公开(公告)号：US06176709B1

公开(公告)日：2001-01-23

申请号：US09472518

申请日：1999-12-27

Applicant: Yoshiiku Sonobe ,  Makoto Oya ,  Satoru Watanabe ,  Osamu Nishida

Inventor： Yoshiiku Sonobe ,  Makoto Oya ,  Satoru Watanabe ,  Osamu Nishida

IPC: H01R909

CPC classification number: H01R12/57 ,  H01L2924/0002 ,  H01R12/58 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10704 ,  H01L2924/00

Abstract: A socket for an integrated circuit which is used for attaching the integrated circuit to a socket mounted on a primary wiring board with an intermediate wiring board interposed therebetween, an adapter for an integrated circuit utilizing the integrated circuit socket, and an integrated circuit assembly utilizing the integrated circuit adapter. The integrated circuit socket includes: a housing to be directly fitted with the integrated circuit; a long insertion pin which is to be inserted through the intermediate wiring board and to be fitted in the socket of the primary wiring board; a short insertion pin which is to be inserted through the intermediate wiring board but not to reach the socket of the primary wiring board; and a surface-mount pin which is to be connected to a surface of the intermediate wiring board opposed to the housing; the long insertion pin, the short insertion pin and the surface-mount pin being implanted in the housing.

Abstract translation: 一种用于集成电路的插座，其用于将集成电路连接到安装在主布线板上的插座之间的中间布线板，用于使用集成电路插座的集成电路的适配器以及利用该集成电路的集成电路组件 集成电路适配器。 集成电路插座包括：直接安装集成电路的外壳; 插入穿过中间布线板并被安装在主布线板的插座中的长插销; 插入中间布线板但不到达初级布线板的插座的短插销; 以及要连接到与壳体相对的中间布线板的表面的表面安装销; 长插入销，短插入销和表面安装销植入壳体中。

公开(公告)号：US6153929A

公开(公告)日：2000-11-28

申请号：US138372

申请日：1998-08-21

Applicant: Walter L. Moden ,  Jerrold L. King ,  Jerry M. Brooks

Inventor： Walter L. Moden ,  Jerrold L. King ,  Jerry M. Brooks

IPC: H01L25/10 ,  H01L23/02

CPC classification number: H05K1/181 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/145 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49169

Abstract: A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage, or, alternatively, are directly fixed to leads or pads on the host circuit board.

Abstract translation: 用于高速应用的低调多IC芯片封装包括用于电连接一组堆叠的初级半导体封装的等效外引线的连接器。 在一个实施例中，连接器包括两部分柔性绝缘聚合物片，其一端形成有总线。 在另一个实施例中，连接器包括由导电聚合物形成的多个总线。 在另外的实施例中，初级封装堆叠在保持架内并且其外引线与保持架内的总线不连接，或者替代地，直接固定到主电路板上的导线或焊盘。

公开(公告)号：US06114763A

公开(公告)日：2000-09-05

申请号：US87739

申请日：1998-05-29

Applicant: John W. Smith

Inventor： John W. Smith

IPC: H01L21/56 ,  H01L23/36 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H01L23/34 ,  H01L23/04 ,  H01L23/10

CPC classification number: H01L23/49827 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49833 ,  H05K1/112 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/141 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K3/0058

Abstract: An electronic assembly which includes a semiconductor chip package having an array of package terminals and a translator. The translator has a first array of terminals exposed on a first surface of the translator and a second array of terminals exposed on a second surface of the translator. The pitch of the first array matches the pitch of the semiconductor package. The pitch of the second array matches the pitch of the printed circuit board to which the electronic assembly is to be mounted. The array of package terminals on the semiconductor chip package is aligned with and bonded to the first array of terminals on the translator to form the electronic assembly. The electronic assembly can then be mounted on a board by aligning and bonding the second array of terminals on the translator with the connection pads on the printed circuit board.

Abstract translation: 一种电子组件，其包括具有封装端子阵列和转换器的半导体芯片封装。 翻译器具有暴露在转换器的第一表面上的第一阵列端子和暴露在转换器的第二表面上的第二端子阵列。 第一阵列的间距与半导体封装的间距相匹配。 第二阵列的间距与电子组件将要安装的印刷电路板的间距相匹配。 半导体芯片封装上的封装端子阵列与转换器上的第一阵列端对准并结合到一起形成电子组件。 然后可以通过将平移器上的第二端子阵列与印刷电路板上的连接焊盘对准和结合来将电子组件安装在板上。

公开(公告)号：US6086386A

公开(公告)日：2000-07-11

申请号：US862151

申请日：1997-05-22

Applicant: Joseph Fjelstad ,  Thomas H. DiStefano ,  Konstantine Karavakis ,  Anthony B. Faraci ,  Tan Nguyen

Inventor： Joseph Fjelstad ,  Thomas H. DiStefano ,  Konstantine Karavakis ,  Anthony B. Faraci ,  Tan Nguyen

