公开(公告)号：KR100439608B1

公开(公告)日：2004-07-12

申请号：KR1019990003880

申请日：1999-02-05

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 아키모토마사미

IPC: H01L21/027

CPC classification number: G03F7/3021 ,  G03D5/06 ,  Y10S414/135 ,  Y10S414/137

Abstract: A resist coating-developing system includes two transporting devices each for transporting a substrate, a relay section arranged between the two transporting devices for temporarily retaining a substrate thereon, a coating unit to and from which a substrate is transferred by one of the two transporting devices, the coating unit subjecting the substrate transferred thereto to a resist coating process, and a developing unit to and from which a substrate is transferred by the other of the two transporting devices, the developing unit subjecting an exposed resist of the substrate transferred thereto to a developing process, wherein the coating unit and the developing unit are arranged opposite to each other with the two transporting devices and the relay section interposed therebetween.

Abstract translation: 抗蚀剂涂布显影系统包括两个输送装置，每个输送装置用于输送衬底;中继部分，布置在两个输送装置之间用于临时保持衬底;涂布单元，通过两个输送装置中的一个输送衬底 ，将转印后的基板进行抗蚀剂涂布处理的涂布单元和通过两个输送装置中的另一个输送基板的显影单元，显影单元使转印的基板的曝光后的抗蚀剂成为 其中，所述涂布单元和所述显影单元通过所述两个输送装置和所述中继部分设置在彼此相对的位置。

公开(公告)号：KR100421349B1

公开(公告)日：2004-03-06

申请号：KR1020020050830

申请日：2002-08-27

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 요네미즈아키라 ,  구도우히로유키 ,  아키모토마사미

IPC: H01L21/304

Abstract: PURPOSE: An apparatus for processing a target processing substrate is provided to prevent the atmosphere in a process chamber from leaking through a window portion for transferring the target processing substrate or through an inlet port for inducing outside air by using a very simple structure. CONSTITUTION: The apparatus for processing the target processing substrate includes an openable window portion for transferring the target processing substrate and an inlet port for introducing the outer atmosphere. The processing apparatus further includes a closed processing chamber for performing predetermined processing for the target processing substrate transferred via the window portion, an exhaust unit for evacuating the interior of the processing chamber, and an opening/closing mechanism for closing the inlet port and opening the inlet port when the pressure in the processing chamber is negative.

公开(公告)号：KR100386130B1

公开(公告)日：2003-08-25

申请号：KR1019970001966

申请日：1997-01-24

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 야에가시히데타미 ,  도시마다카유키 ,  아키모토마사미 ,  야마구치에이지 ,  가타노준이치 ,  기타노다카유키 ,  신야히로시 ,  이이다나루아키

IPC: H01L21/68

CPC classification number: H01L21/67178 ,  H01L21/67196 ,  H01L21/67225 ,  H01L21/67742 ,  Y10T29/41

Abstract: A processing apparatus comprising a plurality of process unit groups (G1 to G5) each including a plurality of process units to subject an object (w) to a series of processes, said process units being arranged vertically in multiple stages, an object transfer space (22) being defined among the process unit groups (G1 to G5); transfer means (21) for transferring the object (w), said transfer means (21) having a transfer member (73, 78a, 78b, 78c) vertically movable in the object transfer space (22), said transfer member (73, 78a, 78b, 78c) being capable of transferring the object (w) to each of said process units; and means (20b, 50 to 62, 84, 95, 95a, 96, 114, 114a, 115, 115a) for reducing a variation in condition of the object transfer space (22), the processing apparatus further comprising at least one first process unit group (G1, G2) in which process units including a resist coating unit for coating a resist and a developing unit for developing a pattern of the resist are vertically stacked; and at least one second process unit group (G3, G4, G5) in which at least one or all of an alignment unit for aligning an object to be processed, a baking unit for baking the object, a cooling unit for cooling the object, an adhesion unit for subjecting the object to an adhesion process, and an extension unit are vertically stacked, wherein said first process unit group (G1, G2) has such an arrangement that the coating unit is placed below the developing unit.

