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公开(公告)号：KR101403864B1
公开(公告)日：2014-06-09
申请号：KR1020110143455
申请日：2011-12-27
Applicant: 제일모직주식회사
CPC classification number: H01L23/544 , C09J7/20 , C09J2201/28 , C09J2201/36 , C09J2203/326 , H01L21/6836 , H01L21/70 , H01L24/27 , H01L2221/68327 , H01L2224/83191
Abstract: 본원 발명은 점착층과 링프레임간의 탈리를 방지하여 공정성을 높이는 다이싱 다이본딩 필름에 관한 것이다. 보다 구체적으로 본원 발명은 점착층 중 링프레임과의 부착 부위 내에 홈이 형성되어있어, 반도체 제조 공정상 투입되는 물 및/또는 공기를 상기 홈을 통하여 제거함으로써, 필름과 링프레임간의 부착력 약화 및 탈리를 방지하는 다이싱 다이본딩 필름에 관한 것이다.
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公开(公告)号：KR101266546B1
公开(公告)日：2013-05-27
申请号：KR1020100122967
申请日：2010-12-03
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J201/00 , C09J11/00 , C09J7/02
Abstract: 본발명의반도체용접착제조성물은고분자수지, 에폭시수지및 경화제를포함하며, 125℃에서 1시간, 150℃에서 10분의경화사이클 3회후 175℃에서의점도가 1.0×10내지 3.0×10poise인것을특징으로한다. 본발명의반도체용접착제조성물및 이를이용한반도체용접착필름은단계별경화시에도용융점도가낮아몰딩시보이드제거특성이우수하며, 픽업공정시근접다이의동시들림현상, 리플로우공정후 접착제의박리, 크랙등이발생하지않아고신뢰성을가질수 있다.
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公开(公告)号：KR1020120077645A
公开(公告)日：2012-07-10
申请号：KR1020100139682
申请日：2010-12-30
Applicant: 제일모직주식회사
IPC: C09J133/14 , C09J133/04 , C09J7/02 , H01L21/58
CPC classification number: C09J133/14 , C09J7/385 , C09J133/04 , C09J2201/606 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: An adhesive composition and dicing die bonding film using the same are provided to solve a problem which requires additional film attachment by having excellent adhesiveness. CONSTITUTION: An adhesive composition comprises acrylic copolymer and a hardener. The acrylic copolymer has one or more alkyl groups, one or more -OHs and one or more phosphate groups. The acrylic copolymer is obtained by polymerization of (meta)acrylate having one or more hydroxy groups, (meta)acrylate having one or more alkyl groups, and (meta)acrylate having one or more phosphates. The (meta)acrylate having phosphate group is marked as CH2=CR-C(=O)O-(CH2)m-O-P(=O)(OR1)(OR2). In the chemical formula, R indicates -H or -(CH2) n-CH3, n indicates an integer of 0-5, R1 and R2 are independently hydrogen, alkyl having 1-10 carbons, or aryl having 6-20 carbons. m indicates an integer of 1-10. 0.1-10 parts by weight of the (meta)acrylate having phosphate group is included based on 100.0 parts by weight of the acrylic copolymer.
