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    防止主机板短路的焊盘
    82.
    发明公开
    防止主机板短路的焊盘 失效

    公开(公告)号：CN1713801A

    公开(公告)日：2005-12-28

    申请号：CN200410027844.1

    申请日：2004-06-21

    Applicant: 鸿富锦精密工业(深圳)有限公司 ,  鸿海精密工业股份有限公司

    Inventor： 王萍 ,  李艳芳

    IPC: H05K3/34 ,  H05K1/00

    CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/10651 ,  H05K2203/1446

    Abstract: 一种防止主机板短路的焊盘，用以防止通过机器设备在印刷电路板上插接元器件时，元器件引脚弯折搭接到周围线路引起的短路。布线时，在印刷电路板原有圆形焊盘区域外围，增加一与该原有焊盘区域相切的圆盘区域，根据使用不同设备产生元器件弯脚的特点，制定圆盘的布线位置及圆盘区域直径。该圆盘区域与焊盘区域覆盖材料相同，都是非走线区域。此时，通过机器设备向印刷电路板上插接元器件时，弯折的元器件引脚超出原焊盘的部分即可以落入这些增加的圆盘所圈定的区域中，从而防止其搭接到印刷电路板上的线路上，避免短路现象发生。

    초소형 LED 전극어셈블리 및 이의 제조방법
    85.
    发明申请
    초소형 LED 전극어셈블리 및 이의 제조방법 审中-公开
    超小型LED电极组件及其制造方法

    公开(公告)号：WO2015005655A1

    公开(公告)日：2015-01-15

    申请号：PCT/KR2014/006123

    申请日：2014-07-08

    Applicant: 피에스아이 주식회사

    Inventor： 도영락

    IPC: H01L33/62

    CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

    Abstract: 본 발명은 초소형 LED 전극어셈블리 및 이의 제조방법에 관한 것으로, 보다 상세하게는 첫째로, 독립하여 제조된 초소형 LED 소자를 불량 없이 서로 다른 두 전극에 정렬하여 연결시킴으로써 나노단위의 초소형 LED 소자를 서로 다른 전극에 직립으로 결합시키는 난점을 극복할 수 있다. 또한 LED 소자와 연결되는 전극을 동일평면상에 위치시킴으로써 결과적으로 LED 소자의 광추출 효율을 향상시킬 수 있다. 나아가 서로 다른 전극과 연결되는 초소형 LED 소자의 개수를 조절할 수 있다. 둘째로, 초소형 LED 소자가 직립하여 상, 하부 전극과 3차원 결합하지 않고 누운 상태로 동일평면상에 존재하는 서로 다른 전극에 결합함으로써 매우 우수한 광추출 효율을 가지며, LED 소자의 표면에 별도의 층을 형성하여 LED 소자와 전극 간에 단락을 방지함으로써 LED 전극어셈블리의 불량률을 최소화할 수 있으며 만일하나 발생할 수 있는 LED 소자의 불량을 대비하여 복수개의 LED 소자를 전극과 연결시킴으로써 초소형 LED 전극어셈블리 본래의 기능을 유지할 수 있다.

    Abstract translation: 本发明涉及一种超小型ELD电极组件及其制造方法，更具体地说，首先，克服了将立体位置的纳米单位超小型LED耦合到不同电极的难度 通过将独立制造的超小型LED对准并连接到两个不同的电极而不涉及缺陷。 此外，最终可以通过将要连接到LED的电极定位在相同的平坦表面上来提高LED的光提取效率。 此外，可以控制连接到不同电极的超小型LED的数量。 其次，通过将水平位置的超小型LED与同一平面上的不同电极连接，本发明具有非常优异的光提取效率，而不是将处于立体位置的超小型LED三维连接到上下 电极; 通过在LED的表面上形成附加层来防止LED和电极之间的短路，可以使LED电极组件的缺陷率最小化。 并且在偶尔有缺陷的LED的情况下，可以通过将多个LED与电极连接来维持超小型LED电极组件的原始功能。

    APPARATUS AND METHOD FOR TEMPERATURE COMPENSATING AN OVENIZED OSCILLATOR
    86.
    发明申请
    APPARATUS AND METHOD FOR TEMPERATURE COMPENSATING AN OVENIZED OSCILLATOR 审中-公开
    温度补偿烧结振荡器的装置和方法

    公开(公告)号：WO2008112265A1

    公开(公告)日：2008-09-18

    申请号：PCT/US2008/003306

    申请日：2008-03-12

    Applicant: CTS CORPORATION

    Inventor： STOLPMAN, James ,  KNECHT, Thomas ,  SHIRAR, Jerry

    IPC: H03B5/04

    CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/403 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10651

    Abstract: An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.

