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    11.
    发明专利
    未知

    公开(公告)号：DE3787399D1

    公开(公告)日：1993-10-21

    申请号：DE3787399

    申请日：1987-04-22

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  LUSSOW ROBERT OTIS ,  NUFER ROBERT WOLFF ,  SCHWARTZ BERNARD ,  ACOCELLA JOHN ,  REDDY SRINIVASA N

    IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H01L23/52

    Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

    12.
    发明专利
    未知

    公开(公告)号：DE3576793D1

    公开(公告)日：1990-05-03

    申请号：DE3576793

    申请日：1985-04-23

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  MASTER RAJ NAVINCHANDRA ,  NUFER ROBERT WOLFF

    IPC: B22F1/00 ,  B22F3/10 ,  C04B41/51 ,  C04B41/88 ,  C22C1/04 ,  H01L21/48 ,  H05K1/09 ,  H05K3/46

    Abstract: In the formation of a glass-ceramic substrate containing multi-layer, interconnected thick-film pattern of metal-based conductors by subjecting glass-ceramic and metal particles to a sintering cycle, sintering of the metal particles at their normal sintering temperature is inhibited by coating the metal particles with an organic material such as polyvinyl butyral, polyvinyl formvar, polyvinyl alcohol, polyacrylonitrile epoxies, urethanes and cross-linked polyvinyl butyral. The organic coating serves as a barrier preventing physical contact between metal particles during the initial phase of the sintering cycle and degrades into a carbonaceous coating followed by volatilization during the intermediate phase of the cycle permitting coalescence of the metal particles into a dense mass along with the coalescence of the glass-ceramic particles. Co-sintering of the metal particles and the glass-ceramic particles with the aid of the organic coating results in a hermectic multi-layer glass ceramic substrate free of dimensional stability problems without deleteriously affecting the electrical conductivity of the metal conductor pattern.

    DIFFUSION ISOLATION LAYER IN A COATING PROCESS
    14.
    发明专利
    DIFFUSION ISOLATION LAYER IN A COATING PROCESS 未知

    公开(公告)号：AU569805B2

    公开(公告)日：1988-02-18

    申请号：AU4791285

    申请日：1985-09-26

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  KUMAR ANANDA HOSAKERE ,  NUFER ROBERT WOLFF

    IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

    20.
    发明专利
    未知

    公开(公告)号：DE3787399T2

    公开(公告)日：1994-04-21

    申请号：DE3787399

    申请日：1987-04-22

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  LUSSOW ROBERT OTIS ,  NUFER ROBERT WOLFF ,  SCHWARTZ BERNARD ,  ACOCELLA JOHN ,  REDDY SRINIVASA N

    IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H01L23/52

    Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

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