公开(公告)号：DE102004019973A1

公开(公告)日：2005-09-15

申请号：DE102004019973

申请日：2004-04-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  BRAUNE BERT

IPC: H01L31/18 ,  H01L33/56 ,  H01L33/00

Abstract: The opto-electronic component, to transmit and/or receive electromagnetic rays, is especially a semiconductor chip with at least a partial shrouding mass (3) of a material permeable to electromagnetic rays. After shrouding, the material surface is treated chemically or by a plasma to form surface groups of Si-O or Si-OH to prevent the adhesion of impurities. The surface can be treated with an organic or inorganic acid e.g. sulfuric acid, nitric acid or tartaric acid. The plastics housing body (1) has a recess (10) to take a LED chip (2) with electrical connections (4). The shrouding mass molding has molecules (5) of n-butyltrimethoxysilane and/or diphenyldimethoxysilane.

公开(公告)号：DE10361801A1

公开(公告)日：2005-08-04

申请号：DE10361801

申请日：2003-12-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  JAEGER HARALD ,  SORG JOERG ERICH

IPC: H01L31/0203 ,  H01L31/18 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L33/00

Abstract: Radiation emitting and/or radiation receiving semiconductor element with a radiation emitting and/or radiation receiving semiconductor chip, a synthetic plastic shaped part (I) permeable to emitting and/or receiving electromagnetic radiation, and having external electrical connections connected to the electrical contact surfaces of the semiconductor chip, where part (1) consists of reaction-cured (sic) molding composition.

公开(公告)号：DE10351349A1

公开(公告)日：2005-06-16

申请号：DE10351349

申请日：2003-10-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： OTT HUBERT ,  GROETSCH STEFAN ,  BRUNNER HERBERT

IPC: G21K4/00 ,  H01L21/00 ,  H01L33/50 ,  H01L33/58 ,  H01L33/00

Abstract: Grown by epitaxy directly onto a substrate (14), a sequence (1) of semiconductor layers produces a semiconductor body (20) and then attaches with a main surface opposite the substrate onto a carrier substrate. With thin-film LED chips there is a quasi-Lambert's radiation characteristic if a thin conversion layer (3) covers a radiation decoupling surface (2) to decouple nearly all radiation.

公开(公告)号：DE10354936A1

公开(公告)日：2005-04-28

申请号：DE10354936

申请日：2003-11-25

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： STREUBEL KLAUS ,  ILLEK STEFAN ,  PIETZONKA INES ,  BRUNNER HERBERT

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/08 ,  H01L33/10 ,  H01L33/46 ,  H01L33/50

Abstract: A light-emitting semiconductor component comprises a mirror layer (15) on a main surface (4). The semiconductor body (1) is followed by a semiconductor converter (2). This is excited by light of wavelength lambda P produced in an active zone (3). The semiconductor converter emits light of wavelength lambda S1, which exceeds wavelength lambda P.

公开(公告)号：DE10122002A1

公开(公告)日：2002-11-21

申请号：DE10122002

申请日：2001-05-07

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  MARCHL WERNER ,  HARTL ALFRED

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: The invention relates to a housing for a component which emits and/or absorbs a radiation, comprising a housing base body (1) with a recess. An annular body (5) is fixed in the recess, surrounding a mounting surface for an element which emits and/or absorbs a radiation, which is embodied such that an inner surface of the annular aperture serves, at least partly, as a reflector for said radiation. The invention further relates to a component provided with such a housing.

公开(公告)号：DE10117889A1

公开(公告)日：2002-10-24

申请号：DE10117889

申请日：2001-04-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  HIEGLER MICHAEL ,  WAITL GUENTHER

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/00 ,  H01L23/495 ,  H01S5/022

Abstract: Leadframe (2) comprises a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b). A support part is provided which is coupled with a thermal connecting part (4). Independent claims are also included for (a) a radiation-emitting component having a radiation-emitting chip and the leadframe; and (b) a process for the production of the semiconductor component.

