公开(公告)号：WO2016120449A1

公开(公告)日：2016-08-04

申请号：PCT/EP2016/051921

申请日：2016-01-29

Applicant: VALEO COMFORT AND DRIVING ASSISTANCE

Inventor： REVOL-BUISSON, Pierre ,  HUE, David

IPC: H05K1/18 ,  H05K3/12 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/184 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/10098 ,  H05K2201/10901 ,  Y02P70/611

Abstract: La présente invention concerne un procédé de montage (MTH) d'au moins un composant électronique sur une carte à circuit imprimé (PCB), ladite carte à circuit imprimé (PCB) comportant une première face (F1 ) et une deuxième face (F2), selon lequel ledit procédé comporte : - le collage d'au moins un composant électronique traversant (PTH) sur la première face (F1) de la carte à circuit imprimé (PCB), ledit au moins un composant électronique traversant (PTH) comportant au moins une broche, la carte à circuit imprimé (PCB) comprenant une ouverture (O) dans laquelle est introduite ladite au moins une broche, ladite ouverture (O) traversant de part en part ladite carte à circuit imprimé (PCB); - une sérigraphie de la carte à circuit imprimé (PCB) sur la deuxième face (F2) opposée à la première face (F1) sur laquelle est collé ledit au moins un composant électronique traversant (PTH) de sorte à introduire une pâte à braser (B) dans ladite ouverture (O) côté deuxième face (F2).

Abstract translation: 本发明涉及一种在印刷电路板（PCB）上安装（MTH）至少一个电子部件的方法，所述印刷电路板（PCB）包括第一面（F1）和第二面（F2），其中所述 所述方法包括：将所述至少一个通过安装的电子部件（PTH）粘合到所述印刷电路板（PCB）的所述第一面（F1）上，所述至少一个通过安装的电子部件（PTH）包括至少一个引脚 ，所述印刷电路板（PCB）包括其中引入所述至少一个引脚的开口，所述开口（O）穿过所述印刷电路板（PCB）; - 所述第二面（F2）上的印刷电路板（PCB）的丝网印刷，所述印刷电路板（F2）与所述至少一个直通电子部件（PTH）粘合在其上的第一面（F1）相对，以便引入 焊膏（B）位于第二面（F2）上的开口（O）内。

公开(公告)号：WO2015168370A1

公开(公告)日：2015-11-05

申请号：PCT/US2015/028453

申请日：2015-04-30

Applicant: R&D CIRCUITS, INC

Inventor： TURPUSEEMA, Dhanonjaya ,  WARWICK, Thomas, P. ,  SMITH, Thomas ,  RUSSELL, James, V.

IPC: H05K3/30 ,  H05K3/46 ,  H05K3/40 ,  G06K19/077 ,  H05K1/18

CPC classification number: H05K1/188 ,  H05K1/144 ,  H05K1/183 ,  H05K1/186 ,  H05K3/0026 ,  H05K3/0094 ,  H05K3/321 ,  H05K3/366 ,  H05K3/4655 ,  H05K3/4679 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2201/042 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2201/09572 ,  H05K2203/0485 ,  H05K2203/063 ,  H05K2203/11 ,  Y10T29/49128 ,  Y10T29/4914

Abstract: A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.

Abstract translation: 印刷电路板内部的方法和电互连结构，用于在嵌入式组件端子，信号迹线和/或电源/接地平面之间建立可靠的，高性能的连接方法，其可能占据与嵌入式组件相同的垂直空间，例如 作为电容器或电阻器。 通过所述嵌入式组件结构的制造过程进一步减轻组装和可靠性。 在一种结构化的钻孔中，电镀通孔使用永久且高度导电的附着材料将印刷电路板中的迹线或平面连接到嵌入式部件的电气端子。 在另一种结构中，轨迹或平面通过选择性侧壁电镀连接，其围绕部件的电端子。该结构还使用永久且高度导电的附着材料将部件端子电连接到电镀侧壁 最终实施例中，端子通过导电附着材料通过z轴中的通孔连接到导电垫。

公开(公告)号：WO2014025298A1

公开(公告)日：2014-02-13

申请号：PCT/SE2012/050868

申请日：2012-08-10

Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (publ) ,  PEREZ-URIA, Igor ,  FERM, Per ,  GUSTAFSON, Benny

Inventor： PEREZ-URIA, Igor ,  FERM, Per ,  GUSTAFSON, Benny

IPC: H05K3/40

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

Abstract: The present invention relates to a printed circuit board arrangement (400) and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board (410) having a first side (411), a second side (412) and an electrical connection (413) electrically connecting a first conductive layer and a second conductive layer (417) of the printed circuit board. The electrical connection (413) comprises a passage (416) extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material (414) is formed on the walls (415) of the passage. The electrically conducting material forms a first path electrically connecting the first conductive layer (417) with the second conductive layer (417). At least one first ball 420 is enclosed by the passage. The at least one firstball is electrically conducting and has a diameter which is equal to or smaller than the length and diameter of the passage, wherein the at least one first ball (420) form part of a second electrical path between the first and second conductive layers of the printed circuit board, said second electrical path having a lower resistance than the first path.

