公开(公告)号：DE60314508T2

公开(公告)日：2008-02-21

申请号：DE60314508

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

公开(公告)号：AT556431T

公开(公告)日：2012-05-15

申请号：AT07007143

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/67 ,  C25D5/22 ,  C25D7/12 ,  H01L21/00

Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

公开(公告)号：MY143763A

公开(公告)日：2011-07-15

申请号：MYPI20082382

申请日：2006-12-19

Applicant: LAM RES CORP

Inventor： MIKHAIL KOROLIK ,  FREER ERIK M ,  DE LARIOS JOHN M ,  KATRINA MIKHAYLICHENKO ,  MIKE RAVKIN ,  FRED REDEKER

IPC: B08B7/00

Abstract: 1 8 METHOD AND SYSTEM FOR USING A TWO-PHASES SUBSTRATE CLEANING COMPOUND ABSTRACT OF THE DISCLOSURE 1511 CLEANING COMPOUNDS, APPARATUS, AND METHODS TO REMOVE CONTAMINANTS FROM A 5 SUBSTRATE SURFACE ARE PROVIDED. AN EXEMPLARY CLEANING COMPOUND TO REMOVE PARTICULATE CONTAMINANTS FROM A SEMICONDUCTOR SUBSTRATE SURFACE IS PROVIDED. THE CLEANING COMPOUND INCLUDES A VISCOUS LIQUID WITH A VISCOSITY BETWEEN ABOUT I CP TO ABOUT 10,000 O. THE CLEANING COMPOUND ALSO INCLUDES A PLURALITY OF SOLID COMPONENTS DISPERSED IN THE VISCOUS LIQUID, THE PLURALITY OF SOLID COMPONENTS INTERACT WITH THE PARTICULATE CONTAMINANTS ON THE SUBSTRATE SURFACE TO REMOVE THE PARTICULATE CONTAMINANTS FROM THE SUBSTRATE SURFACE,

公开(公告)号：SG169975A1

公开(公告)日：2011-04-29

申请号：SG2010097285

申请日：2006-12-18

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRITZ C

Abstract: A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.

公开(公告)号：PL208012B1

公开(公告)日：2011-03-31

申请号：PL37450203

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

公开(公告)号：AT467230T

公开(公告)日：2010-05-15

申请号：AT05251901

申请日：2005-03-29

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  KOROLIK MIKHAIL ,  RAVKIN MIKE ,  FARBER JEFFREY

IPC: H01L21/00 ,  H01L21/304 ,  B08B3/04

Abstract: A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.

公开(公告)号：CA2309583A1

公开(公告)日：1999-09-16

申请号：CA2309583

申请日：1999-02-18

Applicant: LAM RES CORP

Inventor： HYMES DIANE J ,  LI XU ,  ZHAO YUEXING ,  DE LARIOS JOHN M

IPC: C11D1/00 ,  C09K13/00 ,  C09K13/06 ,  C09K13/08 ,  C11D3/02 ,  C11D7/02 ,  C11D7/04 ,  C11D7/08 ,  C11D7/26 ,  C11D11/00 ,  C23G1/10 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/308 ,  H01L21/3205 ,  H01L21/321

Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and an ammonium compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination. The figure illustrates a flowchart of one embodiment of the process of the present invention wherein (310) is the step of polishing a copper layer on a semiconductor substrate followed by (320) the step of placing the polished semiconductor substrate in a scrubber followed by (330) the step of scrubbing the polished semiconductor substrate and ending with (340) the step of applying an acidic cleaning solution to the polished semiconductor substrate during scrubbing.

公开(公告)号：MY149848A

公开(公告)日：2013-10-31

申请号：MYPI20082419

申请日：2006-12-18

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MICHAEL RAVKIN ,  MIKHAIL KOROLIK ,  KATRINA MIKHAYLICHENKO

IPC: B08B3/00

Abstract: A METHOD FOR MAKING A SOLUTION FOR USE IN PREPARING A SURFACE OF A SUBSTRATE IS PROVIDED. THE METHOD INCLUDES PROVIDING (602) A CONTINUOUS MEDIUM THAT ADDS (604) A POLYMER MATERIAL TO THE CONTINUOUS MEDIUM. A FATTY ACID IS ADDED TO THE CONTINUOUS MEDIUM HAVING THE POLYMER MATERIAL, AND THE POLYMER MATERIAL DEFINES A PHYSICAL NETWORK THAT EXERTS FORCES IN THE SOLUTION THAT OVERCOME BUOYANCY FORCES EXPERIENCED BY THE FATTY ACID, THUS PREVENTING THE FATTY ACIDS FROM MOVING WITHIN THE SOLUTION UNTIL A YIELD STRESS OF THE POLYMER MATERIAL IS EXCEED BY AN APPLIED AGITATION. THE APPLIED AGITATION IS FROM TRANSPORTING THE SOLUTION FROM A CONTAINER TO A PREPARATION STATION THAT APPLIES THE SOLUTION TO THE SURFACE OF THE SUBSTRATE.

公开(公告)号：SG178798A1

公开(公告)日：2012-03-29

申请号：SG2012011540

申请日：2008-01-24

Applicant: LAM RES CORP

Inventor： YUN SEOKMIN ,  WILCOXSON MARK ,  DE LARIOS JOHN M

Abstract: METHOD OF LOW-K DIELECTRIC FILM REPAIRAn apparatus, system and method for repairing a carbon depleted low-k material in a low-k dielectric film layer includes identifying a repair chemistry having a hydrocarbon group, the repair chemistry configured to repair the carbon depleted low-k material and applying the identified repair chemistry meniscus to the low-k dielectric film layer such that the carbon depleted low-k material in the low-k dielectric film layer is sufficiently exposed to the repair chemistry meniscus substantially repairing the low-k material. The repaired low-k material exhibits substantially equivalent low-k dielectric characteristics of the low-k dielectric film layer.Fig. 2E

公开(公告)号：DE602005021010D1

公开(公告)日：2010-06-17

申请号：DE602005021010

申请日：2005-03-29

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  KOROLIK MIKHAIL ,  RAVKIN MIKE ,  FARBER JEFFREY

IPC: H01L21/00 ,  H01L21/304 ,  B08B3/04