heat conduction layer 22 composed of material having a selected thickness and coefficient of thermal expansion with which solder connecting obstruction between a plurality of first conducting members and the semiconductor chip is prevented totally. The electronic package 10 includes dielectric material having effective tensile stress for ensuring sufficient compliancy with the multilayer interconnection structure 18 during operation. The allyl surface layer has characteristic capable of enduring thermal stress which is generated during heat cycle operation of the electronic package 10.

公开(公告)号：JP2004136671A

公开(公告)日：2004-05-13

申请号：JP2003334370

申请日：2003-09-25

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： FARQUHAR DONALD S ,  MARK D POLIKS

IPC: G02F1/13 ,  B32B7/04 ,  B32B37/00 ,  C09K19/00 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/4632 ,  B32B7/04 ,  B32B37/00 ,  B32B37/0046 ,  B32B2037/0092 ,  B32B2305/34 ,  B32B2305/55 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2309/02 ,  B32B2311/00 ,  C09K19/00 ,  H05K1/0313 ,  H05K3/4641 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09318 ,  Y10T428/24273 ,  Y10T428/24331

Abstract: PROBLEM TO BE SOLVED: To provide a multi-layered structure using an LCP dielectric, and a forming method therefor. SOLUTION: A page is created by stacking N (N≥2) sub-structures in a certain arrangement order. The first sub-structure of each of a pair of adjacent sub-structures includes an LCP (liquid crystal polymer) dielectric material which is coupled to the second sub-structure of the pair of adjacent sub-structures. The page is brought into a temperature lower than the lowermost nematic-isotropic transition temperature of the LCP dielectric material in the page. Retention time and high pressure are adequate for plastically deforming all the LCP dielectric materials in the page, and laminating each of the pair of adjacent sub-structures without using an extrinsic adhesive layer which is arranged between the first and second sub-structures of each of the pair of adjacent sub-structures. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004282051A

公开(公告)日：2004-10-07

申请号：JP2004048571

申请日：2004-02-24

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： FARQUHAR DONALD S ,  POWELL DOUGLAS O

IPC: B32B27/36 ,  H05K3/46

CPC classification number: H05K3/4617 ,  B32B27/36 ,  H05K3/4688 ,  H05K2201/0141 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T156/1052 ,  Y10T428/24917

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer laminate and a manufacturing method thereof capable of effectively reducing the processing time and processing cost. SOLUTION: There are formed a first dielectric layer 60 made of a liquid crystal polymer (LCP) dielectric material 62, and a second dielectric layer 50 formed of a second LCP dielectric material 52. In the first dielectric layer, a conductive plug 64 is provided penetrating therethrough. Subsequently, a first electric circuit body 69 mechanically contacting the first dielectric layer surface is formed. Also, a second electric circuit body 59 mechanically contacting the second dielectric layer surface is formed. Here, the second electric circuit body is adapted to contact electrically and mechanically one end of the conductive plug. Further, fluxless soldering of the conductive plug to the first electric circuit body is achieved. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2002229857A

公开(公告)日：2002-08-16

申请号：JP2001369492

申请日：2001-12-04

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  FEGER CLAUDIUS ,  MARKOVICH VOYA ,  PAPATHOMAS KONSTANTINOS I ,  MARK D PORIKUSU ,  SHAW JANE M ,  SZEPAROWYCZ GEORGE ,  WEINGART STEVE H

IPC: G06F12/14 ,  G06F1/00 ,  G06F21/00 ,  G06F21/06 ,  G06F21/22 ,  H01L23/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16

Abstract: PROBLEM TO BE SOLVED: To provide a structure and a method of forming a fraudulent intrusion sensing electronic circuit enclosure including an integrated circuit structure, a mesh structure surrounding the integrated circuit, and a sealing enclosure surrounding the mesh structure. SOLUTION: The mesh structure includes a flexible dielectric layer having a first side and a second side, a screen print pattern of a first flexible conductive circuit line forming a first resistor network on the first side, and a photolithography forming pattern of a second flexible conductive circuit line forming a second resistor network on the second side.

公开(公告)号：CA2345433A1

公开(公告)日：2002-03-01

申请号：CA2345433

申请日：2001-04-27

Applicant: IBM

Inventor： FONTANA FULVIO ,  FARQUHAR DONALD S ,  CESANA MARIO L ,  BUTTURINI GIUSEPPE

IPC: G06F21/00 ,  G08B13/12 ,  H05K5/02 ,  H05K5/06

Abstract: A method and apparatus for forming a security enclosure having improved fold retention. In particular, the enclosure is formed by folding a flexible tamper responde nt cloth around an electronic assembly. An adhesive on the inner folded surfaces of the cloth temporarily retains the folds. The enclosure is then exposed to heat and pressure to promote improve d adhesion strength of the adhesive, thereby improving told retention.

公开(公告)号：CA2358743A1

公开(公告)日：2002-05-20

申请号：CA2358743

申请日：2001-10-12

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  CESANA MARIO L ,  TADDEI MARTINO

IPC: G06K19/00 ,  G06F1/16 ,  G06F21/00 ,  G08B13/02 ,  H05K7/00

Abstract: The present invention provides a security enclosure having an electronic assembly, such as a cryptographic processor card enclosed within an enclosure, surrounded by a tamper respondent wrap. The enclosure further includes a flexible extension cable which electrically connects the wrap and the assembly. The extension cable includes a plurality of interconnectio ns at a first end to form an electrical connection with the assembly, and a plurality of bonding pads at a second end to form an electrical connection with a plurality of corresponding bonding pads of t he wrap.

公开(公告)号：MY127684A

公开(公告)日：2006-12-29

申请号：MYPI20002291

申请日：2000-05-24

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  PAPATHOMAS KONSTANTINOS I ,  POLIKS MARK D

IPC: B32B3/00 ,  B32B15/082 ,  C08K3/00 ,  C08L27/12 ,  C08L101/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38

Abstract: A SEMICONDUCTOR DEVICE HAVING A THERMOSET-CONTAINING, DIELECTRIC MATERIAL AND METHODS FOR FABRICATING THE SAME IS PROVIDED. THE DEVICE MAY TAKE THE FORM OF A PRINTED CIRCUIT BOARD, AN INTEGRATED CIRCUIT CHIP CARRIER, OR THE LIKE. THE DIELECTRIC MATERIAL IS A NON-FIBRILLATED, FLUOROPOLYMER MATRIX (10) THAT HAS INORGANIC PARTICLES (14) DISTRIBUTED THEREIN AND IS IMPREGNATED WITH A THERMOSET MATERIAL (12).(FIG. 1)