公开(公告)号：PL208012B1

公开(公告)日：2011-03-31

申请号：PL37450203

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

公开(公告)号：AT365375T

公开(公告)日：2007-07-15

申请号：AT03798815

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN ,  GARCIA JAMES ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

公开(公告)号：SG186359A1

公开(公告)日：2013-01-30

申请号：SG2012092235

申请日：2011-07-01

Applicant: LAM RES CORP

Inventor： KOLICS ARTUR ,  REDEKER FRITZ

Abstract: One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device.

公开(公告)号：SG181638A1

公开(公告)日：2012-07-30

申请号：SG2012042909

申请日：2010-12-10

Applicant: LAM RES CORP

Inventor： WANG YAXIN ,  LI SHIJIAN ,  REDEKER FRITZ ,  PARKS JOHN ,  KOLICS ARTUR ,  YOON HYUNGSUK ALEXANDER ,  DE FILIPE TAREK SUWWAN ,  KOROLIK MIKHAIL

Abstract: Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate.

公开(公告)号：DE60314508D1

公开(公告)日：2007-08-02

申请号：DE60314508

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

公开(公告)号：MY144394A

公开(公告)日：2011-09-15

申请号：MYPI20045300

申请日：2004-12-22

Applicant: LAM RES CORP

Inventor： LARIOS JOHN M DE ,  OWCZARZ ALEKSANDER ,  SCHOEPP ALAN ,  REDEKER FRITZ

IPC: B08B11/02 ,  B08B3/00 ,  H01L21/00

Abstract: AN APPARATUS FOR USE IN PROCESSING A SUBSTRATE (216) INCLUDES A BRUSH ENCLOSURE (212) EXTENDING OVER A LENGTH (218). THE BRUSH ENCLOSURE (212) IS CONFIGURED TO BE DISPOSED OVER A SURFACE OF THE SUBSTRATE AND HAS AN OPEN REGION (222) THAT IS CONFIGURED TO BE DISPOSED IN PROXIMITY TO THE SUBSTRATE. THE OPEN REGION EXTENDS OVER THE LENGTH OF THE BRUSH ENCLOSURE AND ENABLES FOAM (410) FROM WITHIN THE BRUSH ENCLOSURE TO CONTACT THE SURFACE OF THE SUBSTRATE. A SUBSTRATE CLEANING SYSTEM AND METHOD FOR CLEANING A SUBSTRATE ARE ALSO DESCRIBED.

公开(公告)号：MY140370A

公开(公告)日：2009-12-31

申请号：MYPI20045251

申请日：2004-12-20

Applicant: LAM RES CORP

Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  FARBER JEFFREY ,  KOROLIK MIKHAIL ,  REDEKER FRITZ ,  OWCZARZ ALEKSANDER

IPC: B08B3/00 ,  H01L21/00

Abstract: An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

公开(公告)号：MY139627A

公开(公告)日：2009-10-30

申请号：MYPI20051481

申请日：2005-04-01

Applicant: LAM RES CORP

Inventor： RAVKIN MICHAEL ,  SMITH MICHAEL G R ,  LARIOS JOHN M DE ,  REDEKER FRITZ ,  KOROLIK MIKHAIL ,  DIPIETRO CHRISTIAN

IPC: B08B3/00 ,  B08B3/04 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

Abstract: AMONG THE MANY EMBODIMENT, IN ONE EMBODIMENT, A METHOD FOR PROCESSING A SUBSTRATE (108) IS DISCLOSED WHICH INCLUDES GENERATING A FLUID LAYER ON A SURFACE OF THE SUBSTRATE (108), THE FLUID LAYER DEFINING A FLUID MENISCUS (116). THE GENERATING INCLUDES MOVING A HEAD (106) IN PROXIMITY TO THE SURFACE, APPLYING A FLUID FROM THE HEAD (106) TO THE SURFACE WHILE THE HEAD (106) IS IN PROXIMITY TO THE SURFACE OF THE SUBSTRATE (108) TO DEFINE THE FLUID LAYER, AND REMOVING THE FLUID FROM THE SURFACE THROUGH THE PROXIMITY HEAD BY A VACUUM (312). THE FLUID TRAVELS ALONG THE FLUID LAYER BETWEEN THE HEAD (106) AND THE SUBSTRATE (108) AT A VELOCITY THAT INCREASES AS THE HEAD (106) IS IN CLOSER PROXIMITY TO THE SURFACE.

公开(公告)号：DE60314508T2

公开(公告)日：2008-02-21

申请号：DE60314508

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

公开(公告)号：SG10201407683UA

公开(公告)日：2014-12-30

申请号：SG10201407683U

申请日：2010-12-10

Applicant: LAM RES CORP

Inventor： WANG YAXIN ,  LI SHIJIAN ,  REDEKER FRITZ ,  PARKS JOHN ,  KOLICS ARTUR ,  YOON HYUNGSUK ALEXANDER ,  DE FILIPE TAREK SUWWAN ,  KOROLIK MIKHAIL

Abstract: PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING Methods and systems for handling a substrate through processes including an integrated electro less deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electro less deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate. FIG.4B