IPC: H01R11/01 ,  G01R31/28 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R12/52 ,  H01R33/76 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10 ,  H01R12/00

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1061 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49149

Abstract: A connector for microelectronic elements includes a sheetlike body having a plurality of active contacts arranged in a regular grid pattern. The active contacts may include several sheetlike metallic projections extending inwardly around a hole in the sheetlike element, on a first major surface of the sheetlike element. A support structure such as a grid array of noncollapsing structural posts is on a second major surface of the sheetlike element, and each of the posts is electrically connected to one of the active contacts. The grid array of posts and the grid array of active contacts are offset from one another so that an active contact is surrounded by several posts. The posts support the sheetlike element spaced away from a substrate to which the posts are attached. A microelectronic element having bump leads thereon may be engaged by contacting the bump leads with the active contacts, and deflecting the sheetlike element between the bump leads on one side and the posts on the other side. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子元件的连接器包括具有布置成规则网格图案的多个活动触点的片状体。 有源触点可以包括在片状元件的第一主表面上围绕片状元件中的孔向内延伸的几个片状金属突起。 支撑结构例如非隔离结构柱的格子阵列在片状元件的第二主表面上，并且每个柱电连接到一个活动触点。 柱的网格阵列和活动触点的网格阵列彼此偏移，使得活动触点被多个柱包围。 支柱支撑与柱连接的基板间隔开的片状元件。 其上具有凸起引线的微电子元件可以通过使凸起引线与活动触头接触，并使片状元件在一侧的凸起引线与另一侧上的柱之间偏转而接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US6038135A

公开(公告)日：2000-03-14

申请号：US591119

申请日：1996-01-25

Applicant: Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima

Inventor： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima

IPC: H01L23/32 ,  H01L23/538 ,  H05K1/11 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K2201/049 ,  H05K2201/10287 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K3/3405 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/368

Abstract: A wiring board to be provided between a packaged electronic component having an integrated circuit and a mother board on which the packaged electronic component should be mounted, includes a base made of an insulating material, a first circuit pattern which is provided on a first surface of the base and has terminals connectable to terminals of the packaged electronic component for external connections, and a second circuit pattern which is provided on a second surface of the base opposite to the first surface thereof and has terminals connectable to terminals provided on the mother board.

Abstract translation: 在具有集成电路的封装的电子部件和其上安装有封装的电子部件的母板之间提供的布线板包括由绝缘材料制成的基座，第一电路图案设置在第一表面上 底座并具有可连接到用于外部连接的封装电子部件的端子的端子，以及设置在与其第一表面相对的基座的第二表面上并且具有可连接到设置在母板上的端子的端子的第二电路图案。

公开(公告)号：US5972734A

公开(公告)日：1999-10-26

申请号：US932711

申请日：1997-09-17

Applicant: Karla Y. Carichner ,  Dexin Liang

Inventor： Karla Y. Carichner ,  Dexin Liang

IPC: H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K2201/049 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K3/4038 ,  Y02P70/613

Abstract: A ball grid array package (BGA) according to the present invention has an interposer between a bond pad on the lower surface of the substrate and the solder ball. The interposer has a conductive portion in contact with the bond pad surrounded by a nonconductive or insulating portion. The conductive portion in contact with the bond pad is sufficiently constrained from widening during a subsequent reflow process by the presence of the nonconductive or insulating portion. The contact with the bond pad is sufficiently small to allow traces to pass near the bond pad substantially directly en route to another bond pad. The nonconductive portion also prevents subsequently-applied encapsulant from coming in contact with and contaminating the bond pad. The elevated surface of the interposer, i.e. the surface of the interposer furthest from the bond pad, supports the solder ball, and is sufficiently wide to support the solder ball without allowing the solder ball to come in contact with the traces. The solder ball and the trace routing on the lower surface of the substrate is in different planes, thereby allowing a simplified trace routing, but retaining and even increasing rigidity of the structure and coplanarity of the solder balls.

Abstract translation: 根据本发明的球栅阵列封装（BGA）在衬底的下表面上的接合焊盘和焊球之间具有插入件。 插入器具有与由非导电或绝缘部分包围的接合焊盘接触的导电部分。 与接合焊盘接触的导电部分通过存在非导电或绝缘部分在随后的回流工艺期间被充分地限制于加宽。 与接合焊盘的接触足够小，以允许迹线基本上直接通过接合焊盘附近通过另一接合焊盘。 不导电部分还防止随后施加的密封剂与接合焊盘接触并污染接合焊盘。 插入器的升高的表面，即距离接合焊盘最远的插入件的表面支撑焊球，并且足够宽以支撑焊球，而不允许焊球与迹线接触。 焊锡球和基板下表面上的走线路由处于不同的平面，从而允许简化的迹线路由，但是保持并均匀地提高了结构的刚度和焊球的共面性。

公开(公告)号：US5936843A

公开(公告)日：1999-08-10

申请号：US40393

申请日：1998-03-18

Applicant: Osamu Ohshima ,  Yoshiaki Udagawa ,  Masahiro Suzuki ,  Takeshi Nishiyama

Inventor： Osamu Ohshima ,  Yoshiaki Udagawa ,  Masahiro Suzuki ,  Takeshi Nishiyama

IPC: H01L23/12 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/141 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15322 ,  H05K2201/049 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10704 ,  H05K2203/1572 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218

Abstract: A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.

