公开(公告)号：DE69324959D1

公开(公告)日：1999-06-24

申请号：DE69324959

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：IE79088B1

公开(公告)日：1998-04-08

申请号：IE960846

申请日：1996-12-02

Applicant: IBM

Inventor： ANDRICACOS PANAYOTIS CONSTANTI ,  DATTA MADAV ,  DELIGIANNI HARIKLIA ,  HORKANS WILMA JEAN ,  KANG SUNG KWON ,  KWIETNIAK KEITH THOMAS ,  MATHAD GANGADHARA SWAMI ,  PURUSHOTHAMAN SAMPATH ,  SHI LEATHEN ,  TONG HO-MING

IPC: B23K35/26 ,  B23K35/00 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L21/60 ,  H01L23/485 ,  H01L23/488

Abstract: An interconnection structure suitable for the connection of microelectronic circuit chips to packages is provided by this invention. In particular, the invention pertains to the area-array or flip-chip technology often called C4 (controlled collapse chip connection). The structure comprises an adhesion/barrier layer deposited on a passivated substrate (e.g., a silicon wafer), optionally an additional adhesion layer, a solderable layer of a metal selected from the group consisting of Ni, Co, Fe, NiFe, NiCo, CoFe and NiCoFe on the adhesion/barrier layer, and a lead-free solder ball comprising tin as the predominate component and one or more alloying elements selected from Bi, Ag, and Sb, and further optionally including one or more elements selected from the group consisting of Zn, In, Ni, Co and Cu.

公开(公告)号：DE68913823T2

公开(公告)日：1994-09-22

申请号：DE68913823

申请日：1989-04-27

Applicant: IBM

Inventor： CUOMO JEROME JOHN ,  KANG SUNG KWON ,  KIM JUNGIHL ,  LAURO PAUL ,  MIERSCH EKKEHARD FRITZ ,  RITSKO JOHN JAMES ,  SAXENMEYER GEORGE JOHN ,  WALKER GEORGE FREDERICK

IPC: H01R13/02 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H05K3/32

公开(公告)号：DE3787772T2

公开(公告)日：1994-05-05

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48