Abstract translation: 本发明涉及印刷电路板装置（400）和在印刷电路板上形成电连接的方法。 印刷电路板布置包括印刷电路板（410），其具有电连接第一导电层和第二导电层（417）的第一侧（411），第二侧（412）和电连接（413） 印刷电路板。 电连接（413）包括从印刷电路板的一侧的开口延伸穿过第一和第二层之间的印刷电路板的通道（416）。 导电材料（414）形成在通道的壁（415）上。 导电材料形成将第一导电层（417）与第二导电层（417）电连接的第一路径。 至少一个第一球420被通道包围。 所述至少一个第一球是导电的并且具有等于或小于所述通道的长度和直径的直径，其中所述至少一个第一球（420）形成所述第一和第二导电之间的第二电路径的一部分 印刷电路板的层，所述第二电路具有比第一路径更低的电阻。

公开(公告)号：WO2010045214A3

公开(公告)日：2010-07-08

申请号：PCT/US2009060480

申请日：2009-10-13

Applicant: HEWLETT PACKARD DEVELOPMENT CO ,  LEON ALEXANDER

Inventor： LEON ALEXANDER

IPC: G01R1/067 ,  G01R31/304

CPC classification number: G01R1/06738 ,  G01R31/2808 ,  H05K1/0268 ,  H05K1/116 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/0545

Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.

Abstract translation: 当探头的边缘接触测试点的焊锡墩时，使用设置在固定方向的边缘探头来探测电路板的测试点。 焊锡墩具有细长的形状。 当边缘接触焊料堆并且保持在固定取向时，边缘的长度基本上垂直于焊料堆的长度。

公开(公告)号：WO2004052547A3

公开(公告)日：2004-12-02

申请号：PCT/US0338614

申请日：2003-12-05

Applicant: SURFECT TECHNOLOGIES INC ,  GRIEGO THOMAS P

Inventor： GRIEGO THOMAS P

IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/288 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H05K3/34 ,  C25B11/04

CPC classification number: H01L21/76898 ,  B22F2998/00 ,  B22F2999/00 ,  B23K35/0244 ,  C25D7/123 ,  C25D15/00 ,  C25D15/02 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/2885 ,  H01L21/76877 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/09572 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/104 ,  Y10T428/12063 ,  B22F1/025 ,  B22F1/0088 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For. solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

Abstract translation: 使用涂覆和/或磁性颗粒沉积包括焊点，凸块，通孔，结合环等结构的方法。 颗粒可以用可焊接材料涂覆。 对于。 焊料回流焊接材料之后，焊料可以包括未熔化的颗粒在基质中，从而增加接头的强度并降低连接阵列的间距。 颗粒和涂层可形成较高熔点的合金，允许多次随后的回流步骤。 颗粒和/或涂层可以是磁性的。 可以在沉积期间施加外部磁场以精确地控制颗粒装载和沉积位置。 因此，具有不相容的电位的元件可以在一个步骤中电沉积。 使用这样的领域允许填充诸如通孔的高纵横比结构，而不需要结构的完全种子金属化。 而且，由涂覆有催化材料的磁性颗粒组成的催化剂，任选地包括中间层。

公开(公告)号：WO00052974A1

公开(公告)日：2000-09-08

申请号：PCT/EP2000/001770

申请日：2000-03-01

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/0094 ,  H05K3/1216 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/066 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/025 ,  Y02P70/613 ,  Y10T29/49133 ,  Y10T29/49144

Abstract: The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element (5), said element having thermal through-platings (7) which are at least partially sealed by a screen printing process. To this end, the screen printing process is carried out after the application of a first metallisation layer (6) to the support element (5) which forms the base metallisation layer, whereby the residue of the screen printing material (8) remaining on the underside (13) of the support element (5) is stripped once the screen printing material (8) has been cured, using at least a mechanical cleaning process and/or a chemical cleaning process.

Abstract translation: 对于电路装置，其被施加到载体主体（5），其至少部分地由丝网印刷工艺堵塞，热通孔（7），将被简化和改进的制造方法。 为了这个目的，在丝网印刷过程中的第一应用后，基座金属布线的形成金属化（6）进行到所述支撑体（5），其特征在于，在支承体（5）突出的丝网印刷材料的遗体的下侧（13）（8）的丝网印刷材料的硬化后 （8）由至少一个机械清洁工艺和/或化学清洁工艺除去。