Abstract translation: 提供了一种用于将电路元件安装在印刷电路板上的方法和装置，其中具有第一间隔间距的端子的集成电路安装在终端密度转换板的第一表面上，该终端密度转换板将集成电路的第一interterminal pitch转换为 在终端密度转换板的第二表面上具有大于第一interterminal间距的第二interterminal间距的端子; 并且具有第二交间距的端子密度转换板的第二表面上的端子安装在印刷线路板上。

公开(公告)号：US5690270A

公开(公告)日：1997-11-25

申请号：US745782

申请日：1996-11-08

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin. The pin is sized for loosely fitting within the feedthrough and thus movement caused by a coefficient of thermal expansion mismatch between materials of the pad, pin, and printed circuit board is absorbed by movement of the pin within the feedthrough. As a result, stress relief is provided for the solder joints.

Abstract translation: 用于将表面贴装封装安装到印刷电路板上的装置和方法包括将引脚插入穿过印刷电路板馈通以提供销在馈通内的运动。 引脚的一端焊接到印刷电路板底部的导电表面，而引脚ID的另一端焊接到表面贴装封装焊盘。 封装以与印刷电路板顶表面间隔的关系安装。 使用高温焊料将引脚焊接到板导电表面，用于形成焊接接头，在使用诸如铅锡焊料类型的低温焊料的后续焊接期间保持固体。 然后使用低温铅锡焊料将引脚焊接到表面贴装封装的焊盘，以在焊盘和引脚之间形成焊接接头。 该销的尺寸适于松动地配合在馈通内，并且因此由焊盘，销和印刷电路板的材料之间的热膨胀失配系数引起的移动被引脚内的引脚的移动所吸收。 因此，为焊点提供了应力消除。

公开(公告)号：US5572175A

公开(公告)日：1996-11-05

申请号：US509332

申请日：1995-07-31

Applicant: Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

Inventor： Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

IPC: H01P1/205 ,  H01P1/213 ,  H01P5/08 ,  H01P7/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01P1/202

CPC classification number: H05K1/0243 ,  H01P1/2056 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/368

Abstract: A dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting a signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Abstract translation: 电介质谐振元件包括至少一个电介质多级谐振器，其包括一个介质块，形成在一个介质块中的多个内导体形成孔，形成在每个内导体形成孔的内表面上的内导体， 导电体覆盖一个介质块的基本上整个的外表面，电介质多级谐振器在该介电块中构成多个介质谐振器; 以及固定地安装在电介质多级谐振器上的安装基板，用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号，当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极，并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

公开(公告)号：US5564932A

公开(公告)日：1996-10-15

申请号：US339903

申请日：1994-11-14

Applicant: Mark-Andrew B. Castleman

Inventor： Mark-Andrew B. Castleman

IPC: H01R12/04 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K7/02 ,  H01R9/09

CPC classification number: H05K7/023 ,  H05K1/141 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09954 ,  H05K2201/10386 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K3/3426 ,  H05K3/368

Abstract: A customizeable interconnect device is provided for coupling a base component to a stacked insert component. The interconnect device is customizeable to provide connection between various types of components, regardless of whether the components are leaded or leadless, or whether the lead pitch is large or small. The interconnect device is fully customized by modifying a retainer, a base and/or a housing. Each part (i.e., base, retainer and housing) is coupled together as a modular assembly, wherein the base is customizeable to fit the lead arrangement of the base component, and the retainer is customizeable to fit the lead arrangement of a daughter board edge connector. One or more daughter boards are inserted into corresponding housing units in stacked, spaced arrangement over a base component to enhance interconnect density in a three-dimensional fashion.

Abstract translation: 提供了一种可定制的互连装置，用于将基部部件耦合到堆叠的插入部件。 互连装置是可定制的，以提供各种类型的部件之间的连接，而不管部件是引线还是无引线，或者导线间距是大还是小。 通过修改保持器，基座和/或壳体来完全定制互连装置。 每个部件（即，基座，保持器和壳体）作为模块化组件联接在一起，其中基座可定制以配合基座部件的引导装置，并且保持器是可定制的，以配合子板边缘连接器的引线装置 。 将一个或多个子板以堆叠的间隔布置插入到相应的壳体单元中，以在三维方式上增强互连密度。