Abstract:
A busbar cutting unit (30) for cutting a bridge portion (16a) of a busbar plate having a plurality of busbars (17) coupled to each other with the bridge portion so that the busbars serve as electric circuits respectively, includes an attachment portion to which the busbar plate Is attached, a reception portion (38) that receives bridge pieces formed by cutting the bridge portion of the busbar plate when the bridge portion of the busbar plate is pressed down toward the attachment portion, and a welding portion (37) that Is made of an electrical insulation material and is welded to the bridge pieces received in the reception portion.
Abstract:
Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3), and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that, during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).
Abstract:
Zur Herstellung einer Verbindung zwischen einer leitenden Folie und einem Plattenelement mit mindestens einer Bohrung wird vorgeschlagen, die Verbindung in der Weise zu gestalten, dass die nicht gelochte Folie mithilfe von Kontaktstiften in Bohrungen des Plattenelements eingetrieben wird. Die Kontaktstifte legen die umgebogenen Teile der Folie an die Wand der Bohrung an und verklemmen sich in der Bohrung. Die Einpresstiefe der Kontaktstifte wird dadurch begrenzt, dass das Klemmelement, aus dem sie hervortreten, an der Oberseite des Plattenelements zur Anlage kommt. Dadurch werden auch Bereiche der Folie zwischen der Oberseite der Platte und dem Klemmelement direkt verklemmt.
Abstract:
There is disclosed a method of forming a printed circuit board including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, the method comprising the steps of: providing an opening in the printed circuit board extending from the upper surface to the lower surface; providing a raised portion on the plate having dimensions corresponding to the opening in the printed circuit board, the height of said raised portion being greater than the thickness of the printed circuit board; laminating the printed circuit board and the metal plate to form the raised portion of the plate in the opening of the printed circuit board; and compressing the laminated structure to form a structure in which the upper surface of the printed circuit board is coplanar with the surface of the raised portion of the metal plate.
Abstract:
1. A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of: i) affixing a conductive layer, such as a metal foil (3), to a substrate material (1) selectively, such that a part of the conductive layer, such as the metal foil (3), comprising desired areas (3a) for the final product and narrow areas (3c) between the final product's conducting areas, is affixed to the substrate material (1) by means of a bond (2), and removal-intended more extensive areas (3b) of the conductive layer, for example the metal foil (3), are left substantially unattached to the substrate material in such a way that the removable area (3b) is in attachment with the substrate material (1) by not more than its edge portion to be patterned in a subsequent step ii) and possibly by sites which preclude a release of the removable areas prior to a step iii); ii) patterning, by a removal of material, the conductive layer, such as the metal foil (3), from narrow gaps between the desired conducting areas (3a), and from an outer periphery of the area (3b) removable in a solid state, for establishing conductor patterns; iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer holds the removable areas (3b) attached by their edges to the substrate material.
Abstract:
The invention relates to a circuit board comprising at least one additional electrically conductive structure that is in the form of a round or rectangular electrically conductive wiring element, in particular in the form of an elongate copper element or element containing copper, that is brought into contact with copper film elements by ultrasound on at least one part on the surface on the copper film elements and is integrated into the circuit board by means of a lamination process. The at least one elongate wiring element has a cross-section that is deformed by means of a specifically formed sonotrode in a contact area that is flat in parts, such that the contact surfaces are at least 20%, in particular more than 30% and more particularly more than 50% greater in a non-deformed contact surface. The wiring element is further deformed in the cross-section in an approximately triangular like manner or in a trapezoidal manner thus increasing the contact surface. Also, the elongate wiring element in brought into contact at defined intervals in a flat manner on a conductive film element that is arranged therebelow.