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公开(公告)号：CN105210157B
公开(公告)日：2017-05-31
申请号：CN201480021985.4
申请日：2014-09-12
Applicant: 积水化学工业株式会社
CPC classification number: H01R13/03 , H01B1/22 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2732 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32227 , H01L2224/83101 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/83851 , H01L2224/83855 , H01L2224/83862 , H01L2224/83877 , H01L2924/15788 , H01R4/04 , H05K3/323 , H05K3/361 , H05K2201/0218 , H05K2201/0221 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05342 , H01L2924/0549 , H01L2924/0532 , H01L2924/01056 , H01L2924/0534 , H01L2924/01022 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/01015 , H01L2924/01005 , H01L2924/0781 , H01L2924/04563 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
Abstract: 本发明提供一种导电性粒子，其对电极间进行电连接的情况下，可以降低连接电阻。本发明的导电性粒子1具备：基材粒子2、配置于基材粒子2表面上的导电部3，导电部3在外表面上具有多个突起3a，导电部3具有晶体结构，在导电部3的具有突起3a的部分和不具有突起3a的部分，晶体结构是连续的。
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公开(公告)号：CN104766850B
公开(公告)日：2018-04-17
申请号：CN201410437081.1
申请日：2014-08-29
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L23/49838 , H01L22/14 , H01L23/481 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/11614 , H01L2224/11622 , H01L2224/131 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/1712 , H01L2224/17132 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81466 , H01L2224/81815 , H01L2924/01057 , H01L2924/01072 , H01L2924/05042 , H01L2924/0533 , H01L2924/0534 , H01L2924/05342 , H01L2924/05432 , H01L2924/05442 , H01L2924/05994 , H01L2924/14 , H01L2924/1531 , H01L2924/15787 , H01L2924/2064 , H01L2924/20641 , H05K1/0268 , H05K1/113 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/096 , H05K2201/0989 , H05K2201/10674 , H05K2203/0353 , H01L2924/014 , H01L2924/00014
Abstract: 本发明提供了一种管芯和一种衬底。该管芯包括至少一个集成电路芯片，且该衬底包括至少部分延伸穿过该衬底的导电柱的第一子集和第二子集。导电柱的第一子集的每个都包括突出于衬底的表面的凸块焊盘，且导电柱的第二子集的每个都部分形成凹进衬底的表面中的迹线。通过多个导电凸块将管芯连接到衬底，多个导电凸块的每个都延伸到凸块焊盘的一个焊盘和管芯之间。
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公开(公告)号：CN105210157A
公开(公告)日：2015-12-30
申请号：CN201480021985.4
申请日：2014-09-12
Applicant: 积水化学工业株式会社
CPC classification number: H01R13/03 , H01B1/22 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2732 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32227 , H01L2224/83101 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/83851 , H01L2224/83855 , H01L2224/83862 , H01L2224/83877 , H01L2924/15788 , H01R4/04 , H05K3/323 , H05K3/361 , H05K2201/0218 , H05K2201/0221 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05342 , H01L2924/0549 , H01L2924/0532 , H01L2924/01056 , H01L2924/0534 , H01L2924/01022 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/01015 , H01L2924/01005 , H01L2924/0781 , H01L2924/04563 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
Abstract: 本发明提供一种导电性粒子，其对电极间进行电连接的情况下，可以降低连接电阻。本发明的导电性粒子1具备：基材粒子2、配置于基材粒子2表面上的导电部3，导电部3在外表面上具有多个突起3a，导电部3具有晶体结构，在导电部3的具有突起3a的部分和不具有突起3a的部分，晶体结构是连续的。
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公开(公告)号：CN104513632B
公开(公告)日：2017-05-10
申请号：CN201410521172.3
申请日：2014-09-30
Applicant: 三星SDI株式会社
IPC: C09J7/00 , C09J163/00 , C09J171/12 , C09J11/04 , C09J9/02 , H01B5/14
CPC classification number: H01L24/29 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/2712 , H01L2224/29005 , H01L2224/29083 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32145 , H01L2224/32227 , H01L2224/83203 , H01L2224/83851 , H01L2924/0665 , H01L2924/15788 , H01L2924/20104 , H01L2924/20105 , H01L2924/2064 , H01L2924/20641 , H01L2924/30101 , H05K3/323 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/0542 , H01L2924/0103 , H01L2924/0532 , H01L2924/01012 , H01L2924/05342 , H01L2924/0544 , H01L2924/01082 , H01L2924/053 , H01L2924/01083 , H01L2924/0536 , H01L2924/01042 , H01L2924/0535 , H01L2924/01023 , H01L2924/01041 , H01L2924/01073 , H01L2924/01074 , H01L2924/0543 , H01L2924/01049 , H01L2924/00014 , H01L2924/014 , H01L2924/01006
