中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

309 records (took 0.02 seconds)

    MULTI-LAYER CIRCUIT CONSTRUCTION METHODS AND STRUCTURES WITH CUSTOMIZATION FEATURES AND COMPONENTS FOR USE THEREIN
    92.
    发明申请
    MULTI-LAYER CIRCUIT CONSTRUCTION METHODS AND STRUCTURES WITH CUSTOMIZATION FEATURES AND COMPONENTS FOR USE THEREIN 审中-公开
    多层电路构造方法和结构与自定义特征及组件的使用

    公开(公告)号：WO1993013637A1

    公开(公告)日：1993-07-08

    申请号：PCT/US1992011395

    申请日：1992-12-30

    Applicant: TESSERA, INC.

    Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  KHANDROS, Igor ,  GRUBE, Gary, W. ,  EHRENBERG, Scott, G.

    IPC: H05K01/00

    CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

    Abstract: A multi-layer circuit panel assembly is formed by laminating circuit panels (10) with interposers (12) incorporating flowable conductive material (48) at interconnect locations and a flowable dielectric material (30, 38) at other locations. Excess materials are captured in reservoirs (20) in the circuit panels. The flowable materials and reservoirs allow the interposers to compress and take up tolerances in the components. The stacked panels may have contacts (538) on their top surfaces, through conductors (527) extending between top and bottom and terminals (530) connected to the bottom end of each through conductor. The terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact an adjacent panels are aligned with one another, these are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors.

    Abstract translation: 多层电路板组件通过层叠具有在互连位置处包含可流动导电材料（48）的插入件（12）的电路板（10）和在其它位置处的可流动电介质材料（30,38）形成。 多余的材料被捕获在电路板中的储存器（20）中。 可流动的材料和储存器允许内插器压缩并占据部件中的公差。 堆叠的板可以在其顶表面上具有通过在顶部和底部之间延伸的导体（527）和连接到每个贯通导体的底端的端子（530）之间的触点（538）。 端子和触头在每个接口处彼此非选择性地连接，使得当端子和邻近的面板彼此对准时，它们彼此连接。 这形成延伸穿过多个面板的复合垂直导体。 面板顶部和底部表面的选择性处理在垂直导体中提供选择性的中断。

    Electric wiring board and its manufacturing method
    95.
    发明专利
    Electric wiring board and its manufacturing method 有权
    电线及其制造方法

    公开(公告)号：JP2006134919A

    公开(公告)日：2006-05-25

    申请号：JP2004319041

    申请日：2004-11-02

    Applicant: Jtekt Corp ,  株式会社ジェイテクト

    Inventor： AMO KOJI

    IPC: H05K1/02 ,  H05K3/22

    CPC classification number: H01L21/485 ,  H01L23/5382 ,  H01L2924/0002 ,  H05K1/0287 ,  H05K1/0289 ,  H05K3/328 ,  H05K2201/09681 ,  H05K2201/09945 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an electric wiring board which can obtain a wiring circuit, without performing a solder bonding, and to provide a method of manufacturing this. SOLUTION: The electric wiring board is manufactured by a step of forming a network form cylinder 2, in which a plurality of conductive loop wires 1 are connected integrally in a plurality of circular direction positions, a step of forming network form sheets 3 and 4 in which the network form cylinders 2 are crushed and laminated flat in the radial direction, a step of interposing an insulating sheet 5 inside the network form sheets 3 and 4, and a step of forming defect parts 6 in the circular direction position of the conductive loops 1a of the network form sheets 3 and 4. Consequently, the electric wiring board is manufactured, and the semiconductor chip 7 can be bonded directly to the conduction loop 1a of the network form sheet 3. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种能够获得布线电路而不进行焊接接合的电气布线板，并提供制造方法。 解决方案：电气布线板通过形成网状圆筒2的步骤制造，其中多个导电环线1在多个圆周方向上一体地连接，形成网状薄片3的步骤 4，其中网状圆筒2在径向方向上被压扁和层压，将绝缘片5插入网状片材3和4内的步骤，以及在圆形方向位置上形成缺陷部分6的步骤 网络的导电环1a形成片3和4.因此，制造电布线板，并且半导体芯片7可以直接接合到网状片3的导电环1a。版权所有（C） ）2006年，日本特许厅和NCIPI

Patent Agency Ranking