Abstract translation: 1。一种处理装置，其特征在于，具有：多个处理单元组（G1〜G5），其分别具有对被处理体（w）进行一系列处理的多个处理单元，该多个处理单元以多个阶段进行垂直配置， 22）被定义在处理单元组（G1到G5）中; 用于传送物体（w）的传送装置（21），所述传送装置（21）具有可在物体传送空间（22）中垂直移动的传送构件（73,78a，78b，78c），所述传送构件（73,78a ，78b，78c）能够将物体（w）转移到每个所述处理单元; 和用于减少所述物体转移空间（22）的状态变化的装置（20b，50至62,84,95,95a，96,114,114a，115,115a），所述处理装置还包括至少一个第一处理 单元组（G1，G2），其中包括用于涂覆抗蚀剂的抗蚀剂涂布单元和用于显影抗蚀剂图案的显影单元的处理单元垂直堆叠; 以及至少一个第二处理单元组（G3，G4，G5），其中用于对准待处理对象的对准单元，用于烘烤对象的烘烤单元，用于冷却所述对象的冷却单元， 用于对物体进行粘合处理的粘合单元和延伸单元垂直地堆叠，其中所述第一处理单元组（G1，G2）具有这样的布置，即涂覆单元位于显影单元下方。

公开(公告)号：KR100379649B1

公开(公告)日：2003-07-22

申请号：KR1019970056977

申请日：1997-10-31

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 아키모토마사미 ,  데구치요이치

IPC: H01L21/027

CPC classification number: H01L21/67178 ,  H01L21/6715 ,  Y10S414/135

Abstract: Disclosed is an apparatus for processing a substrate in which a processing consisting of a plurality of process steps is applied to a substrate to be processed. The apparatus comprises a transfer zone extending in a vertical direction, a plurality of process groups arranged to surround the transfer zone for processing the substrate, each process group consisting of a plurality of process units stacked one upon the other, and each process unit having an opening communicating with the transfer zone for transferring the substrate into and out of the process unit, a main arm mechanism movably mounted in the transfer zone for transferring the substrate into and out of the process unit through the opening, and down flow forming means for forming a down flow of a clean air within the transfer zone. At least one of the plural process groups includes a plurality of thermal units for heating or cooling the substrate, a transfer unit for transferring the substrate into and out of the transfer zone, and a gas process unit for processing the substrate with a gas, the opening of the gas process unit being positioned lower than the openings of the thermal units and the transfer unit.

Abstract translation: 公开了一种用于处理衬底的设备，其中由多个处理步骤组成的处理被应用于待处理的衬底。 该设备包括在垂直方向上延伸的转移区域，多个处理组被布置为围绕处理衬底的转移区域，每个处理组由多个彼此堆叠的处理单元组成，并且每个处理单元具有 与输送区域连通，用于将衬底输入和输出处理单元;主臂机构，可移动地安装在输送区域中，用于通过开口将衬底输入和输出处理单元;以及下流形成装置，用于形成 清洁空气在传送区域内向下流动。 多个工艺组中的至少一个工艺组包括用于加热或冷却基板的多个热单元，用于将基板传送进出传送区域的传送单元以及用气体处理基板的气体处理单元， 气体处理单元的打开位置低于热单元和转印单元的开口。

公开(公告)号：KR100376321B1

公开(公告)日：2003-06-09

申请号：KR1019970045484

申请日：1997-09-02

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 아키모토마사미

IPC: H01L21/027

CPC classification number: H01L21/67173 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67781

Abstract: The process system of the present invention has a cooling process portion, a siding portion, and transfer means. The cooling process portion is responsible for applying cooling process to a heated substrate. The siding portion is positioned in an upper side of the cooling process portion and used for temporarily storing the substrate before being subjected to the cooling process. The transfer means loads/unloads the substrate into/from the cooling process portion and the siding portion.