Abstract: 本发明公开了一种各向异性导电膜和一种使用所述各向异性导电膜的半导体装置。所述各向异性导电膜具有三层结构，包含第一绝缘层、导电层和第二绝缘层，所述三层以此顺序依序堆叠。所述各向异性导电膜可通过调整所述各别层的流动性使得终端之间的空间可由所述绝缘层充分填充且可抑制导电粒子向所述空间中流出来防止终端之间短路并具有提高的连接可靠性。
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公开(公告)号：CN105073901B
公开(公告)日：2018-08-28
申请号：CN201480018790.4
申请日：2014-03-25
Applicant: 纳美仕有限公司
IPC: C08L101/12 , C08K3/013 , C08K3/08 , C08K3/22 , C08K5/09 , C08K5/372 , C08K5/548 , C09J9/00 , C09J11/00 , C09J201/00
CPC classification number: C09J9/00 , C08K3/013 , C08K3/08 , C08K3/22 , C08K5/005 , C08K5/09 , C08K5/098 , C08K5/372 , C08K5/548 , C08L101/12 , C09J11/02 , C09J201/00 , H01L23/3737 , H01L23/49513 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/29298 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29386 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29464 , H01L2224/29486 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/83447 , H01L2224/83851 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/01029 , H01L2924/0105 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/05342 , H01L2924/045 , H01L2924/049 , H01L2924/207 , H01L2924/0665 , H01L2924/00
Abstract: 本发明提供一种树脂组合物，其在半导体装置的制造中发挥优异的粘接强度、抑制了高温工艺中的固化物的剥离。本发明涉及：一种树脂组合物，其含有(A)无机填料、(B)热固性树脂、(C)固化剂、(D)(D1)沸点为200℃以上的有机酸的金属盐以及/或者(D2)沸点为200℃以上的有机酸与金属粒子和/或金属氧化物粒子的组合、和(E)多硫化物；或者一种树脂组合物，其含有(A)无机填料、(B)热固性树脂、(C)固化剂、(D)(D1)沸点为200℃以上的有机酸的金属盐以及/或者(D2)沸点为200℃以上的有机酸与金属粒子和/或金属氧化物粒子的组合、和(E’)次抗氧化剂；含有这些树脂组合物的管芯连接膏或散热部件用粘接剂；使用这些管芯连接膏或散热部件用粘接剂制作的半导体装置。
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Patent Agency Ranking
公开(公告)号：CN104937675B
公开(公告)日：2016-08-24
申请号：CN201480005809.1
申请日：2014-02-28
Applicant: 积水化学工业株式会社
CPC classification number: H01B1/22 , B22F1/025 , B23K35/0244 , B23K35/262 , C22C13/00 , C23C18/1635 , C23C18/1651 , C23C18/1653 , C25D5/12 , H01B1/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29481 , H01L2224/29487 , H01L2224/32227 , H01L2224/83191 , H01L2224/834 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2924/3512 , H01L2924/3651 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2203/0425 , H01L2924/00014 , H01L2924/04941 , H01L2924/05342 , H01L2924/01015 , H01L2924/01005 , H01L2924/014 , H01L2924/01047 , H01L2924/01051 , H01L2924/01083 , H01L2924/01049 , H01L2924/01032 , H01L2924/01013 , H01L2924/0103 , H01L2924/01028 , H01L2924/01027 , H01L2924/01029
Abstract: 本发明的目的在于，提供一种导电性微粒，其是即使施加因下落等所带来的冲击，也不易发生因电极与该导电性微粒的连接界面的破坏所导致的断线，即使反复受到加热和冷却，也不易疲劳的导电性微粒；使用该导电性微粒而成的各向异性导电材料；和导电连接结构体。本发明涉及一种导电性微粒，其是在包含树脂或金属的芯粒子的表面至少依次层叠有导电金属层、阻挡层、铜层、和含有锡的焊料层的导电性微粒，其中，所述铜层和焊料层直接接触，与所述焊料层直接接触的铜层中的铜相对于所述焊料层中包含的锡的比率为0.5～5重量％。
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公开(公告)号：CN104766850A
公开(公告)日：2015-07-08
申请号：CN201410437081.1
申请日：2014-08-29
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L23/49838 , H01L22/14 , H01L23/481 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/11614 , H01L2224/11622 , H01L2224/131 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/1712 , H01L2224/17132 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81466 , H01L2224/81815 , H01L2924/01057 , H01L2924/01072 , H01L2924/05042 , H01L2924/0533 , H01L2924/0534 , H01L2924/05342 , H01L2924/05432 , H01L2924/05442 , H01L2924/05994 , H01L2924/14 , H01L2924/1531 , H01L2924/15787 , H01L2924/2064 , H01L2924/20641 , H05K1/0268 , H05K1/113 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/096 , H05K2201/0989 , H05K2201/10674 , H05K2203/0353 , H01L2924/014 , H01L2924/00014
