撮像装置および撮像装置の製造方法
    94.
    发明申请
    撮像装置および撮像装置の製造方法 审中-公开
    成像装置和制造成像装置的方法

    公开(公告)号:WO2015125776A1

    公开(公告)日:2015-08-27

    申请号:PCT/JP2015/054291

    申请日:2015-02-17

    Abstract: 撮像装置1は、受光部12が形成された受光面10SAの外周部に受光部12と接続された複数の電極パッド13が列設されている撮像素子10と、それぞれが電極パッド13と接続されている複数のインナーリード21を含む配線板20と、を具備する撮像装置1であって、それぞれのインナーリード21が、先端部21Xと屈曲部21Yと後端部21Zとからなり、先端部21Xが電極パッド13と接続されており、屈曲部21Yが受光面10SAに対して凹形状の第1屈曲部21Y1と凸形状の第2屈曲部21Y2とからなり、後端部21Zが撮像素子10の側面10SSに平行に配置されている。

    Abstract translation: 一种成像装置(1),其具有与受光部(12)连接的多个电极焊盘(13)并列在受光面(10SA)的外周部的成像元件(10) 其上形成有光接收部分(12),以及布线板(20),其包括多个内引线(21),每个内引线与电极焊盘(13)连接,其中每个内引线 )包括尖端部分(21X),弯曲部分(21Y)和后端部分(21Z),所述尖端部分(21X)与所述电极焊盘(13)连接,所述弯曲部分(21Y)包括第一 相对于受光面(10SA)呈凸状的第二弯曲部(21Y2),后端部(21Z)与所述光接收面(10SA)的侧面(10SS)平行地配置, 成像元件(10)。

    BUSBAR CUTTING UNIT, BUSBAR CUTTING METHOD, AND INTERIOR ILLUMINATION DEVICE FOR VEHICLE
    95.
    发明申请
    BUSBAR CUTTING UNIT, BUSBAR CUTTING METHOD, AND INTERIOR ILLUMINATION DEVICE FOR VEHICLE 审中-公开
    母线切割单元,母线切割方法和车辆内部照明装置

    公开(公告)号:WO2013015448A1

    公开(公告)日:2013-01-31

    申请号:PCT/JP2012/069528

    申请日:2012-07-25

    Inventor: SAKAI, Manabu

    Abstract: A busbar cutting unit (30) for cutting a bridge portion (16a) of a busbar plate having a plurality of busbars (17) coupled to each other with the bridge portion so that the busbars serve as electric circuits respectively, includes an attachment portion to which the busbar plate Is attached, a reception portion (38) that receives bridge pieces formed by cutting the bridge portion of the busbar plate when the bridge portion of the busbar plate is pressed down toward the attachment portion, and a welding portion (37) that Is made of an electrical insulation material and is welded to the bridge pieces received in the reception portion.

    Abstract translation: 一种用于切割母线板的桥接部分(16a)的母线切割单元(30),所述母线板具有多个汇流条(17),所述多个汇流条(17)分别与所述桥接部分相互耦合,使得汇流条分别用作电路,其包括附接部分 接收部分(38),其接收当母线板的桥接部分朝向安装部分被压下时通过切割母线板的桥接部分而形成的桥接件;以及焊接部分(37) 其由电绝缘材料制成并且焊接到接收部分中接收的桥接件。

    METHOD FOR CONNECTING AT LEAST ONE WIRE CONDUCTOR DISPOSED ON A SUBSTRATE WITH A CHIP OF A TRANSPONDER UNIT
    96.
    发明申请
    METHOD FOR CONNECTING AT LEAST ONE WIRE CONDUCTOR DISPOSED ON A SUBSTRATE WITH A CHIP OF A TRANSPONDER UNIT 审中-公开
    将基底处理的至少一根导线连接到传感器单元的芯片上的方法

    公开(公告)号:WO2011036150A1

    公开(公告)日:2011-03-31

    申请号:PCT/EP2010/063898

    申请日:2010-09-21

    Abstract: Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3), and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that, during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).

    Abstract translation: 用于将至少一个线导体(6)与芯片模块(5)的至少一个终端装置(22a,22b)连接起来用于产生包括线圈装置(2)和所述芯片模块(5)的应答器装置(1)的方法 ),其中,在第一方法步骤中,线圈装置(2)被布置并固定在基板(3)上,并且在另一方法步骤中,线圈装置(2)的导线(6)被连接 所述芯片模块(5)的特征在于,在所述第一方法步骤期间,所述导线(6)的端部(7a,7b)被放置成以间隔开的方式延伸穿过所述容纳窗(4) 在用于芯片模块(5)的容纳窗(4)的中心区域(Z)中,延伸穿过容纳窗(4)的导线(6)的部分区域(8a,8b)从所述 中心区域(Z)通过定位装置(3)朝向容纳窗(4)的对应边缘(23a,23b)延伸,直到部分区域(8a,8b)的至少一部分延伸 在端子区域(22a,22b)的期望位置之后,芯片模块(5)随后插入容纳窗口(4)中,然后将该部分与端子区域(22a,22b)以导电方式连接, 。

    VERBINDUNGSANORDNUNG
    97.
    发明申请
    VERBINDUNGSANORDNUNG 审中-公开
    连接装置

    公开(公告)号:WO2011033059A1

    公开(公告)日:2011-03-24

    申请号:PCT/EP2010/063693

    申请日:2010-09-17

    Inventor: KALLEE, Werner

    Abstract: Zur Herstellung einer Verbindung zwischen einer leitenden Folie und einem Plattenelement mit mindestens einer Bohrung wird vorgeschlagen, die Verbindung in der Weise zu gestalten, dass die nicht gelochte Folie mithilfe von Kontaktstiften in Bohrungen des Plattenelements eingetrieben wird. Die Kontaktstifte legen die umgebogenen Teile der Folie an die Wand der Bohrung an und verklemmen sich in der Bohrung. Die Einpresstiefe der Kontaktstifte wird dadurch begrenzt, dass das Klemmelement, aus dem sie hervortreten, an der Oberseite des Plattenelements zur Anlage kommt. Dadurch werden auch Bereiche der Folie zwischen der Oberseite der Platte und dem Klemmelement direkt verklemmt.

