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公开(公告)号：KR1020150116639A
公开(公告)日：2015-10-16
申请号：KR1020140041761
申请日：2014-04-08
Applicant: 성균관대학교산학협력단
Abstract: 복합체분말의제조방법이개시된다. 복합체분말을제조하기위하여, 금속와이어를탄소계물질로피복하고, 이를용액중에서전기폭발시킬수 있다. 이에의해제조된복합체분말은금속분말및 금속분말표면을코팅하고전기전도성을갖는다층그래핀이코팅된필름으로이루어질수 있다.
Abstract translation: 公开了一种复合粉末的制造方法。 复合粉末通过用碳基材料覆盖金属丝并在其后的溶液中进行脉冲丝蒸发来制造。 因此，复合粉末可以包括：金属粉末; 以及涂覆有具有导电性并涂覆金属粉末的表面的多层石墨烯的膜。
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公开(公告)号：KR101465343B1
公开(公告)日：2014-12-04
申请号：KR1020130071436
申请日：2013-06-21
Applicant: 성균관대학교산학협력단
Abstract: 본 발명은 프로브 카드용 니들을 제조하는 방법에 관한 것으로서, 프로브 카드용 니들을 제조하는 방법의 용이성을 확보하고 단순화된 공정을 제공하기 위함이다.
본 발명의 일 실시예에 따른 프로브 카드용 니들을 제조하는 방법은, 표면 처리된 금속 기판을 준비하는 단계; 상기 기판 상에 포토레지스트를 패터닝하는 단계; 전해 도금(electroplating)을 이용하여 상기 포토레지스트가 패터닝되지 아니한 부분에 금속 도금층을 형성하는 단계; 상기 금속 도금층을 형성한 이후 포토레지스트를 제거하는 단계; 상기 포토레지스트를 제거한 이후 상기 기판 및 상기 금속 도금층 위에 감광성 필름을 코팅하는 단계; 상기 감광성 필름 위에 테이프를 입히는 단계; 및 상기 기판을 떼어내는 단계를 포함한다.Abstract translation: 本发明涉及一种用于制造探针卡针的方法。 本发明的目的是促进用于制造用于探针卡的针的方法并提供简化的过程。 根据本发明的实施例的用于制造探针卡针的方法包括以下步骤：制备其表面被加工的金属基底; 在衬底上图案化光致抗蚀剂; 在光致抗蚀剂未使用电镀图案化的区域上形成金属镀层; 在形成金属镀层之后去除光致抗蚀剂; 在光致抗蚀剂之后，在基板和金属镀层上涂布感光膜; 将胶带涂在感光膜上; 并分离底物。
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公开(公告)号：KR1020140087321A
公开(公告)日：2014-07-09
申请号：KR1020120157171
申请日：2012-12-28
Applicant: 삼성전기주식회사 , 성균관대학교산학협력단
CPC classification number: H01L33/644 , H01L33/502 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2933/0075
Abstract: The present invention relates to an LED package and a manufacturing method thereof. According to one embodiment of the present invention, suggested is the LED package which includes a heat sink which includes a cavity groove on an upper side thereof and a plurality of heat radiation pins on a lower side thereof; an LED module body which is detachably inserted into the cavity groove and includes a receiving groove on an upper side thereof; an LED chip which is fixedly received in the receiving groove; and a transmitting material which fills the receiving groove, covers the LED chip, and transmits light from the LED chip. Also, suggested is the method for manufacturing the LED package.
Abstract translation: 本发明涉及LED封装及其制造方法。 根据本发明的一个实施例，提出的是LED封装，其包括散热器，该散热器在其上侧包括空腔凹槽，在其下侧包括多个散热销; LED模块体，其可拆卸地插入到所述空腔凹槽中，并且在其上侧包括接收槽; 固定地容纳在接收槽中的LED芯片; 以及填充接收槽的透射材料，覆盖LED芯片并透射来自LED芯片的光。 另外，建议制造LED封装的方法。
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公开(公告)号：KR101232456B1
公开(公告)日：2013-02-12
申请号：KR1020110081845
申请日：2011-08-17
Applicant: 성균관대학교산학협력단
IPC: H01L21/683 , H01L21/60 , H01L23/48
Abstract: PURPOSE: A jig for filling a via hole, a via hole filling device, and a via hole filling method are provided to improve a process speed by mounting a first substrate and a second substrate on the upper and lower sides of a receiving space. CONSTITUTION: A body(110) includes a first receiving groove and a second receiving groove. A peripheral side of a first substrate(10) is received in the inner sidewall of the first receiving groove. The first substrate includes a via hole. A peripheral side of a second substrate(20) and the first receiving groove are received in the inner sidewall of a second receiving groove. A paste supply unit(120) supplies metal paste to the receiving space.
Abstract translation: 目的：提供用于填充通孔的夹具，通孔填充装置和通孔填充方法，以通过将第一基板和第二基板安装在接纳空间的上侧和下侧来提高加工速度。 构成：主体（110）包括第一接收槽和第二接收槽。 第一基板（10）的周边被容纳在第一接收槽的内侧壁中。 第一基板包括通孔。 第二基板（20）的外周侧和第一接收槽被容纳在第二接收槽的内侧壁中。 糊剂供给单元（120）将金属糊料供给到容纳空间。
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公开(公告)号：KR101220118B1
公开(公告)日：2013-01-11
申请号：KR1020110028644
申请日：2011-03-30
Applicant: 성균관대학교산학협력단
Abstract: 본 발명은 절연층의 전열성능과 열전달능력을 향상시키고, 박리강도를 향상시킨 방열 인쇄회로기판에 관한 것으로, 메탈층; 상기 메탈층의 일면에 접하는 절연층; 및 상기 절연층의 타면에 접하는 기판을 포함하여 구성되며, 상기 절연층에 접하는 상기 메탈층의 일면에는 다수의 요철이 형성되고, 상기 절연층의 일면이 상기 요철에 삽입 형성된 것을 특징으로 한다.
