公开(公告)号：SG121693A1

公开(公告)日：2006-05-26

申请号：SG200104767

申请日：1997-11-10

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  DIMITRAKOPOULOS CHRISTOS DIMIT ,  FURMAN BRUCE KENNETH ,  GRAHAM TERESITA O

IPC: H01L21/3205 ,  G02F1/1343 ,  G02F1/1345 ,  H01L21/28 ,  H01L21/288 ,  H01L21/58 ,  H01L23/52 ,  H01L27/148 ,  H01L29/43 ,  H01L29/45 ,  H01L29/49 ,  H01L29/786 ,  H01L31/00 ,  H01L31/10 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  H01L51/05 ,  H01L51/40 ,  H01L51/50 ,  H01L51/52 ,  H05B33/12 ,  H05B33/14 ,  H05B33/26

公开(公告)号：AU2002351269A1

公开(公告)日：2004-06-30

申请号：AU2002351269

申请日：2002-12-05

Applicant: IBM

Inventor： HUANG WU-SONG ,  LI WENJIE ,  MOREAU WAYNE ,  MEDEIROS DAVID E ,  PETRILLO KAREN E ,  LANG ROTBERT N ,  ANGELOPOULOS MARIE

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/30

公开(公告)号：AU2003230825A1

公开(公告)日：2003-11-03

申请号：AU2003230825

申请日：2003-04-01

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  BABICH KATHERINA ,  BROCK PHILLIP ,  HUANG WU-SONG ,  MAHOROWALA ARPAN P ,  MEDEIROS DAVID R ,  SOORIYAKUMARAN RATNAM ,  PFEIFFER DIRK

IPC: G03F7/11 ,  G03F7/004 ,  G03F7/038 ,  G03F7/075 ,  G03F7/09 ,  H01L21/027 ,  G03F7/00 ,  G03F7/26

Abstract: Antireflective compositions characterized by the presence of an SiO-containing polymer having chromophore moieties and transparent moieties are useful antireflective hardmask compositions in lithographic processes. These compositions provide outstanding optical, mechanical and etch selectivity properties while being applicable using spin-on application techniques. The compositions of the invention are advantageously useful with shorter wavelength lithographic processes and/or have minimal residual acid content.

公开(公告)号：DE69712959T2

公开(公告)日：2003-01-23

申请号：DE69712959

申请日：1997-03-21

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  YUN-HSIN LIAO ,  SARAF RAVI F

IPC: C08G61/12 ,  H01B1/12

公开(公告)号：DE60237318D1

公开(公告)日：2010-09-23

申请号：DE60237318

申请日：2002-12-05

Applicant: IBM

Inventor： HUANG WU-SONG ,  LI WENJIE ,  MOREAU WAYNE ,  MEDEIROS DAVID E ,  PETRILLO KAREN E ,  LANG ROTBERT N ,  ANGELOPOULOS MARIE

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/30

公开(公告)号：AU2002329596A1

公开(公告)日：2004-02-02

申请号：AU2002329596

申请日：2002-07-11

Applicant: IBM

Inventor： MOREAU WAYNE M ,  ANGELOPOULOS MARIE ,  ARIRAM ARI ,  GUARNIERI C RICHARD ,  HUANG WU-SONG ,  KWONG RANEE

IPC: C08K5/00 ,  B05D5/00 ,  B32B9/04 ,  C08G77/04 ,  C08J7/18 ,  C08L83/04 ,  G03C1/76 ,  H01L21/312 ,  H01L21/3213

公开(公告)号：DE69517788T2

公开(公告)日：2000-12-14

申请号：DE69517788

申请日：1995-12-22

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  GELORME JEFFREY DONALD ,  KUCZYNSKI JOE

IPC: C09J9/02 ,  H01B1/12 ,  C09J201/00

Abstract: An electrically conductive pressure sensitive adhesive containing electrically conductive polymers used as an alternative to metallic solder in interconnect electronic applications.

公开(公告)号：SG71852A1

公开(公告)日：2000-04-18

申请号：SG1998003973

申请日：1998-10-02

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  BUCCHIGNANO JAMES JOSEPH ,  PETRILLO KAREN E

IPC: G03C1/89 ,  G03F7/004 ,  G03F7/038 ,  H01B1/12 ,  H05K1/09

Abstract: The present invention is an electrically conductive polymeric composition of matter having a controlled pH and structures fabricated therewith and methods of fabrication thereof having: a surface; a plurality of layer on the surface; at least one of the plurality of layers is formed from an energy sensitive material; at least another layer is formed from an electrically conductive polymer; the electrically conductive polymer contains acid functionality; and the electrically conductive polymer has a predetermined pH. The pH is controlled by additives mixed in with the electrically conductive polymer or by constituents on the electrically conductive polymer. The electrically conductive polymer is preferably a top layer. The structures are useful for lithography in microelectronic fabrication to avoid the effects of charging on resist from electron beams. The compositions are also useful in applications as static dissipation, electromagnetic interference shielding, corrosion protection, electroplating, and wiring.