Abstract translation: 目的：提供一种使用其的粘合剂组合物和切割模片接合膜，以解决通过具有优异的粘合性需要额外的膜附着的问题。 构成：粘合剂组合物包含丙烯酸共聚物和硬化剂。 丙烯酸共聚物具有一个或多个烷基，一个或多个-OH和一个或多个磷酸酯基团。 通过聚合具有一个或多个羟基的（甲基）丙烯酸酯，具有一个或多个烷基的（甲基）丙烯酸酯和具有一个或多个磷酸酯的（甲基）丙烯酸酯）得到丙烯酸共聚物。 具有磷酸基的（甲基）丙烯酸酯标记为CH 2 = CR-C（= O）O-（CH 2）m -O-P（= O）（OR 1）（OR 2）。 在化学式中，R表示-H或 - （CH2）n-CH3，n表示0-5的整数，R1和R2独立地为氢，具有1-10个碳的烷基或具有6-20个碳的芳基。 m表示1-10的整数。 基于100.0重量份的丙烯酸共聚物，包括0.1-10重量份的具有磷酸基的（甲基）丙烯酸酯。
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公开(公告)号：KR1020120074110A
公开(公告)日：2012-07-05
申请号：KR1020100136069
申请日：2010-12-27
Applicant: 제일모직주식회사
IPC: C09J9/00 , C09J163/00 , C09J11/02 , C09J7/02
CPC classification number: C09J9/00 , C09J7/22 , C09J7/35 , C09J11/02 , C09J163/00 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: An adhesive composition for semiconductor and an adhesive film including the same are provided to reduce or omit semi-cure process and to remove or minimize foamable void. CONSTITUTION: An adhesive composition for semiconductor has a compressive strength of 100-150 gf/mm^2 at 125 deg. Celsius after curing for 60 minutes and compressive strength of 500-1000 gf/mm^2 at 150 deg. Celsius after curing for 10 minutes, at 150 deg. Celsius after curing for 30 minutes, and at 175 deg. Celsius after mold 60 seconds, and the void thereof are all less than 10%. The adhesive compound comprises a thermoplastic resin, an epoxy resin, a hardener, and a curing catalyst. 30-70 weight% of the thermoplastic resin is included based on whole composition. The thermoplastic resin content amount is bigger than sum total of the epoxy resin and the hardener.
Abstract translation: 目的：提供用于半导体的粘合剂组合物和包含其的粘合剂膜以减少或省略半固化过程并除去或最小化可发泡空隙。 构成：半导体用粘合剂组合物在125度下的抗压强度为100-150gf / mm ^ 2。 固化60分钟后的摄氏度，150度时的抗压强度为500-1000gf / mm ^ 2。 固化10分钟后，摄氏150度。 固化30分钟后，摄氏175度。 模具60秒后的摄氏度，其空隙均小于10％。 粘合剂包括热塑性树脂，环氧树脂，硬化剂和固化催化剂。 基于全部组成包括30-70重量％的热塑性树脂。 热塑性树脂含量大于环氧树脂和固化剂的总和。
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公开(公告)号：KR1020120061610A
公开(公告)日：2012-06-13
申请号：KR1020100122967
申请日：2010-12-03
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J201/00 , C09J11/00 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/35 , C09J7/38 , C09J11/00 , C09J201/005 , C09J2201/16 , C09J2201/36 , C09J2201/61 , C09J2201/622 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for semiconductors and an adhesive film using thereof are provided to enhance void elimination property during molding and to prevent lifting of close die during a pick-up process. CONSTITUTION: An adhesive composition for semiconductors comprises 50-90 weight% of polymer resin, 5-30 weight% of epoxy resin, and 1-30 weight% of hardener. A melting point at 175 deg. Celsius after 3 times of curing cycles at 125 deg. Celsius for 1 hour is 1.0×10^5 - 3.0×10^6 poise. The adhesive film for semiconductors comprises a base film, a tackifier layer which is laminated on the base film, an adhesive layer which is laminated on the adhesion layer and is formed with the adhesive composition, and a protective film which is laminated on the bonding layer.
Abstract translation: 目的：提供用于半导体的粘合剂组合物和使用其的粘合剂膜，以增强模制期间的空隙消除性能，并且防止在拾取过程中关闭模具的提升。 构成：半导体用粘合剂组合物包含50-90重量％的聚合物树脂，5-30重量％的环氧树脂和1-30重量％的硬化剂。 熔点为175度 摄氏度为125度后3次固化循环。 摄氏1小时为1.0×10 ^ 5 - 3.0×10 ^ 6泊。 半导体用粘合膜包括基膜，层叠在基膜上的增粘层，层叠在粘合层上并形成有粘合剂组合物的粘合层和层叠在接合层上的保护膜 。
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Patent Agency Ranking
公开(公告)号：KR101103407B1
公开(公告)日：2012-01-05
申请号：KR1020080133849
申请日：2008-12-24
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J163/00 , C09J11/00
CPC classification number: C09J163/00 , C09J7/35 , C09J2201/128 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/838 , H01L2224/8592 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/0665 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
Abstract: 본 발명은 반도체용 접착제 조성물 및 이를 이용하여 제조된 복층구조 접착 필름에 관한 것으로, 전이금속 및 전이금속 이온의 이동으로 인해 야기되는 반도체 칩의 신뢰성 저하를 해결하기 위하여, 전이금속 이온과 결합을 통하여 또는 전이금속 이온을 산화 또는 환원시키고, 전이금속의 이동도를 현저히 감소시킬 수 있는 기능기를 포함하는 접착제 조성물을 사용하되, 후속의 와이어 본딩 공정을 고려하여 유동성을 확보할 수 있는 접착필름을 더 형성함으로써, 반도체 작동의 안정성을 높일 수 있고, 접착 필름의 치수 안정성을 확보함과 동시에 인장강도를 증가시켜 반도체 칩 접합 공정의 신뢰도를 높일 수 있도록 하는 발명에 관한 것이다.