Abstract: 本发明提供了一种管芯和一种衬底。该管芯包括至少一个集成电路芯片，且该衬底包括至少部分延伸穿过该衬底的导电柱的第一子集和第二子集。导电柱的第一子集的每个都包括突出于衬底的表面的凸块焊盘，且导电柱的第二子集的每个都部分形成凹进衬底的表面中的迹线。通过多个导电凸块将管芯连接到衬底，多个导电凸块的每个都延伸到凸块焊盘的一个焊盘和管芯之间。
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公开(公告)号：CN105073901A
公开(公告)日：2015-11-18
申请号：CN201480018790.4
申请日：2014-03-25
Applicant: 纳美仕有限公司
IPC: C08L101/12 , C08K3/00 , C08K3/08 , C08K3/22 , C08K5/09 , C08K5/372 , C08K5/548 , C09J9/00 , C09J11/00 , C09J201/00
CPC classification number: C09J9/00 , C08K3/013 , C08K3/08 , C08K3/22 , C08K5/005 , C08K5/09 , C08K5/098 , C08K5/372 , C08K5/548 , C08L101/12 , C09J11/02 , C09J201/00 , H01L23/3737 , H01L23/49513 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/29298 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29386 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29464 , H01L2224/29486 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/83447 , H01L2224/83851 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/01029 , H01L2924/0105 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/05342 , H01L2924/045 , H01L2924/049 , H01L2924/207 , H01L2924/0665 , H01L2924/00
Abstract: 本发明提供一种树脂组合物，其在半导体装置的制造中发挥优异的粘接强度、抑制了高温工艺中的固化物的剥离。本发明涉及：一种树脂组合物，其含有(A)无机填料、(B)热固性树脂、(C)固化剂、(D)(D1)沸点为200℃以上的有机酸的金属盐以及/或者(D2)沸点为200℃以上的有机酸与金属粒子和/或金属氧化物粒子的组合、和(E)多硫化物；或者一种树脂组合物，其含有(A)无机填料、(B)热固性树脂、(C)固化剂、(D)(D1)沸点为200℃以上的有机酸的金属盐以及/或者(D2)沸点为200℃以上的有机酸与金属粒子和/或金属氧化物粒子的组合、和(E’)次抗氧化剂；含有这些树脂组合物的管芯连接膏或散热部件用粘接剂；使用这些管芯连接膏或散热部件用粘接剂制作的半导体装置。
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公开(公告)号：CN104937675A
公开(公告)日：2015-09-23
申请号：CN201480005809.1
申请日：2014-02-28
Applicant: 积水化学工业株式会社
CPC classification number: H01B1/22 , B22F1/025 , B23K35/0244 , B23K35/262 , C22C13/00 , C23C18/1635 , C23C18/1651 , C23C18/1653 , C25D5/12 , H01B1/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29481 , H01L2224/29487 , H01L2224/32227 , H01L2224/83191 , H01L2224/834 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2924/3512 , H01L2924/3651 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2203/0425 , H01L2924/00014 , H01L2924/04941 , H01L2924/05342 , H01L2924/01015 , H01L2924/01005 , H01L2924/014 , H01L2924/01047 , H01L2924/01051 , H01L2924/01083 , H01L2924/01049 , H01L2924/01032 , H01L2924/01013 , H01L2924/0103 , H01L2924/01028 , H01L2924/01027 , H01L2924/01029
Abstract: 本发明的目的在于，提供一种导电性微粒，其是即使施加因下落等所带来的冲击，也不易发生因电极与该导电性微粒的连接界面的破坏所导致的断线，即使反复受到加热和冷却，也不易疲劳的导电性微粒；使用该导电性微粒而成的各向异性导电材料；和导电连接结构体。本发明涉及一种导电性微粒，其是在包含树脂或金属的芯粒子的表面至少依次层叠有导电金属层、阻挡层、铜层、和含有锡的焊料层的导电性微粒，其中，所述铜层和焊料层直接接触，与所述焊料层直接接触的铜层中的铜相对于所述焊料层中包含的锡的比率为0.5～5重量％。
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公开(公告)号：CN104513632A
公开(公告)日：2015-04-15
申请号：CN201410521172.3
申请日：2014-09-30
Applicant: 三星SDI株式会社
IPC: C09J7/00 , C09J163/00 , C09J171/12 , C09J11/04 , C09J9/02 , H01B5/14
CPC classification number: H01L24/29 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/2712 , H01L2224/29005 , H01L2224/29083 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32145 , H01L2224/32227 , H01L2224/83203 , H01L2224/83851 , H01L2924/0665 , H01L2924/15788 , H01L2924/20104 , H01L2924/20105 , H01L2924/2064 , H01L2924/20641 , H01L2924/30101 , H05K3/323 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/0542 , H01L2924/0103 , H01L2924/0532 , H01L2924/01012 , H01L2924/05342 , H01L2924/0544 , H01L2924/01082 , H01L2924/053 , H01L2924/01083 , H01L2924/0536 , H01L2924/01042 , H01L2924/0535 , H01L2924/01023 , H01L2924/01041 , H01L2924/01073 , H01L2924/01074 , H01L2924/0543 , H01L2924/01049 , H01L2924/00014 , H01L2924/014 , H01L2924/01006
Abstract: 本发明公开了一种各向异性导电膜和一种使用所述各向异性导电膜的半导体装置。所述各向异性导电膜具有三层结构，包含第一绝缘层、导电层和第二绝缘层，所述三层以此顺序依序堆叠。所述各向异性导电膜可通过调整所述各别层的流动性使得终端之间的空间可由所述绝缘层充分填充且可抑制导电粒子向所述空间中流出来防止终端之间短路并具有提高的连接可靠性。
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