公开(公告)号：DE59707787D1

公开(公告)日：2002-08-29

申请号：DE59707787

申请日：1997-01-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GRAMANN WOLFGANG ,  SPAETH WERNER ,  WAITL GUENTHER ,  BRUNNER HERBERT

IPC: G09F9/33 ,  H01L25/075 ,  H01L33/00 ,  H01L33/38 ,  H01L33/40

Abstract: The invention concerns an LED device (1) comprising at least one LED chip (2), wherein front contact plating (8) is disposed on a light outlet surface of a light-emitting body (5) and rear contact plating (6) is disposed on a side of the light-emitting body (5) lying opposite the light outlet surface. The LED chip (2) is disposed between a first (15) and a second strip conductor carrier (31), the first strip conductor (15) being transparent and comprising at least one first electrical conductor (16) which contacts the front contact plating (8), and the second strip conductor carrier (31) comprising at least one second electrical conductor (13) which contacts the rear contact plating (6). The LED device (1) according to the invention has inter alia the particular advantage that the size of the LED chip (2) is reduced with respect to conventional LED devices and hence the beam density can be increased.

公开(公告)号：DE10027206A1

公开(公告)日：2001-12-13

申请号：DE10027206

申请日：2000-05-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  BOGNER GEORG ,  BRUNNER HERBERT

IPC: C08L63/00 ,  C08K5/00 ,  C08K5/13 ,  C08K5/17 ,  C08K5/3435 ,  H01L23/29 ,  H01L23/31 ,  H01L33/00 ,  H01L33/56 ,  C08L63/02 ,  C08L63/04 ,  H05K3/28

Abstract: The invention relates to an epoxy-resin system, in particular for cast-resin applications. Said system comprises a component A, based on a glycidyl ether or glycidyl ester and containing epoxide and a component B, containing an anhydride as the hardener, a sterically hindered amine being added to component A as a stabiliser to prevent ageing of the moulding material. Light-emitting semiconductor components which are cast using said system exhibit an improved resistance to ageing, in particular with regard to the long-term luminosity factor. The epoxy-resin system can also be used for potting and moulding compounds and in mixtures with acrylates for all applications, in particular external applications.

公开(公告)号：DE10020465A1

公开(公告)日：2001-11-08

申请号：DE10020465

申请日：2000-04-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： DEBRAY ALEXANDRA ,  BRUNNER HERBERT ,  WAITL GUENTER ,  JAEGER HARALD

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: The invention concerns a radiation emitting semiconductor component with a luminescence-converting element (7), wherein the semiconductor body (3) is disposed in a groove of the base body (1). A cup-shaped area containing the luminescence-converting element (7) surrounding the semiconductor body (3) is formed inside the groove around the semiconductor body. The cup-shaped area is formed in the shape of a hollowness inside the groove or as an annular fringe (6) on the bottom of the groove.

公开(公告)号：DE102005041064B4

公开(公告)日：2023-01-19

申请号：DE102005041064

申请日：2005-08-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JÄGER HARALD ,  HÖFER THOMAS DR ,  SCHWARZ RAIMUND DR ,  BRAUNE BERT DR ,  BRUNNER HERBERT

IPC: H01L33/62 ,  H01L31/02 ,  H01L31/18 ,  H01L33/00 ,  H01L33/48 ,  H01S5/022 ,  H01S5/028

Abstract: Oberflächenmontierbares Bauelement, mit- einem optoelektronischen Halbleiterchip (1),- einem Formkörper (2), der an den Halbleiterchip (1) angeformt ist,- einer Montagefläche (3), die zumindest stellenweise durch eine Oberfläche des Formkörper (2) gebildet ist,- zumindest einer Anschlussstelle (4a, 4b), die pilzförmig ausgebildet ist, und- Seitenflächen (2a, 2b) des Bauelements, die mittels Vereinzeln erzeugt sind.