公开(公告)号：WO9962105A3

公开(公告)日：2000-06-29

申请号：PCT/US9911824

申请日：1999-05-27

Applicant: ROMPOWER INC

Inventor： JITARU IONEL

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

Abstract translation: 电源转换器的封装，其中多层电路板可以容纳这些组件。 磁性元件的缠绕结合在多层电路板中。 顶层和底层的一些部分也支持电子元件。 一些组件被放置在顶层上，这可能不被用于磁绕组，从而减小了磁芯（26a）的占地面积。 功率耗散装置放置在通过连接顶层到底层涂覆多个铜的垫上。 通过这些热量从功率器件传递到PCB的另一侧。 在本发明的一些实施例中，热量可以进一步传递到经由导热绝缘体连接到多层电路板的金属板。 基板具有切口或空腔以容纳磁芯。 导热材料放置在磁芯（26a）和空腔底部上的金属板之间。

公开(公告)号：WO99062105A2

公开(公告)日：1999-12-02

申请号：PCT/US1999/011824

申请日：1999-05-27

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20 ,  H01L

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

Abstract translation: 一种用于电力转换器的封装，其中多层电路板保持部件。 磁性元件的绕组结合在多层电路板中。 底层的顶部和一些部分也支持电子部件。 一些部件被放置在顶层上，这可能不能用于磁性绕组，减少了磁芯（26a）的占地面积。 功率耗散器件放置在焊盘上，通过连接顶层到底层，镀有多种铜。 通过这些通过热量从功率器件传递到PCB的另一侧。 在本发明的一些实施例中，可以通过导热绝缘体将热量进一步转移到连接到多层电路板的金属板上。 基板具有用于容纳磁芯的切口或空腔。 将导热材料放置在磁芯（26a）和空腔底部的金属板之间。

公开(公告)号：WO1995011580A1

公开(公告)日：1995-04-27

申请号：PCT/DE1994001216

申请日：1994-10-14

Applicant: ROBERT BOSCH GMBH ,  MAYER-STEUERNAGEL, Wolfgang ,  FASSEL, Reinhard ,  KLINGER, Herbert ,  SCHMIDT, Hans-Joerg

Inventor： ROBERT BOSCH GMBH

IPC: H05K01/02

CPC classification number: H05K1/0209 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/09572 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10689

Abstract: The aim of the invention is to conduct away the heat produced by the operation of a power component (10) soldered on to a circuit board (13) via a soldering surface (12). To remove the heat, through-contacts (18) are provided which are situated outside the soldering surface (12) and are electrically insulated by a length of insulation (19). These through-contacts (18) ensure good thermal contact through the floor (23) of the circuit board (13) to the heat sink (35). The length of insulation (19) ensures that the contact surface of the power component (10), which is raised to an electrical potential, is separated electrically from the contact surface of the heat sink (35), which is normally earthed. The intermediate layers (21, 22) which will also be present in a multilayer circuit board (13) of conventional design and the use of through-contacts (18) filled with tin further enhance the conduction of heat from the power component (10) to the heat sink (35).

Abstract translation: 一种动力装置（10），操作热的导出，被布置成通过一个焊接表面（12）上的电路板（13）的装置。 散热电通过绝缘间隙（19）和焊接表面的面积外部隔离（12）的通孔（18）。 这些电镀通孔（18）允许在所述印刷电路板（13）到所述散热器（35）的底部层（23）良好的热接触的。 隔离路径（19）提供功率器件（10）和所述散热器（35）的最领先的金属轴承表面的接地电位的电位著名轴承表面之间的电隔离。 另外，在传统类型的已知的中间层（21，22）的多层电路板（13）（多层）和可能除了与锡填充的通孔（18）促进从电源部件（10）到所述散热器（35）的热传递。

公开(公告)号：KR1020130040140A

公开(公告)日：2013-04-23

申请号：KR1020120113019

申请日：2012-10-11

Applicant: 타이코 일렉트로닉스 저팬 지.케이.

Inventor： 테라지마,케이타

IPC: H01R12/51 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01R43/0256 ,  H01R4/027 ,  H01R12/58 ,  H01R13/533 ,  H05K3/4046 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2201/10242

Abstract: PURPOSE: A connector is provided to improve hermeticity by combining a bar-shaped member with a through-hole by soldering. CONSTITUTION: An insulating substrate(11) includes a surface(11a), a rear surface(11b), and a through-hole(11h). A conductive pattern(15) covers an inner wall of the through-hole. A bar-shaped member(16) is stretched to a direction crossing the surface in the through-hole. A first terminal(16a) of the bar-shaped member is protruded from the surface. The first terminal and a second terminal(16b) of the bar-shaped member are in the through-hole. Solder(17) covers the second terminal while sealing a gap of the bar-shaped member and the inner wall of the through-hole.

Abstract translation: 目的：通过焊接将棒状构件与通孔组合来提供连接器以提高气密性。 构成：绝缘基板（11）包括表面（11a），后表面（11b）和通孔（11h）。 导电图案（15）覆盖通孔的内壁。 棒状构件（16）被拉伸到与通孔中的表面交叉的方向。 棒状构件的第一端子（16a）从表面突出。 杆状构件的第一端子和第二端子（16b）位于通孔中。 焊接（17）覆盖第二端子，同时密封棒状构件和通孔的内壁的间隙。