22.
    发明专利
    未知

    公开(公告)号:DE59914589D1

    公开(公告)日:2008-02-07

    申请号:DE59914589

    申请日:1999-11-11

    Abstract: The component (5) can be connected to a burn-in voltage, which is higher than its internal voltage, which is impressed across a switchable regulator (6) integrated in the component. An element (1,2) integrated in the component has a different characteristic, e.g. degradation, from the regulator under the burn-in voltage after the burn-in test duration. The element may be a fuse.

    23.
    发明专利
    未知

    公开(公告)号:DE102005051943A1

    公开(公告)日:2006-07-06

    申请号:DE102005051943

    申请日:2005-10-29

    Abstract: The present invention relates to an integrated memory device including: memory cells arranged at wordlines and bitlines, wherein the memory cells are addressable in sets of 2 n bit, wherein n is an integer, a pre-fetch read unit to pre-fetch an addressed set of 2 n data bit in parallel from the addressed memory area, buffer memory to buffer the number of pre-fetched data bits; a number m of output ports to output the data bits buffered in the buffer memory; an output controller for controlling the outputting of the data bits buffered in the buffer memory to the number m of output ports in groups of m bits in one or a plurality of successive cycles, characterized in that the number m of output ports is different to any of the possible numbers 2 n of the sets of addressable memory cells.

    24.
    发明专利
    未知

    公开(公告)号:DE10124752B4

    公开(公告)日:2006-01-12

    申请号:DE10124752

    申请日:2001-05-21

    Abstract: The invention features a method for reading and storing a binary memory cell signal where a signal transit time of the binary memory cell signal between one memory cell and an output terminal is reduced. The method includes applying a binary memory cell signal to a bit line pair; switching through the binary memory cell signal from the bit line pair to a local data line pair via a sense amplifier; switching through the amplified binary memory cell signal by a main data switching unit from the local data line to a main data line pair; and outputting the amplified, transferred binary memory cell signal via the first main data line and the second main data line pairs.

    28.
    发明专利
    未知

    公开(公告)号:DE19962677A1

    公开(公告)日:2001-07-05

    申请号:DE19962677

    申请日:1999-12-23

    Abstract: The configuration allows for testing a multiplicity of semiconductor chips with respect to critical parameters on the wafer level. Each of the semiconductor chips on a semiconductor wafer is additionally provided with at least one option pad. The option pad allows access for a test program to the chip for separating out the semiconductor chips which do not correspond to predetermined requirements for critical parameters.

    Semiconductor chip separation device

    公开(公告)号:DE19961790C1

    公开(公告)日:2001-05-10

    申请号:DE19961790

    申请日:1999-12-21

    Abstract: The separation device separates a semiconductor chip from a semiconductor wafer having an insulation layer (3) provided with a number of metallisation planes (M0,M1,M2), in which a recess (5) is provided for reducing the thickness of the insulation layer to define a separation line. The insulation layer is provided by a silicon dioxide layer, which is provided with openings for electrical connection of the uppermost metallisation plane (M2) with the underlying metallisation plane (M1) via a connection layer (C2), together with the recess for reducing the thickness of the insulation layer.

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