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    Peripherally Mounted Components in Embedded Circuits
    4.
    发明申请
    Peripherally Mounted Components in Embedded Circuits 审中-公开
    嵌入式电路中的外围组件

    公开(公告)号：US20150366067A1

    公开(公告)日：2015-12-17

    申请号：US14717829

    申请日：2015-05-20

    Applicant: Edward Herbert

    Inventor： Edward Herbert

    IPC: H05K1/18

    CPC classification number: H05K1/185 ,  H01L23/4822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2518 ,  H05K1/0271 ,  H05K3/007 ,  H05K2201/0338 ,  H05K2201/0373 ,  H05K2201/1056 ,  H05K2201/10901 ,  H05K2201/10946

    Abstract: Semiconductor die and other components can be mounted in printed circuit boards with a binding agent at their periphery. This leaves both surfaces exposed for subsequent processing, usually over-plating with copper that is then etched to define a conductor pattern, just as in printed circuit manufacture. Methods using the surface tension of liquids for precise component placement in three dimensions (3-D) are shown. Optionally, micro-conductors can be used for the connections to the die, for reduced apparent resistance at high frequencies. The micro-channels between the micro-conductors can be a wick for liquid for evaporative cooling at the semiconductor surface as part of a heat pipe circuit.

    Abstract translation: 半导体管芯等组件可以在其周围装有粘合剂的印刷电路板。 这使得两个表面暴露以用于随后的处理，通常用铜进行镀覆，然后被蚀刻以限定导体图案，就像在印刷电路制造中一样。 示出了使用液体的表面张力在三维（3-D）中精确组分放置的方法。 可选地，微导体可用于与管芯的连接，以降低高频下的视在电阻。 微导体之间的微通道可以是作为热管回路的一部分的半导体表面处的用于蒸发冷却的液体的芯。

    Electronic device and manufacturing method of the same
    5.
    发明申请
    Electronic device and manufacturing method of the same 有权
    电子器件及其制造方法相同

    公开(公告)号：US20080146051A1

    公开(公告)日：2008-06-19

    申请号：US11979968

    申请日：2007-11-13

    Applicant: Takayoshi Honda

    Inventor： Takayoshi Honda

    IPC: H01R12/00

    CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

    Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

    Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

    TRANSISTOR PIN ALIGNMENT ASSEMBLY
    6.
    发明公开
    TRANSISTOR PIN ALIGNMENT ASSEMBLY 审中-公开

    公开(公告)号：US20240215167A1

    公开(公告)日：2024-06-27

    申请号：US18145066

    申请日：2022-12-22

    Applicant: Garrett Transportation I Inc

    Inventor： Valeriy Fedorikhin

    IPC: H05K1/18 ,  H05K3/34

    CPC classification number: H05K1/18 ,  H05K3/3447 ,  H01L25/115 ,  H05K2201/10166 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/10901

    Abstract: An electric vehicle thermal management system for compressing a low pressure refrigerant with a centrifugal compressor to generate a high pressure refrigerant, determining a battery cooling condition, routing one of the low pressure refrigerant and the high pressure refrigerant to the heat exchanger in response to the battery cooling condition, regulating a transfer of heat between the refrigerant loop and the battery cooling loop in response to a temperature of the battery coolant within the battery cooling loop and the battery cooling condition, and regulating the transfer of heat between the battery coolant loop and a cabin coolant loop in response to the HVAC setting and a cabin coolant temperature within the cabin coolant loop.

    Electronic component
    7.
    发明授权
    Electronic component 有权

    公开(公告)号：US11844178B2

    公开(公告)日：2023-12-12

    申请号：US17325080

    申请日：2021-05-19

    Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

    Inventor： John David Brazzle ,  Sok Mun Chew

    IPC: H05K1/18 ,  H01F27/29 ,  H01L23/31 ,  H01L25/16 ,  H05K3/34 ,  H01L23/495

    CPC classification number: H05K1/181 ,  H01F27/29 ,  H01L23/3121 ,  H01L25/167 ,  H05K3/3447 ,  H01L23/49575 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10901

    Abstract: An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate.

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