    Abstract translation: 振荡器组件包括被配置为产生频率信号的振荡器电路。 温度补偿电路与振荡器电路通信，并且适于根据温度变化调整频率信号。 振荡器和温度补偿电路位于烤箱内。 与加热器连通的加热器和温度传感器也都位于烤箱中。 温度传感器适用于根据温度变化直接控制加热器。 在一个实施例中，振荡器部件被安装到球栅阵列基板，该栅格阵列基板又安装在印刷电路板上。 在该实施例中，谐振器覆盖在球栅阵列基板上，并且盖覆盖并限定用于谐振器和球栅阵列基板的烤箱和外壳。 振荡器和温度补偿电路定义在球栅阵列基板上。

    DUAL LED BOARD LAYOUT FOR LIGHTING SYSTEMS
    87.
    发明申请
    DUAL LED BOARD LAYOUT FOR LIGHTING SYSTEMS 审中-公开
    用于照明系统的双LED板布局

    公开(公告)号：WO2007120777A2

    公开(公告)日：2007-10-25

    申请号：PCT/US2007009047

    申请日：2007-04-13

    Applicant: RENAISSANCE LIGHTING INC ,  ALDRICH MATTHEW H ,  RAINS JACK C JR

    Inventor： ALDRICH MATTHEW H ,  RAINS JACK C JR

    IPC: H05K7/00

    CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10651 ,  Y02P70/611

    Abstract: Disclosed examples of printed circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line or manufacturer. The other pad set is configured to mate with contacts of an LED of a second type, e.g. from a different product line or manufacturer. The layout may enable an easy system re-design, e.g. to shift from one type of LED to another. Alternatively, the layout may enable one system to use LEDs of the two different types in a single LED set or array. Exemplary systems disclosed herein include an element for mixing light produced by LEDs mounted to the landing zones, such as an optical integrating cavity.

    Abstract translation: 用于照明系统的印刷电路板的公开示例具有印刷在板上的相同的LED着陆区。 每个区域包括至少两组LED接触焊盘。 一个焊盘组被配置为与第一结构类型的LED的触点（例如， 从第一个产品线或制造商。 另一个焊盘组被配置为与第二类型的LED的触点配合，例如， 来自不同的产品线或制造商。 该布局可以实现简单的系统重新设计，例如。 从一种类型的LED转移到另一种类型的LED。 或者，布局可以使得一个系统能够在单个LED组或阵列中使用两种不同类型的LED。 本文公开的示例性系统包括用于混合由安装到着陆区域的LED产生的光的元件，例如光学积分腔。

    LED LAMP
    88.
    发明申请
    LED LAMP 审中-公开
    点灯

    公开(公告)号：WO2007081152A1

    公开(公告)日：2007-07-19

    申请号：PCT/KR2007/000171

    申请日：2007-01-10

    Applicant: SEOUL SEMICONDUCTOR CO., LTD. ,  CHO, Jae Ho ,  KIM, Jung Yun ,  CHO, Kang Hyun

    Inventor： CHO, Jae Ho ,  KIM, Jung Yun ,  CHO, Kang Hyun

    IPC: F21S2/00

    CPC classification number: F21V29/004 ,  F21S41/19 ,  F21S45/47 ,  F21V19/04 ,  F21V29/2212 ,  F21V29/767 ,  F21Y2115/10 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2203/167

    Abstract: The present invention relates to a light emitting diode (LED) lamp, and an object of the present invention is to provide an LED lamp in which an LED can be easily exchanged and external vibration can be absorbed to prevent the play thereof. To this end, an LED lamp according to the present invention comprises an LED package having a lead frame; a printed circuit board separated from the LED package and having a conductive pattern formed on a surface thereof facing the lead frame; and a pressing means for pressing the LED package toward the PCB so that the lead frame is in contact with the conductive pattern.

    Abstract translation: 发光二极管（LED）灯技术领域本发明涉及一种发光二极管（LED）灯，其目的在于提供一种能够容易地进行LED交换的LED灯，能够吸收外部振动，防止其发挥。 为此，根据本发明的LED灯包括具有引线框架的LED封装; 印刷电路板，与LED封装分离并且具有形成在其面向引线框架的表面上的导电图案; 以及用于将LED封装朝向PCB按压使得引线框架与导电图案接触的按压装置。

    A COMPONENT ADAPTED FOR BEING MOUNTED ON A SUBSTRATE AND A METHOD OF MOUNTING A SURFACE MOUNTED DEVICE
    89.
    发明申请
    A COMPONENT ADAPTED FOR BEING MOUNTED ON A SUBSTRATE AND A METHOD OF MOUNTING A SURFACE MOUNTED DEVICE 审中-公开
    一种适于安装在基板上的组件以及一种安装表面安装设备的方法

    公开(公告)号：WO2007046045A2

    公开(公告)日：2007-04-26

    申请号：PCT/IB2006/053768

    申请日：2006-10-13

    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  DONNERS, Maurice, A., H.

    Inventor： DONNERS, Maurice, A., H.

    IPC: H05K1/18 ,  H05K3/30

    CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

    Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

    Abstract translation: 一种适于安装在基板（11）上并用作表面安装装置（15）的支撑件的支撑部件（1）包括具有第一表面（3）的主体（2） ）适于安装在基板（11）上，以及第二表面（4）适于支撑表面安装装置（15）。 第二表面（4）相对于第一表面（3）倾斜。 所述支撑部件（1）还包括适于在所述基板（11）的第一基板导体（12）和所述表面安装设备（15）的第一电极（16）之间形成电接触的第一支撑部件导体 ）。 在将倾斜安装的表面安装器件（15）安装在基板（11）上的方法中，支撑部件（1）安装在基板（11）上，其上安装有表面安装器件（15） / p>

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