公开(公告)号：WO2008059322A2

公开(公告)日：2008-05-22

申请号：PCT/IB2007/001138

申请日：2007-05-02

Applicant: SONY ERICSSON MOBILE COMMUNICATIONS AB ,  KARLSSON, Ulf G.

Inventor： KARLSSON, Ulf G.

CPC classification number: H05K1/167 ,  H01L2224/16225 ,  H01L2924/15192 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4069 ,  H05K2201/0187 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/10734

Abstract: In one embodiment, a printed circuit board (12) includes a plurality of insulating layers (26) in which an aperture is formed through some of the layers. A resistive plug (28) at least partially fills the aperture and contacts respective conductive members (18, 20, 30) at each end of the resistive plug to form a resistive via (24) that traverses partially through the printed circuit board. In another embodiment, a printed circuit board (12) includes a plurality of insulating layers (26) in which an aperture is formed through at least some of the layers. A dielectric plug (32) at least partially fills the aperture and contacts respective conductive members (18, 20, 34) at each end of the dielectric plug to form a capacitive via (26) that traverses at least partially through the printed circuit board.

Abstract translation: 在一个实施例中，印刷电路板（12）包括多个绝缘层（26），其中通过一些层形成孔。 电阻塞（28）至少部分地填充孔并且在电阻塞的每个端部处接触相应的导电构件（18,20,30），以形成穿过印刷电路板的电阻通孔（24）。 在另一个实施例中，印刷电路板（12）包括多个绝缘层（26），其中通过至少一些层形成孔。 绝缘插头（32）至少部分地填充所述孔并且在介电插塞的每个端部处接触相应的导电构件（18,20,34），以形成至少部分穿过印刷电路板的电容通孔（26）。

公开(公告)号：WO2008045644A2

公开(公告)日：2008-04-17

申请号：PCT/US2007/078014

申请日：2007-09-10

Applicant: MOTOROLA, INC. ,  BURHANCE, Gary, R. ,  BARRON, John, C. ,  GARCIA, Jorge, L. ,  MEYER, David, J.

Inventor： BURHANCE, Gary, R. ,  BARRON, John, C. ,  GARCIA, Jorge, L. ,  MEYER, David, J.

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

Abstract: A printed circuit board (100) and a method (302,304,306,308) for imbedding a battery (106) in the printed circuit board are disclosed. The method includes connecting (302) the battery to a first inner pad (116) and a second inner pad (118) on an inner core layer (104) and forming a first battery contact (122) between a first outer pad (108) and the first inner pad (116). The method also includes electrically isolating (306) the first battery contact (122) and forming a second battery contact (124) between a second outer pad (110) and the second inner pad (118).

Abstract translation: 公开了用于将电池（106）嵌入印刷电路板中的印刷电路板（100）和方法（302,304,306,308）。 该方法包括将电池连接（302）到内芯层（104）上的第一内垫（116）和第二内垫（118），并在第一外垫（108）和第二外垫（108）之间形成第一电池触点（122） 和第一内垫（116）。 该方法还包括将第一电池触点（122）电隔离（306）并在第二外垫（110）和第二内垫（118）之间形成第二电池触点（124）。

公开(公告)号：WO2003078153A2

公开(公告)日：2003-09-25

申请号：PCT/US2003/007842

申请日：2003-03-14

Applicant: GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS, INC.

Inventor： PAI, Deepak K. ,  DENNY, Ronald, R.

IPC: B32B

CPC classification number: H05K3/462 ,  H01L2224/05548 ,  H05K3/28 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/043 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49213

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract translation: 本发明提供了用于层叠和互连多个高层计数（HLC）衬底以形成多层封装或其它电路部件的多种技术。 可以在两个HLC衬底中的至少一个的导电焊盘上形成焊料凸块。 焊料凸块优选地由焊膏应用于导电焊盘形成。 粘合剂膜可以位于具有导电焊盘的HLC衬底的表面之间，其中粘合剂膜包括基本上位于导电焊盘上方的孔，使得导电焊盘和/或焊料凸块通过孔彼此面对。 然后可以将HLC基底压在一起以经由粘合剂机械地粘合两个基底。 在叠层期间或之后可以回流焊料凸点，以产生焊接段，该焊料段通过粘合膜中的孔提供两个导电焊盘之间的电连接。

公开(公告)号：WO03067711A2

公开(公告)日：2003-08-14

申请号：PCT/US0232404

申请日：2002-10-09

Applicant: MOLEX INC

Inventor： MCGRATH JAMES L ,  CAPADONA JAMES P ,  MCGOWAN DANIEL B ,  PANELLA AUGUSTO P

IPC: H01R13/652 ,  H01R3/00 ,  H01R12/16 ,  H01R12/18 ,  H05K1/02 ,  H05K1/11 ,  H01R

CPC classification number: H05K1/117 ,  H01R12/721 ,  H01R13/6585 ,  H05K1/0219 ,  H05K2201/093 ,  H05K2201/0949 ,  H05K2201/0969 ,  H05K2201/09709 ,  H05K2201/09727

Abstract: Circuit boards to which such high speed differential signal connectors are mounted are disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.