접착필름, 반도체용 접착제, 조성물, 다이싱, 전이금속Abstract translation: 本发明涉及一种用于半导体的粘合剂层和通过使用该粘合剂层制备的双层粘合膜，其中为了解决由过渡金属和过渡金属离子迁移引起的半导体芯片的可靠性恶化的问题， 使用过渡金属离子或过渡金属离子被氧化或还原，并且使用包含可显着降低过渡方法的迁移率的官能团的粘合剂层; 进一步形成能够确保流动性的粘合剂膜，考虑到随后的引线接合工艺，从而可以提高半导体操作的稳定性，确保粘合膜的尺寸稳定性，提高拉伸强度和提高可靠性 半导体芯片焊接工艺得到加强。
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公开(公告)号：KR101019756B1
公开(公告)日：2011-03-09
申请号：KR1020090131248
申请日：2009-12-24
Applicant: 제일모직주식회사
CPC classification number: H01L24/29 , H01L21/6836 , H01L24/27 , H01L2224/274 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/181 , H01L2924/3025 , Y10T156/1092 , Y10T428/14 , Y10T428/1462 , Y10T428/2809 , H01L2924/00 , C09J7/20 , C09J2203/326 , C09J2205/10
Abstract: PURPOSE: A non-UV type die attach film is provided to lower an adhesion between a dicing film layer and an adhesive layer to strippability required for chip picup while maintaining the adhesion of the edge portion of the dicing film layer. CONSTITUTION: A method for manufacturing a die attach film comprises the steps of: introducing an adhesive layer(120) and a dicing film layer(110) of a photo-curable adhesive including an adhesive layer portion(113) and a ring frame portion(114); and irradiating ultraviolet ray to a back side of the dicing film layer and inducing the inflow of oxygen as a radical scavenger to an upper side of the exposed ring frame portion to suppress the photo-curing of the ring frame portion, and inducing the photo-curing of the adhesive layer portion in which the inflow of the oxygen is blocked by the adhesive layer.
Abstract translation: 目的：提供非UV型贴片膜，以降低切割膜层和粘合剂层之间的粘附性，同时保持切割膜层的边缘部分的粘附性，从而切片切片所需的剥离性。 构成：用于制造管芯附着膜的方法包括以下步骤：引入包含粘合剂层部分（113）和环形框架部分（113）的光固化粘合剂的粘合剂层（120）和切割膜层（110） 114）; 并且将紫外线照射到切割膜层的背面并引起作为自由基清除剂的氧气流入暴露的环形框架部分的上侧，以抑制环形框架部分的光固化， 粘合层部分的固化，其中氧气的流入被粘合剂层阻挡。
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公开(公告)号：KR1020100075213A
公开(公告)日：2010-07-02
申请号：KR1020080133849
申请日：2008-12-24
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J163/00 , C09J11/00
CPC classification number: C09J163/00 , C09J7/35 , C09J2201/128 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/838 , H01L2224/8592 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/0665 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
Abstract: PURPOSE: An adhesive composition for a semiconductor device, and a multi-layer adhesive film using thereof are provided to prevent the reliability deterioration of a semiconductor chip occurred from a transition metal infiltrated on a bonding interface. CONSTITUTION: A multi-layer adhesive film for a semiconductor device comprises a first adhesive layer(150) and a second adhesive layer(140). The first adhesive layer is formed on the upper side of a base film with an adhesive composition containing 50~90wt% of binder with a transition metal-trapping group. The second adhesive layer is formed on the upper side of the first adhesive layer with the adhesive composition containing 15~30wt% of the binder with the transition metal-trapping group.
