Abstract:
PURPOSE: Provided are a method and an apparatus for forming a resist pattern in which amending operation is facilitated by a reduced workload of an operator and in the same time, the appropriate amendment can be performed. CONSTITUTION: A controller(7) having a controlling portion controls a processing of a coating and developing apparatus(100) with a coating unit(3A) and a developing unit(3B). An inspecting portion(A2) and the like measures at least one of a plurality of measurement items selected from, a reflection ratio and a film thickness of a base film and a resist film, a line width after the development, an accuracy that the base film matches with a resist pattern, a defect after the development, and so on. The measured data is transmitted to the controller(7). At the controller(7), a parameter subject to an amendment is selected based on the corresponding data of each of the measurement item such as the film thickness of the resist and the line width after the development, and the amendment of the parameters subject to the amendment is performed.
Abstract:
PURPOSE: An image generating method, a substrate inspecting method, and a recording media and a substrate inspecting device for performing the image generating method and the substrate inspecting method are provided to reduce the number of intention failure wrongly detected and to detect actual failure. CONSTITUTION: An image generating method having a filter image generating process is as follows. A pixel value of a pixel positioned on the circumference of a circle having a central position of recorded images as a center is converted into a maximum value among the pixel values of a plurality of pixels selected from the pixels positioned on the circumference so that filter images are generated(S14). Position coordinates of the pixel of the recorded images are converted into polar coordinates so that converted images are generated. Maximum data indicating a relation of the maximum value among the pixel values and the diameter of the circle is generated based on the converted images. [Reference numerals] (AA) Start; (BB) Decision process; (CC,DD) Decided that defects are existed on a substrate; (EE) Finish; (S11) Synthetic image process; (S12) Converted image process; (S13) Data process; (S14) Filter image process; (S15) Object image process; (S16) Elimination image process; (S17) Whether or not a pixel value of one pixel is larger than a criterion?
Abstract:
PURPOSE: A defect inspection device is provided to implement inspection on a wafer within a smaller space by rotating the wafer when taking an image of the wafer. CONSTITUTION: A defect inspection device(1) comprises a loading table which is able to place a wafer(W) and rotate, a lighting device(21) which is installed directly over the loading table and arranged parallel to the straight area extended from the center of rotation to the peripheral part of the wafer in order to illuminate the wafer, a half mirror(22) which is directly under the lighting device and let the light from the lighting device pass and reflected off the wafer, and a photographing device(20) which acquires the light reflected from the half mirror.