Abstract translation: 本发明的处理系统具有冷却处理部分，侧壁部分和传送装置。 冷却过程部分负责将冷却过程应用于加热的基板。 旁路部分位于冷却处理部分的上侧，并用于在经受冷却处理之前临时存储基板。 传送装置将基板从冷却处理部分和侧壁部分装载/卸载。

公开(公告)号：KR100300614B1

公开(公告)日：2001-11-30

申请号：KR1019950009914

申请日：1995-04-26

Applicant: 도쿄엘렉트론가부시키가이샤 ,  도오교오에레구토론큐우슈우가부시끼가이샤

Inventor： 미우라요시카즈 ,  아라이히데오 ,  아키모토마사미 ,  오가와시즈오 ,  나가노도시히코

IPC: H01L21/027

Abstract: 본 발명은, 로우드ㆍ언로우드부, 처리부, 및 인터페이스부로 구성된 피처리체의 처리장치로서, 로우드ㆍ언로우드부로부터 인터페이스부까지 양방향으로 이동가능하며, 처리부에서의 각 처리파트에 피처리체를 이송함과 동시에, 로우드ㆍ언로우드부로부터 인터페이스부까지 피처리체를 양방향으로 반송할 수 있는 반송기구와, 반송기구에 의해 인터페이스부에 피처리체를 옮겨 실을 때에 피처리체를 일시 대기시키기 위한 적어도 두개의 대기부를 구비하는 피처리체의 처리장치를 제공한다.

公开(公告)号：KR1020010082581A

公开(公告)日：2001-08-30

申请号：KR1020000076997

申请日：2000-12-15

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 기타노다카히로 ,  모리카와마사테루 ,  에사키유키히코 ,  이시자카노부카즈 ,  고가노리히사 ,  다케시타가즈히로 ,  오쿠마히로후미 ,  아키모토마사미

IPC: H01L21/027

CPC classification number: H01L21/6715

Abstract: PURPOSE: A film forming unit is provided to apply the resist solution linearly on the wafer when it moves along the guide shaft. Meanwhile the wafer which is supported horizontally is moved by another drive mechanism in a direction perpendicular to the direction in which the discharge nozzle slides. CONSTITUTION: The film forming unit comprises moving means(86) for moving a discharge nozzle(85), wherein the moving means(86) includes a support member for supporting the discharge nozzle(85), a moving member for moving support member, a guide shaft passing through bearing portion formed in the supporting member, and a gas supplying part for supplying gas into a space between the bearing portion and guide shaft.

Abstract translation: 目的：提供一种成膜单元，当其沿着导向轴移动时，将抗蚀剂溶液线性地施加到晶片上。 同时水平支撑的晶片在垂直于排出喷嘴滑动方向的另一驱动机构上移动。 构成：成膜单元包括用于移动排放喷嘴（85）的移动装置（86），其中移动装置（86）包括用于支撑排放喷嘴（85）的支撑构件，用于移动支撑构件的移动构件， 引导轴穿过形成在支撑构件中的支承部分，以及气体供应部分，用于将气体供应到轴承部分和引导轴之间的空间中。

公开(公告)号：KR1020010062439A

公开(公告)日：2001-07-07

申请号：KR1020000076708

申请日：2000-12-14

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 키타노타카히로 ,  모리카와마사테루 ,  에사키유키히코 ,  이시자카노부카즈 ,  코가노리히사 ,  타케시타카즈히로 ,  오오쿠마히로후미 ,  아키모토마사미

IPC: H01L21/027

CPC classification number: H01L21/6715 ,  B05B12/20 ,  B05B13/041 ,  B05C5/0212 ,  B05C5/0216 ,  B05C5/0291 ,  B05C11/1039

Abstract: PURPOSE: A device for forming a coating film is provided to facilitate the washing of mask members, which are installed in a device forming a coating film of an uniform film thickness onto a substrate and cover the surface of the substrate other than an area on which the coating film is formed, and to suppress the enlargement of the device. CONSTITUTION: The device for forming a coating film on a substrate includes a substrate holding portion for holding the substrate; a coating solution nozzle(3), provided to face the substrate held by the substrate holding portion, for discharging a coating solution to the substrate; a drive mechanism for moving the coating solution nozzle(3) along a surface of the substrate relatively with respect to the substrate while the coating solution is being discharged to the surface of the substrate from the coating solution nozzle; a mask unit(4) covering a portion other than a coating film formation area of the substrate(W) and including a mask member(41) for catching the coating solution from the coating solution nozzle(3), and a cleaning mechanism, provided in the mask unit(4), for cleaning a coating film adhering to the mask member(41).