Abstract translation: 公开了安装这种高速差分信号连接器的电路板，并且它们具有特定的端接迹线图案，通常采取延伸穿过电路板的电镀通孔的形式。 这些通孔被布置成三角形图案，并且电路板的接地参考平面设置有空隙，一个空隙相关联并且包围一对单个三端口的差分信号通路。 这减小了信号通路的电容，从而增加了发射区域内的电路板的阻抗，以减少连接器 - 电路板接口中的阻抗不连续性。

公开(公告)号：WO2002100142A1

公开(公告)日：2002-12-12

申请号：PCT/JP2002/005162

申请日：2002-05-28

Applicant: 株式会社 日立製作所 ,  山口 欣秀 ,  寺林 隆夫 ,  宝蔵寺 裕之 ,  天明 浩之 ,  諫田 尚哉

Inventor： 山口 欣秀 ,  寺林 隆夫 ,  宝蔵寺 裕之 ,  天明 浩之 ,  諫田 尚哉

IPC: H05K3/46

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/0044 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/0949 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2203/025 ,  H05K2203/1581 ,  H01L2224/05599

Abstract: A multilayer wiring board (6) manufactured at low cost comprises an insulating sheet(1) having a through hole (100) and a thin−film wiring layer (2) formed on the insulating sheet. The board has a high reliability, and a high−density wiring can be provided on the board. A through hole is made in a glass sheet (1) by sand blasting, a wiring pattern (120) and an interlayer insulating layer (110) are formed on the glass sheet, and the through hole is filled with a plating wiring or a conductive material (101), thus fabricating a multilayer wiring board.

Abstract translation: 以低成本制造的多层布线板（6）包括具有通孔（100）的绝缘片（1）和形成在绝缘片上的薄膜布线层（2）。 该板具有高可靠性，并可在板上提供高密度接线。 通过喷砂在玻璃板（1）中形成通孔，在玻璃板上形成布线图案（120）和层间绝缘层（110），并且通孔填充有电镀布线或导电 材料（101），从而制造多层布线板。

公开(公告)号：WO9841069A3

公开(公告)日：1998-11-05

申请号：PCT/DE9800760

申请日：1998-03-13

Applicant: SIEMENS AG ,  LUDWIG GUNTER

Inventor： LUDWIG GUNTER

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/00

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K2201/0949 ,  H05K2201/10651

Abstract: The invention relates to a fitted and soldered printed circuit board (1) of a flat assembly on which an additional component (2) is subsequently added and soldered. The printed circuit board has two solder-free fixing holes (7, 8) to fix the ends of the leads (4, 5) of the additional component (2), between which two interspaced soldering pads (10, 11) are placed, enabling said additional component (2) to be fixed onto the printed circuit board (1) and to be electrically connected. The leads (4, 5) have an area (12) running parallel to the surface of the printed circuit board (3) and a second area (14) running perpendicular to said surface, which are inserted into both fixing holes (7, 8).

Abstract translation: 本发明涉及一种平板组件的装配和焊接印刷电路板（1），其上附加和焊接附加部件（2）。 印刷电路板具有两个无焊料固定孔（7,8），用于固定附加部件（2）的引线（4,5）的端部，两个间隔焊垫（10,11）之间放置， 使得所述附加部件（2）固定在印刷电路板（1）上并被电连接。 引线（4,5）具有平行于印刷电路板（3）的表面延伸的区域（12）和垂直于所述表面延伸的第二区域（14），它们插入两个固定孔（7,8 ）。

公开(公告)号：ZA8406088B

公开(公告)日：1985-03-27

申请号：ZA8406088

申请日：1984-08-06

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE ,  GUDGEON BRIAN ,  WOMBWELL KENNETH JAMES

IPC: H05K3/46 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K

CPC classification number: H05K3/0094 ,  H05K1/115 ,  H05K3/225 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/429 ,  H05K3/4676 ,  H05K3/4688 ,  H05K2201/0949 ,  H05K2201/09627 ,  H05K2203/1394 ,  H05K2203/176

公开(公告)号：EP2815466B1

公开(公告)日：2018-04-11

申请号：EP13704703.1

申请日：2013-02-08

Applicant: CommScope, Inc. of North Carolina

Inventor： SCHUMACHER, Richard A. ,  MICHAELIS, Scott Lynn

IPC: H01R13/6466 ,  H01R13/6469 ,  H01R13/66 ,  H01R24/64 ,  H05K1/02 ,  H01R24/28 ,  H01R12/53

CPC classification number: H01R13/658 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R43/205 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

公开(公告)号：EP2341583A4

公开(公告)日：2012-10-31

申请号：EP09821841

申请日：2009-04-24

Applicant: ASAHI DENKA KENKYUSHO CO LTD

Inventor： MIZOGUCHI MASANORI

IPC: H01R12/52 ,  H01R12/71 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/326 ,  H01R12/718 ,  H05K1/118 ,  H05K1/147 ,  H05K3/306 ,  H05K3/363 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10378 ,  H05K2201/1059

公开(公告)号：EP1866961A4

公开(公告)日：2012-01-25

申请号：EP06738702

申请日：2006-03-15

Applicant: MEDCONX INC

Inventor： KENT HAROLD B ,  LEVANTE JAMES J ,  FINE AARON T ,  LAYTON JOSEPH R

IPC: H05K3/34 ,  H01L23/13 ,  H01R43/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/3494 ,  H01L23/13 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19043 ,  H01R43/0256 ,  H05K1/116 ,  H05K1/184 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2203/0195 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/2075 ,  H01L2924/00014 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00015