公开(公告)号：US20180166200A1

公开(公告)日：2018-06-14

申请号：US15835486

申请日：2017-12-08

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Chuh Hsien Lu ,  Da-Jung Chen

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F27/36 ,  H01F41/00

CPC classification number: H01F27/022 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/32 ,  H01F27/36 ,  H01F41/00 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.

公开(公告)号：US09980381B2

公开(公告)日：2018-05-22

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： Seng Huan Chuah ,  Friedrich Josef Bollmann ,  Khai Jin Choo ,  Weng Kong Hor ,  Sih Hau Tan

IPC: H05K1/11 ,  H05K1/14 ,  H04M1/02 ,  H05K5/06 ,  H05K1/02

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

公开(公告)号：US09936582B2

公开(公告)日：2018-04-03

申请号：US14432195

申请日：2014-04-30

Applicant: INTEL CORPORATION

Inventor： Junfeng Zhao ,  Saeed S. Shojaie ,  Cheng Yang

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/36 ,  H01L23/48 ,  H01L25/00 ,  H05K3/30 ,  H01L25/065 ,  H01L25/16

CPC classification number: H05K1/181 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L25/00 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/14 ,  H05K3/303 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0415 ,  Y10T29/49128 ,  Y10T29/49131

Abstract: Embodiments of integrated circuit (IC) assemblies and related techniques are disclosed herein. For example, in some embodiments, an IC assembly may include a first printed circuit board (PCB) having a first face and an opposing second face; a die electrically coupled to the first face of the first PCB; a second PCB having a first face and an opposing second face, wherein the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints; and a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB. Other embodiments may be disclosed and/or claimed.

公开(公告)号：US20180084648A1

公开(公告)日：2018-03-22

申请号：US15811901

申请日：2017-11-14

Applicant: OLYMPUS CORPORATION

Inventor： Takahide MIYAWAKI

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/186 ,  H01L23/13 ,  H01L23/5385 ,  H05K1/145 ,  H05K1/147 ,  H05K3/0014 ,  H05K3/301 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A three-dimensional wiring board includes a chip component including a first end electrode and a second end electrode, a first wiring board with a recessed portion including a first junction electrode on a bottom surface, and a second wiring board, disposed on the first wiring board, including a second junction electrode, where the chip component is vertically housed in the recessed portion, the first end electrode is joined to the first junction electrode, and the second end electrode is joined to the second junction electrode.

公开(公告)号：US20180054896A1

公开(公告)日：2018-02-22

申请号：US15677415

申请日：2017-08-15

Applicant: Guangdong Oppo Mobile Telecommunications Corp., LTD.

Inventor： Wenzhen Zhang

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H05K3/36 ,  H05K5/03

CPC classification number: H05K1/189 ,  G06F1/1684 ,  G06F2203/0338 ,  G06K9/00006 ,  G06K9/00053 ,  H04M1/026 ,  H04M2250/12 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/144 ,  H05K3/301 ,  H05K3/305 ,  H05K3/363 ,  H05K5/03 ,  H05K2201/041 ,  H05K2201/10151 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10757

Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.

公开(公告)号：US09900983B2

公开(公告)日：2018-02-20

申请号：US15045024

申请日：2016-02-16

Applicant: INTEL CORPORATION

Inventor： Kevin E. Wells ,  Richard C. Stamey

IPC: H05K1/11 ,  H05K7/02 ,  H05K1/02 ,  H05K3/36 ,  H05K3/42 ,  G06F1/16 ,  H05K3/34 ,  H05K1/14 ,  G06F1/18 ,  H01L23/498

CPC classification number: H05K1/115 ,  G06F1/16 ,  G06F1/18 ,  G06F1/183 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K2201/041 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.

公开(公告)号：US20180035542A1

公开(公告)日：2018-02-01

申请号：US15661921

申请日：2017-07-27

Applicant: Japan Display Inc.

Inventor： Shuichi OSAWA ,  Yoshikatsu IMAZEKI ,  Yoichi KAMIJO ,  Yoshihiro WATANABE

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/144 ,  G02F1/13306 ,  G02F1/133305 ,  G02F1/13338 ,  G02F1/1339 ,  G02F1/136227 ,  G02F2001/133388 ,  H05K1/115 ,  H05K3/002 ,  H05K3/0026 ,  H05K3/366 ,  H05K3/4038 ,  H05K2201/041 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/10136 ,  H05K2203/107

Abstract: According to one embodiment, an electronic device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement which is disposed to be apart from the first conductive layer and includes a first surface opposed to the first conductive layer and a second surface opposite to the first surface, and a second conductive layer disposed on the second surface, the second substrate including a first hole passing through the second basement, and a connecting material passing through the first hole to electrically connect the first conductive layer and the second conductive layer, wherein the first hole is shaped as a funnel.

公开(公告)号：US09878678B2

公开(公告)日：2018-01-30

申请号：US15137532

申请日：2016-04-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Ki Jung

IPC: H04N5/225 ,  H04N7/00 ,  H04N7/18 ,  B60R11/04 ,  H05K1/14

CPC classification number: B60R11/04 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H05K1/144 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/041

Abstract: A camera module for automobiles is disclosed. The camera module includes a lens unit, a housing, in front of which the lens unit is disposed, and a plurality of printed circuit boards disposed in the housing so as to be opposite the lens unit, wherein the housing is provided at the inner wall thereof with a plurality of steps, the steps being provided between the respective printed circuit boards so as to be spaced apart from each other for setting the distance between the respective printed circuit boards.

公开(公告)号：US20180020544A1

公开(公告)日：2018-01-18

申请号：US15642768

申请日：2017-07-06

Applicant: NGK INSULATORS, LTD.

Inventor： Hiroshi TAKEBAYASHI

IPC: H05K1/14 ,  H01L21/683 ,  H05K3/36 ,  H05K1/02 ,  H01L21/67

CPC classification number: H05K1/144 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H05K1/0209 ,  H05K1/0212 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09381

Abstract: A connection FPC 75 and a sheet heater 30 are joined together with a solder joint member interposed therebetween. The connection FPC 75 includes a ground contact point 90b and a connection electrode 90d extending along a row of contact points and to which the ground contact point 90b is connected. The connection electrode 90d extends beyond both ends of the row. The sheet heater 30 includes a ground land 46b and a connection land 46d extending along a row of lands and to which the ground land 46b is connected. The connection land 46d extends beyond both ends of the row.

公开(公告)号：US09832874B2

公开(公告)日：2017-11-28

申请号：US14745526

申请日：2015-06-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas C. Doering ,  Ralph Heller ,  Ronald P. Luijten ,  Martin L. Schmatz

IPC: H05K3/20 ,  H05K1/11 ,  H01R12/73 ,  H05K1/14 ,  H01R43/26 ,  H01R12/52 ,  H01R13/24 ,  H05K3/36

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.