公开(公告)号：WO2007130938A3

公开(公告)日：2009-01-08

申请号：PCT/US2007067872

申请日：2007-05-01

Applicant: TEXAS INSTRUMENTS INC ,  GERBER MARK A ,  WACHTLER KURT P ,  CASTRO ABRAM M

Inventor： GERBER MARK A ,  WACHTLER KURT P ,  CASTRO ABRAM M

IPC: H01L23/488

CPC classification number: H05K1/141 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.

Abstract translation: 半导体系统（300）具有一个或多个封装的有源子系统（310,330）; 每个子系统具有基板，其具有电接触焊盘和堆叠在彼此之上的一个或多个半导体芯片，组装在基板上。 该系统还具有封装的无源子系统（320），其包括具有电触点的基板和无源电部件，例如电阻器，电容器和指示器。 被动子系统与有源子系统堆叠并通过焊料体与其连接。

公开(公告)号：WO2007140318A2

公开(公告)日：2007-12-06

申请号：PCT/US2007/069773

申请日：2007-05-25

Applicant: ILLINOIS TOOL WORKS INC. ,  GORRELL, Brian ,  SAYLOR, Austin, A.

Inventor： GORRELL, Brian ,  SAYLOR, Austin, A.

CPC classification number: H05K1/183 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09036 ,  H05K2201/10174 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: An electrical assembly including a substantially planar substrate having at least one recess therein and a plurality of electrical components. The electrical components are positioned in the at least one recess and include a first electrical component and a second electrical component. Each of the electrical components has a body and an electrical connection. The electrical connection of the first electrical component and the electrical connection of the second electrical component are aligned with each other when the body of the first electrical component is in a recess and the body of the second electrical component is in a recess.

Abstract translation: 一种电气组件，包括其中具有至少一个凹部的基本平坦的基板和多个电气部件。 电气部件定位在至少一个凹部中，并且包括第一电气部件和第二电气部件。 每个电气部件都具有主体和电气连接。 当第一电气部件的主体处于凹部中并且第二电气部件的主体处于凹部中时，第一电气部件和第二电气部件的电连接的电连接彼此对准。

公开(公告)号：WO2005086235A3

公开(公告)日：2006-01-05

申请号：PCT/DE2005000307

申请日：2005-02-23

Applicant: INFINEON TECHNOLOGIES AG ,  HAGEN ROBERT-CHRISTIAN ,  POHL JENS

Inventor： HAGEN ROBERT-CHRISTIAN ,  POHL JENS

IPC: H01L23/498 ,  H01L25/10 ,  H05K1/14

CPC classification number: H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a base semi-conductor component (1) for a semi-conductor stack (2). The base semi-conductor component (1) comprises a semi-conductor chip (3) which is arranged in a central manner on a firm wiring substrate (4). The wiring substrate (4) comprises contact connection surfaces (8) in the edge area thereof (6,7), which are in contact in an electric manner with external contacts, also with contact surfaces of the semi-conductor chip (3), and with stack contact surfaces (17). The stack contact surfaces (17) also form the upper side of the base semi-conductor component (1) and comprise an arrangement pattern (16) which corresponds to an arrangement pattern of external contacts of a semi-conductor component which is to be stacked (19).

Abstract translation: 本发明涉及一种用于半导体器件叠层（2），所述基底半导体部件（1）包括半导体芯片安装（4）的刚性布线基板上居中地布置（3）的基部的半导体部件（1）。 在布线基板（4）具有在其边缘区域（6,7）的接触垫（8）电连接到外部触点，并在同一时间与所述半导体芯片（3）的接触表面，并且与堆接触表面（17）。 堆栈的接触表面（17），同时形成在基础半​​导体元件（1）的上表面上，并具有对应于半导体器件的外部触点的配置图案，以堆叠（19）的排列图案（16）。

公开(公告)号：WO2003094203A2

公开(公告)日：2003-11-13

申请号：PCT/US2003/013524

申请日：2003-04-29

Applicant: SILICON PIPE, INC.

Inventor： FJELSTAD, Joseph, C. ,  SEGARAM, Para, K. ,  HABA, Belgacem

IPC: H01L

CPC classification number: H05K1/147 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0228 ,  H05K1/0237 ,  H05K3/222 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and the second integrated circuit packages suspended above the printed circuit board.

