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    METHOD AND APPARATUS FOR CLEANING A SUBSTRATE USING NON-NEWTONIAN FLUIDS
    41.
    发明专利
    METHOD AND APPARATUS FOR CLEANING A SUBSTRATE USING NON-NEWTONIAN FLUIDS 未知

    公开(公告)号：SG149849A1

    公开(公告)日：2009-02-27

    申请号：SG2009003047

    申请日：2006-06-14

    Applicant: LAM RES CORP

    Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  FARBER JEFFREY ,  KOROLIK MIKHAIL ,  REDEKER FRED C

    Abstract: METHOD AND APPARATUS FOR CLEANING A SUBSTRATE USING NON-NEWTONIAN FLUIDS A method for cleaning a substrate is provided. In this method, a flow of non- Newtonian fluid is provided where at least a portion of the flow exhibits plug flow. To remove particles from a surface of the substrate, the surface of the substrate is placed in contact with the portion of the flow that exhibits plug flow such that the portion of the flow exhibiting plug flow moves over the surface of the substrate. Additional methods and apparatuses for cleaning a substrate also are described.

    METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING THE SAME
    42.
    发明专利
    METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING THE SAME 未知

    公开(公告)号：MY150143A

    公开(公告)日：2013-11-29

    申请号：MYPI20063116

    申请日：2006-06-29

    Applicant: LAM RES CORP

    Inventor： KOROLIK MIKHAIL ,  RAVKIN MICHAEL ,  DELARIOS JOHN ,  REDEKER FRITZ C ,  BOYD JOHN M

    IPC: H01L21/00

    Abstract: A PRESSURE IS MAINTAINED WITHIN A VOLUME WITHIN WHICH A SEMICONDUCTOR WAFER (101) RESIDES AT A PRESSURE THAT IS SUFFICIENT TO MAINTAIN A LIQUID STATE OF A PRECURSOR FLUID (301) TO A NON- NEWTONIAN FLUID (303). THE PRECURSOR FLUID IS DISPOSED PROXIMATE TO A MATERIAL (103B, 104) TO BE REMOVED FROM THE SEMICONDUCTOR WAFER (101) WHILE MAINTAINING THE PRECURSOR FLUID (301) IN THE LIQUID STATE. THE PRESSURE IS REDUCED IN THE VOLUME WITHIN WHICH THE SEMICONDUCTOR WAFER (101) RESIDES SUCH THAT THE PRECURSOR FLUID (301) DISPOSED ON THE WAFER WITHIN THE VOLUME IS TRANSFORMED INTO THE NON-NEWTONIAN FLUID (303). AN EXPANSION OF THE PRECURSOR FLUID (301) AND MOVEMENT OF THE PRECURSOR FLUID RELATIVE TO THE WAFER (101) DURING TRANSFORMATION INTO THE NON-NEWTONIAN FLUID (303) CAUSES THE RESULTING NON-NEWTONIAN FLUID TO REMOVE THE MATERIAL (103B, 104) FROM THE SEMICONDUCTOR WAFER (101).

    PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING
    43.
    发明专利
    PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING 未知

    公开(公告)号：SG181638A1

    公开(公告)日：2012-07-30

    申请号：SG2012042909

    申请日：2010-12-10

    Applicant: LAM RES CORP

    Inventor： WANG YAXIN ,  LI SHIJIAN ,  REDEKER FRITZ ,  PARKS JOHN ,  KOLICS ARTUR ,  YOON HYUNGSUK ALEXANDER ,  DE FILIPE TAREK SUWWAN ,  KOROLIK MIKHAIL

    Abstract: Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate.

    METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING THE SAME
    46.
    发明专利
    METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING THE SAME 未知

    公开(公告)号：SG166109A1

    公开(公告)日：2010-11-29

    申请号：SG2010071355

    申请日：2006-06-15

    Applicant: LAM RES CORP

    Inventor： KOROLIK MIKHAIL ,  RAVKIN MICHAEL ,  DELARIOS JOHN ,  REDEKER FRITZ C ,  BOYD JOHN M

    Abstract: A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non- Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non- Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer. Fig. 3B

    APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE
    48.
    发明专利
    APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE 未知

    公开(公告)号：SG133543A1

    公开(公告)日：2007-07-30

    申请号：SG2006087423

    申请日：2006-12-15

    Applicant: LAM RES CORP

    Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

    Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

    METHOD FOR REMOVING CONTAMINATION FROM A SUBSTRATE AND FOR MAKING A CLEANING SOLUTION
    50.
    发明专利
    METHOD FOR REMOVING CONTAMINATION FROM A SUBSTRATE AND FOR MAKING A CLEANING SOLUTION 未知

    公开(公告)号：SG133491A1

    公开(公告)日：2007-07-30

    申请号：SG2006080493

    申请日：2006-11-20

    Applicant: LAM RES CORP

    Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

    Abstract: A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.

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