Abstract translation: 目的：提供一种用于形成涂膜的装置，以便于将安装在形成均匀膜厚的涂膜的装置中的掩模构件的清洗放在基板上并覆盖基板的除了 形成涂膜，并且抑制装置的放大。 构成：在基板上形成涂膜的装置包括：用于保持基板的基板保持部; 涂布溶液喷嘴（3），设置成面对由所述基板保持部保持的所述基板，用于将涂布溶液排出到所述基板; 驱动机构，用于当所述涂布溶液从所述涂布溶液喷嘴排出到所述基材的表面时，使所述涂布溶液喷嘴（3）沿着所述基板的表面相对于所述基板移动; 覆盖基板（W）的涂膜形成区域以外的部分的掩模单元（4），并且包括用于从涂布溶液喷嘴（3）捕获涂布溶液的掩模构件（41），以及清洁机构 在掩模单元（4）中，用于清洁附着在掩模构件（41）上的涂膜。

公开(公告)号：KR1020010030215A

公开(公告)日：2001-04-16

申请号：KR1020000051477

申请日：2000-09-01

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 기타노다카히로 ,  아키모토마사미 ,  도시미쓰다카후미

IPC: H01L21/027

CPC classification number: H01L21/67253 ,  G03F7/162 ,  G03F7/3021 ,  G03F7/3028

Abstract: PURPOSE: A substrate treatment system and substrate treatment is provided to maintain the thickness of a coating film with a specified thickness at the minimum cost of equipment without complicating a coating equipment. The system is also provided to keep the standard of photoregist with a specified standard regardless of the change of pressure. CONSTITUTION: In an FAB(2) having a plurality of developing treatment apparatuses(1) atmospheric pressure is measured with a barometer(3) disposed in the FAB(2), and the measured value is transferred to the respective developing treatment apparatuses(1) via a host computer(4). In the respective developing treatment apparatuses(1), the number of revolution of a substrate in a resist liquid coating unit is adjusted based on the measured value, only in the case that a value of atmospheric pressure exceeds a specified allowable value which is previously set regarding each kind of chemical liquid.

Abstract translation: 目的：提供基板处理系统和基板处理，以设备的最低成本保持具有规定厚度的涂膜的厚度，而不会使涂布设备复杂化。 还提供该系统，以保持光刻胶的标准具有指定的标准，而不管压力的变化。 构成：在具有多个显影处理装置（1）的FAB（2）中，通过设置在FAB（2）中的气压计（3）测定大气压，将测定值转印到各显影处理装置（1） ）通过主计算机（4）。 在各显影处理装置（1）中，仅在大气压值超过预先设定的规定容许值的情况下，基于测定值来调整抗蚀剂液体涂布单元中的基板的转数 关于各种化学液体。

公开(公告)号：KR1020010020971A

公开(公告)日：2001-03-15

申请号：KR1020000031750

申请日：2000-06-09

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 아키모토마사미

IPC: H01L21/30

CPC classification number: H01L21/67109 ,  Y10S414/135

Abstract: PURPOSE: A device is provided to prevent substrate from being overbaked. CONSTITUTION: Cooling treaters(14) for cooling wafers W up to a prescribed temperature are arranged between heating treaters(11) and resist coating treatment devices(8) and development processing devices(9). Preliminary cooling units(15) are provided on the treaters(14) in a multistage. The wafers W immediately after a heating treatment of the wafers W in the treaters(11) is ended are first transferred to the units(15) by a first transfer unit(12). After that, the wafers W are transferred to the units(14) by a third transfer unit(17) and are cooled up to the prescribed temperature and, thereafter, the wafers W are transferred to the devices(8) by a second transfer unit(13).

Abstract translation: 目的：提供一种防止基板过度烘烤的设备。 构成：在加热处理器（11）和抗蚀剂涂层处理装置（8）和显影处理装置（9）之间布置用于将晶片W冷却至规定温度的冷却处理器（14）。 预处理器（15）以多级设置在处理器（14）上。 在处理器（11）中的晶片W的加热处理之后立即结晶的晶片W首先通过第一转印单元（12）传送到单元（15）。 之后，通过第三传送单元（17）将晶片W转移到单元（14），并被冷却到规定温度，然后通过第二传送单元将晶片W传送到设备（8） （13）。