본 발명은, 절연층과 메탈층의 접촉면적을 넓힘으로써, 절연특성이 향상될 뿐만 아니라, 열전달 면적이 증가에 의하여 방열특성도 향상되는 효과가 있다.
또한, 절연층과 메탈층의 사이에 산화물층을 형성함으로써, 절연특성이 향상되는 효과가 있다.-
Patent Agency Ranking
公开(公告)号：KR1020120110645A
公开(公告)日：2012-10-10
申请号：KR1020110028644
申请日：2011-03-30
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A heat dissipating printed circuit board and a manufacturing method thereof are provided to improve an insulation property by forming an oxide layer between an insulating layer and a metal layer. CONSTITUTION: An aluminum foil to be used as a metal(110) is prepared. Concave grooves(112) with a predetermined depth are formed on a metal layer of an aluminum material which is prepared form surface unevenness. A surface area of the metal layer is broadened by forming a square concave groove. A wet etch process using a mask is used to form the concave groove having the predetermined depth. An etching mask material resist to an etchant is coated an aluminum surface. An oxide layer(114) is formed by oxidizing a surface of the metal layer having the concave groove. The oxide layer is formed between the metal layer and an insulating layer(120).
Abstract translation: 目的：提供散热印刷电路板及其制造方法，以通过在绝缘层和金属层之间形成氧化物层来提高绝缘性能。 构成：准备用作金属（110）的铝箔。 在由表面不均匀制成的铝材的金属层上形成具有预定深度的凹槽（112）。 通过形成方形凹槽来使金属层的表面积变宽。 使用使用掩模的湿蚀刻工艺来形成具有预定深度的凹槽。 对蚀刻剂抗蚀刻的蚀刻掩模材料涂覆有铝表面。 通过氧化具有凹槽的金属层的表面形成氧化物层（114）。 在金属层和绝缘层（120）之间形成氧化物层。
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公开(公告)号：KR101181224B1
公开(公告)日：2012-09-10
申请号：KR1020110028187
申请日：2011-03-29
Applicant: 성균관대학교산학협력단
CPC classification number: H01L33/486 , H01L33/642 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: PURPOSE: An LED package and a manufacturing method thereof are provided to reduce a problem due to the generation of heat of an LED by minimizing the use of a wire and an adhesive while enhancing heat radiation efficiency. CONSTITUTION: A metallic board(10) in which an insulating plate(20) is combined is formed. A penetration hole(22) is formed on the insulating plate. An electrode(50) is formed by filling the penetration hole with metal. A cavity(12) is formed by eliminating a part of the metallic board. An LED chip(30) is formed within the cavity. The electrode is connected to the LED chip. The cavity is filled with sealing material by plating. Fluorescent material is dispersed to the sealing material.
Abstract translation: 目的：提供LED封装及其制造方法，以通过最小化使用导线和粘合剂同时提高散热效率来减少由于LED的发热而产生的问题。 构成：形成有绝缘板（20）组合的金属板（10）。 在绝缘板上形成贯通孔（22）。 电极（50）通过用金属填充贯通孔而形成。 通过去除金属板的一部分来形成空腔（12）。 在空腔内形成LED芯片（30）。 电极连接到LED芯片。 通过电镀填充密封材料。 将荧光材料分散到密封材料中。
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公开(公告)号：KR101145741B1
公开(公告)日：2012-05-16
申请号：KR1020100071811
申请日：2010-07-26
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a method for fabricating the same are provided to prevent an electrical short circuit which is generated from a metal pattern by coating the metal pattern of a probe unit with a protective layer comprised of an insulating material. CONSTITUTION: At least one metal pattern(120) is formed in one side of a substrate(110). A metal coating layer(130) is formed in the substrate so that the metal coating layer is connected to the metal pattern on the inner wall of a connecting through hole. A protective film(140) comprised of the insulating film is formed in the upper part of the metal pattern. A probe part(150) comprises a probe(151), a main body member(152), and an align part(153). A PCB(Printed Circuit Board) part(160) is attached to the upper side of the metal pattern.
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公开(公告)号：KR1020110135574A
公开(公告)日：2011-12-19
申请号：KR1020100055384
申请日：2010-06-11
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a manufacturing method thereof are provided to prevent signal loss due to the twisting phenomenon of a printed circuit board part by bonding the printed circuit board part on the upper side of a metal pattern which is formed on a insulating board. CONSTITUTION: A connection bump(112) is perpendicularly projected in one side of a first substrate. One or more metal patterns and a connection through hole which is contiguous to the metal pattern are formed in one side of a second substrate according to each metal pattern. The connection bump is inserted into one side of the connection through hole. A probe part(130) is inserted to the other side of the connection through hole and the first substrate and the probe part are welded in the second substrate. A PCB(Printed Circuit Board) part is attached to the metal pattern which is formed in the second substrate.
Abstract translation: 目的：提供探针单元及其制造方法，以通过将形成在绝缘板上的金属图案的上侧的印刷电路板部分接合来防止印刷电路板部分的扭曲现象引起的信号损失。 构成：连接凸块（112）垂直地投影在第一基板的一侧。 根据每种金属图案，在第二基板的一侧形成一个或多个金属图案和与金属图案相邻的连接通孔。 连接凸块插入连接通孔的一侧。 探针部分（130）被插入到连接通孔的另一侧，并且第一基底和探针部分被焊接在第二基底中。 PCB（印刷电路板）部分附接到形成在第二基板中的金属图案。
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