Abstract translation: 一种直接连接信号系统，包括印刷电路板和布置在印刷电路板上的第一和第二集成电路封装。 多个电信号导体在悬挂在印刷电路板上的第一和第二集成电路封装之间延伸。

公开(公告)号：WO02089260A3

公开(公告)日：2002-12-27

申请号：PCT/US0213561

申请日：2002-05-01

Applicant: INCEP TECHNOLOGIES INC

Inventor： DERIAN EDWARD J ,  DIBENE JOSEPH TED II ,  HARTKE DAVID H

IPC: G06F1/18 ,  H01L23/427 ,  H01L23/433 ,  H01R4/64 ,  H01R12/16 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H01B17/06 ,  H01R12/00 ,  H05K1/11

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor for electrical coupling with the first circuit board (315) and second circuit board (311), and one or more disconnectable conduction features (310, 322) for electrically coupling the connector with the second circuit board.

Abstract translation: 一种用于从第一电路板向第二电路板提供电力的连接器。 该装置包括第一导电构件，其包括第一导电构件第一端和远离第一端的第一导电构件第二端; 设置在第一导电构件内的第二导电构件，第二导电构件包括第二导体构件第一端和远离第二导体的第二导体构件，用于与第一电路板（315）和第二电路板（315）电耦合; 311）以及用于将连接器与第二电路板电耦合的一个或多个可断开的传导特征（310,322）。

公开(公告)号：WO0004595A3

公开(公告)日：2000-06-29

申请号：PCT/US9916067

申请日：1999-07-16

Applicant: INTEL CORP

Inventor： BURTON EDWARD A

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H01L23/13 ,  H01L23/538 ,  H01L25/16 ,  H01L25/15

CPC classification number: H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10704 ,  H05K2203/1572 ,  Y02P70/611

Abstract: A method and apparatus is presented to allow one or more electrical components to be coupled to the land-side of an integrated circuit package coupled to a circuit board. In a first embodiment, a void is provided in the circuit board, and a peripheral area of the integrated circuit package is coupled to a peripheral area around the void. This provides space for the insertion of components in the land-side of the integrated circuit package. In a second embodiment, a spacer is provided coupled to the peripheral area of the integrated circuit package to allow the insertion of components into the land-side of the package and above the circuit board. With these embodiments of the present invention, components, such as decoupling capacitors can be coupled closer to the die (e.g. a processor die) of the package thus reducing parasitic inductance.

Abstract translation: 提出了一种方法和设备，以允许一个或多个电气部件耦合到耦合到电路板的集成电路封装的焊盘侧。 在第一实施例中，在电路板中提供空隙，并且集成电路封装的外围区域耦合到空隙周围的外围区域。 这为在集成电路封装的焊盘侧插入元件提供了空间。 在第二实施例中，提供耦合到集成电路封装的外围区域的间隔件以允许将组件插入到封装的焊盘侧和电路板上方。 利用本发明的这些实施例，诸如去耦电容器的组件可以更靠近封装的管芯（例如，处理器管芯）耦合，从而降低寄生电感。

公开(公告)号：EP3110238A3

公开(公告)日：2017-04-26

申请号：EP16175340.5

申请日：2016-06-20

Applicant: Delta Electronics, Inc.

Inventor： YE, Haoyi ,  ZENG, Jianhong ,  ZHANG, Yu ,  HU, Peiqing ,  ZHOU, Ziying

IPC: H05K1/02 ,  G06F1/18 ,  H01L25/065 ,  H05K1/14 ,  H05K7/10

CPC classification number: H05K7/02 ,  G06F1/188 ,  G06F1/20 ,  H01L25/0657 ,  H05K1/0218 ,  H05K1/0262 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/368 ,  H05K7/10 ,  H05K7/2039 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10545

Abstract: The present disclosure provides an assembly structure for providing power for a chip (22, 62, 102) and an electronic device using the same. The assembly structure includes: a circuit board (21, 61, 101), configured to provide a first power supply; a chip (22, 62, 102); and a first power converting module (23, 63, 103, 69'), configured to electrically connect the circuit board (21, 61, 101) and the chip (22, 62, 102), convert the first power supply to a second power supply, and supply the second power supply to the chip (22, 62, 102), wherein the circuit board (21, 61, 101), the chip (22, 62, 102) and the first power converting module (23, 63, 103, 69') are stacked to form the assembly structure. The present disclosure assembles a power converting module (23, 63, 103) with a circuit board (21, 61, 101) and a chip (22, 62, 102) in a stacking manner, which may shorten a current path between the power converting module (23, 63, 103) and the chip (22, 62, 102), reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