    Abstract translation: 用于生产导电膜和具有至少一个孔的板构件之间的化合物提出了使在使用接触销到板构件的通孔的非多孔膜被驱动的方式连接。 接触销在孔的壁中创建所述膜的弯曲部分,并成为卡住在孔。 接触针的插入深度由以下事实:所述夹紧元件,从它们的出现,是在板元件到植株顶端的高度的限制。 这也板的顶部和夹持构件之间的膜的部分被直接夹持。

    PRINTED CIRCUIT BOARD WITH CO-PLANAR PLATE AND METHOD OF MANUFACTURING THEREFOR
    98.
    发明申请
    PRINTED CIRCUIT BOARD WITH CO-PLANAR PLATE AND METHOD OF MANUFACTURING THEREFOR 审中-公开
    带平面板的印刷电路板及其制造方法

    公开(公告)号:WO2009141413A1

    公开(公告)日:2009-11-26

    申请号:PCT/EP2009/056199

    申请日:2009-05-21

    Abstract: There is disclosed a method of forming a printed circuit board including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, the method comprising the steps of: providing an opening in the printed circuit board extending from the upper surface to the lower surface; providing a raised portion on the plate having dimensions corresponding to the opening in the printed circuit board, the height of said raised portion being greater than the thickness of the printed circuit board; laminating the printed circuit board and the metal plate to form the raised portion of the plate in the opening of the printed circuit board; and compressing the laminated structure to form a structure in which the upper surface of the printed circuit board is coplanar with the surface of the raised portion of the metal plate.

    Abstract translation: 公开了一种形成印刷电路板的方法,所述印刷电路板包括用于从所述印刷电路板的上表面提供导热性的板到所述印刷电路板的下表面,所述方法包括以下步骤:在所述印刷电路板中提供开口 电路板从上表面延伸到下表面; 在所述板上提供具有对应于所述印刷电路板中的开口的尺寸的凸起部分,所述凸起部分的高度大于所述印刷电路板的厚度; 层叠印刷电路板和金属板以在印刷电路板的开口中形成板的凸起部分; 并且压缩层压结构以形成其中印刷电路板的上表面与金属板的凸起部分的表面共面的结构。

    METHOD FOR MANUFACTURING LAMINATED CIRCUIT BOARD
    99.
    发明申请
    METHOD FOR MANUFACTURING LAMINATED CIRCUIT BOARD 审中-公开
    制造层压电路板的方法

    公开(公告)号:WO2009118455A1

    公开(公告)日:2009-10-01

    申请号:PCT/FI2009/050226

    申请日:2009-03-25

    Inventor: MARTTILA, Tom

    Abstract: 1. A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of: i) affixing a conductive layer, such as a metal foil (3), to a substrate material (1) selectively, such that a part of the conductive layer, such as the metal foil (3), comprising desired areas (3a) for the final product and narrow areas (3c) between the final product's conducting areas, is affixed to the substrate material (1) by means of a bond (2), and removal-intended more extensive areas (3b) of the conductive layer, for example the metal foil (3), are left substantially unattached to the substrate material in such a way that the removable area (3b) is in attachment with the substrate material (1) by not more than its edge portion to be patterned in a subsequent step ii) and possibly by sites which preclude a release of the removable areas prior to a step iii); ii) patterning, by a removal of material, the conductive layer, such as the metal foil (3), from narrow gaps between the desired conducting areas (3a), and from an outer periphery of the area (3b) removable in a solid state, for establishing conductor patterns; iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer holds the removable areas (3b) attached by their edges to the substrate material.

    Abstract translation: 1.一种制造具有导电图案的电路板的方法,所述方法包括以下步骤:i)选择性地将诸如金属箔(3)的导电层固定到基底材料(1)上,使得部件 包括用于最终产品的所需区域(3a)和最终产品的导电区域之间的狭窄区域(3c)的金属箔(3)的导电层通过以下方式固定到基底材料(1)上: 导电层(例如金属箔(3))的导电层(2)和去除预期更广泛的区域(3b)基本上不与衬底材料连接,使得可移除区域(3b)处于 在后续步骤ii)中可能与基底材料(1)的连接不超过其待图案化的边缘部分,并且可能通过排除在步骤iii)之前的可移除区域的释放的位置; ii)通过从所需导电区域(3a)之间的狭窄间隙和从固体中可移除的区域(3b)的外周去除导电层(例如金属箔(3))的图案, 状态,用于建立导体图案; iii)在导电层的边缘区域从固定状态除去导电层的边缘区域之后,从导电层(例如金属箔(3))上去除不附着于基底材料(1)的可移除区域(3b) 在步骤ii)的过程中,可移除区域的外围不再将其边缘附着的可移除区域(3b)保持在衬底材料上。

Patent Agency Ranking