Abstract translation: 目的：提供一种用于半导体器件的粘合剂组合物及其使用的多层粘合膜，以防止渗透在接合界面上的过渡金属发生半导体芯片的可靠性劣化。 构成：用于半导体器件的多层粘合膜包括第一粘合剂层（150）和第二粘合剂层（140）。 第一粘合剂层在基膜的上侧形成有粘合剂组合物，该粘合剂组合物含有50〜90重量％的粘合剂和过渡金属捕获基团。 第二粘合剂层形成在第一粘合剂层的上侧，粘合剂组合物含有15〜30wt％的粘合剂与过渡金属捕获基团。
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公开(公告)号：KR1020090022722A
公开(公告)日：2009-03-04
申请号：KR1020070088323
申请日：2007-08-31
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J183/04 , C09J7/02
CPC classification number: C09J133/14 , Y10T428/1471 , C09J7/00 , C09J2203/326
Abstract: An adhesive composition is provided to prevent the sticking by adding silicon modified acrylate imparting releasability and slip property to an adhesive binder and to secure enough pick-up property by lowering the maximum value of releasability. A photo-curable composition for an adhesive layer comprises an embedded adhesive binder, reactive acrylate having a dimethylsiloxane structure to a molecular chain, thermosetting material and photoinitiator. The embedded adhesive binder is added with low-molecular-weight acrylate having a carbon-carbon double bond to a side chain of polymer adhesive resin polymerized with an acrylate monomer. The interactive acrylate has a structure represented by the chemical formula 1. In the chemical formula 1, n is an integer of 5-1000.
Abstract translation: 提供粘合剂组合物以通过添加硅改性丙烯酸酯赋予粘合剂粘合剂赋予脱模性和滑爽性，并且通过降低脱模性的最大值来确保足够的吸收性能来防止粘附。 用于粘合剂层的可光固化组合物包括嵌入粘合剂粘合剂，分子链具有二甲基硅氧烷结构的反应性丙烯酸酯，热固性材料和光引发剂。 向嵌入的粘合剂粘合剂中加入具有碳 - 碳双键的低分子量丙烯酸酯与聚合物粘合剂树脂与丙烯酸酯单体聚合的侧链。 交互式丙烯酸酯具有由化学式1表示的结构。在化学式1中，n为5-1000的整数。
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公开(公告)号：KR1020090014513A
公开(公告)日：2009-02-11
申请号：KR1020070078527
申请日：2007-08-06
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J11/02 , C09J161/00 , C09J163/00 , C09J2203/326
Abstract: An adhesive film for semiconductor assembly is provided to ensure the adhesive force between wafers or of a wafer and PCB, to improve the pick-up property with an adhesion layer due to the improvement of tensile modulus, and to minimize the bubbles generated in a die attach process due to a thermoplastic property. An adhesive film composition for semiconductor assembly comprises (a) phenoxy-based resin, (b) elastomeric resin containing a hydroxyl group or an epoxy group, (c) epoxy-based resin, (d) phenol type epoxy hardener or aromatic amine-based hardener, (e) at least one material selected from the group consisting of a latent catalytic curing agent and curing catalyst, (f) silane coupling agent and (g) filler.
Abstract translation: 提供用于半导体组件的粘合膜以确保晶片或晶片和PCB之间的粘合力，由于拉伸模量的改善而提高了粘合层的吸收性能，并且使模具中产生的气泡最小化 由于热塑性能而附着工艺。 用于半导体组合物的粘合膜组合物包括（a）苯氧基类树脂，（b）含有羟基或环氧基的弹性体树脂，（c）环氧类树脂，（d）酚型环氧固化剂或芳香族胺类 硬化剂，（e）选自潜催化固化剂和固化催化剂中的至少一种材料，（f）硅烷偶联剂和（g）填料。
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