Abstract translation: 本公开提供了一种用于为芯片（22,62,102）提供电力的组装结构和使用其的电子设备。 组装结构包括：电路板（21,61,101），被配置为提供第一电源; 芯片（22,62,102）; 和配置成电连接所述电路板（21,61,101）和所述芯片（22,62,102）的第一电力转换模块（23,63,103,69'）将所述第一电源转换为第二电源 电源，并将第二电源供应到芯片（22,62,102），其中电路板（21,61,101），芯片（22,62,102）和第一电力转换模块（23） 63,103,69'）堆叠以形成组装结构。 本公开以堆叠方式与电路板（21,61,101）和芯片（22,62,102）组装电力转换模块（23,63,103），这可以缩短电力之间的电流路径 转换模块（23,63,103）和芯片（22,62,102），减少电流传输损耗，提高系统效率，减少占用空间并节省系统资源。

公开(公告)号：EP3042404A1

公开(公告)日：2016-07-13

申请号：EP14756220.1

申请日：2014-08-18

Applicant: Johnson Controls Technology Company

Inventor： DEKEUSTER, Richard M. ,  MACK, Robert J. ,  SOLESKI, Edward J. ,  TYLER, Matthew R. ,  CASH, Stephen D. ,  BALK, Mikhail S.

IPC: H01M2/10 ,  H01M2/12 ,  H01M10/42 ,  H01M2/20 ,  H01M2/30 ,  H01M10/613 ,  H01M10/625 ,  H01M10/647 ,  H01M10/6551

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.

Abstract translation: 提供一种母线，其包括包括第一材料的第一端和包括第二材料的第二端和制造方法。 第一端被设计成耦合到电池模块的第一电池单元的端子，并且包括设置在第一端上的第一环，设计成接收和围绕电池模块的第一电池单元的端子。 第二端被设计成耦合到电池模块的第二电池单元的端子，并且包括设置在第二端上的第二套环，其设计成接收和围绕电池模块的第二电池的端子。 电池模块的第一和第二电池彼此相邻。 此外，母线包括电连接和机械耦合第一端和第二端的接头。

公开(公告)号：EP3042212A1

公开(公告)日：2016-07-13

申请号：EP14761767.4

申请日：2014-08-25

Applicant: Johnson Controls Technology Company

Inventor： DULLE, Ronald J. ,  GUNDERSON, Mark D. ,  THIEME, Bryan L.

IPC: G01R31/36 ,  H01M2/10 ,  H01M10/42 ,  H01M10/48 ,  H02J7/00 ,  H01M2/12 ,  H01M2/20 ,  H01M2/30 ,  H01M10/613 ,  H01M10/625 ,  H01M10/647 ,  H01M10/6551

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.

Abstract translation: 提供一种母线，其包括包括第一材料的第一端和包括第二材料的第二端和制造方法。 第一端被设计成耦合到电池模块的第一电池单元的端子，并且包括设置在第一端上的第一环，设计成接收和围绕电池模块的第一电池单元的端子。 第二端被设计成耦合到电池模块的第二电池单元的端子，并且包括设置在第二端上的第二套环，其设计成接收和围绕电池模块的第二电池的端子。 电池模块的第一和第二电池彼此相邻。 此外，母线包括电连接和机械耦合第一端和第二端的接头。

公开(公告)号：EP2757613A1

公开(公告)日：2014-07-23

申请号：EP13183848.4

申请日：2013-09-11

Applicant: Samsung SDI Co., Ltd.

Inventor： Yi, Sang-Il ,  Kang, Moon-Gil

IPC: H01M2/20 ,  H01M10/42 ,  H05K3/40 ,  H05K1/00 ,  G01R31/36

CPC classification number: H01M2/34 ,  H01M2/105 ,  H01M2/204 ,  H01M10/425 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10916 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: A rechargeable battery pack according to an exemplary embodiment of the present invention includes a plurality of unit cells (11, 12, 13, 14), connection tabs (30, 40) for electrically connecting the plurality of unit cells, connection plates (50, 70) combined with the connection tabs, and a protective circuit module (21) in which grooves (22, 23) with which the connection plates are combined are formed.

Abstract translation: 根据本发明的示例性实施例的可充电电池组包括多个单元电池（11,12,13,14），用于电连接所述多个单元电池的连接片（30,40），连接板（50， 70），以及保护电路模块（21），其中形成有连接板组合的凹槽（22,23）。